TWI696232B - 內建偵知器之過濾器構造體及晶圓收容容器 - Google Patents
內建偵知器之過濾器構造體及晶圓收容容器 Download PDFInfo
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Abstract
提供一種可檢出晶圓收容室之清淨度,其中,可良好地保持晶圓收容容器之維修性之內建偵知器之過濾器構造體。
一種內建偵知器之過濾器構造體,在晶圓搬運容器中,被配置於自外部往晶圓收容室連接之流路,其特徵在於其具有:第1過濾器,去除包含在氣體中之塵埃;第2過濾器,被配置於比前述第1過濾器還要靠近前述晶圓收容室側,阻止做為液體之水通過,以使氣體通過;以及氣體檢出偵知器,被配置於前述第1過濾器與前述第2過濾器之間,檢出接觸之氣體之溫度、濕度、壓力、成分及氣體中的塵埃中之至少一者。
Description
本發明係關於一種在晶圓收容容器中,被配置於導入清淨化氣體往晶圓收容室,或者,自前述晶圓收容室排出氣體之流路之內建偵知器之過濾器構造體以及具有此之晶圓收容容器。
例如在半導體之製造工序中,係使用被稱做SMIF或FOUP之晶圓收容容器,實施各處理裝置間之晶圓搬運或晶圓保管。
在此,收容有晶圓之晶圓收容容器內之環境,係為了使晶圓表面不受氧化或污染,最好保持優於既定狀態之惰性狀態及清淨度。提高容器內的氣體之惰性狀態或清淨度之方法,提案有一種導入清淨化氣體到容器的內部或與容器相連通之空間之氣體吹掃等之技術。又,另外,使容器內之清淨度清淨化到既定狀態之技術,提案有一種連接配管到容器,使收容容器內的氣體在與外部的環境控制單元之間循環,控制晶圓收容容器內之水分濃度或氧氣濃度之技術(參照專利文獻1)。
[專利文獻]
[專利文獻1]日本特開2003-347397號公報
但是,導出收容容器內的氣體到外部以控制之先前方法,有只要不暫時導出收容容器內的氣體到外部,就無法檢出收容容器內之清淨度,而很難縮短檢出時間之課題。又,另外,在收容晶圓之晶圓收容室的內部,設置偵知器等之檢出機構之方法中,當洗淨晶圓收容室時,產生檢出機構浸水之問題,所以,容器之洗淨必須卸下檢出機構後再進行,而有維修性之課題。
本發明係鑑於這種實情所研發出者,可提供一種可檢出晶圓收容室之清淨度,其中,可良好地保持晶圓收容容器之維修性之內建偵知器之過濾器構造體以及具有該內建偵知器之過濾器構造體之晶圓收容容器。
為了達成上述目的,本發明之內建偵知器之過濾器構造體,係一種內建偵知器之過濾器構造體,在晶圓搬運容器中,被配置於連通到晶圓收容室之流路,其特徵在於:
其具有:
第1過濾器,去除包含在氣體中之塵埃;
第2過濾器,被配置於比前述第1過濾器還要靠近前述晶圓收容室側,阻止做為液體之水通過,以使氣體通過;以及
氣體檢出偵知器,被配置於前述第1過濾器與前述第2過濾器之間,檢出接觸之氣體之溫度、濕度、壓力、成分及氣體中的塵埃中之至少一者。
在本發明之內建偵知器之過濾器構造體中,係被包括在連接到晶圓收容室之流路,晶圓收容室側的第2過濾器係通過氣體,所以,內建之氣體檢出偵知器,可很容易檢出晶圓收容室的氣體。又,被配置於晶圓收容室側之第2過濾器,係阻止做為液體之水之通過,所以,例如當以水洗淨晶圓收容室時,也可防止氣體檢出偵知器浸水之情事。因此,這種內建偵知器之過濾器構造體,係對於晶圓收容容器之維修性之不良影響較少,即使在安裝偵知器後之狀態下,也可沖洗晶圓收容室。又,外部側的第1過濾器,係去除包含在氣體中之塵埃,所以,防止外部的塵埃流入晶圓收容室內,可防止晶圓收容室內的塵埃往外部流出之問題。
而且,第1過濾器最好粒子捕集率大於第2過濾器,第2過濾器最好耐水度大於第1過濾器。
又,例如前述第1過濾器與前述第2過濾器,係隔開既定間隔配置,
前述氣體檢出偵知器,也可以設於前述第1過濾器中之前述晶圓收容室側的面。
這種內建偵知器之過濾器構造體,係對於防止氣體檢出偵知器或第1過濾器接觸到水,非常適合。
又,例如前述第1過濾器與前述第2過濾器,係隔開既定間隔配置,
前述氣體檢出偵知器,係也可以設於前述第2過濾器中之前述晶圓收容室側的相反側的面。
這種內建偵知器之過濾器構造體,係對於防止第1過濾器接觸到水,非常適合,同時可使氣體檢出偵知器配置在更接近晶圓收容室之位置。
又,例如前述第1過濾器與前述第2過濾器,係也可以夾持前述氣體檢出偵知器以重疊。
藉這種構造,可使內建偵知器之過濾器構造體薄型化。
又,例如前述第2過濾器也可以係面積小於前述第1過濾器,被設於前述氣體檢出偵知器中之前述晶圓收容室側的面。
具有這種構造之內建偵知器之過濾器構造體,係第2過濾器之面積較小,所以,可減少配置有內建偵知器之過濾器構造體之流路之壓損。
又,例如本發明之晶圓收容容器係具有:
內建偵知器之過濾器構造體,上述任一所述者;
前述晶圓收容室;以及
吹掃端口,具有導入清淨化氣體往前述晶圓收容室,或者,使氣體自前述晶圓收容室排出之前述流路。
這種晶圓收容容器,係在吹掃端口的流路配置有內建偵知器之過濾器構造體,所以,可很容易檢出晶圓收容室的氣體,同時用於配置氣體檢出偵知器之空間,成為與吹掃端口的流路併用,有利於小型化。
又,例如設有前述內建偵知器之過濾器構造體之前述流路,也可以係自前述晶圓收容室排出氣體之吹掃端口的一部分。
在自晶圓收容室排出氣體之吹掃端口的流路,配置有內建偵知器之過濾器構造體,所以,這種晶圓收容容器係在吹掃中,也可非常適於檢出晶圓收容室之清淨度。
以下,依據圖面所示實施形態說明本發明。
圖1係表示包含本發明一實施形態內建偵知器之過濾器構造體50(以下,也稱做「過濾器構造體50」。)之做為晶圓收容容器之套箍20,被載置於加載端口裝置40後之狀態之示意圖。如下所述,過濾器構造體50係被配置於自外部的加載端口裝置40,連接到套箍20中之晶圓收容室21a之流路24a。而且,關於過濾器構造體50之詳細構造,以下使用圖5等做說明,所以,在圖1中,未表示過濾器構造體50之構造。
加載端口裝置40係構成用於自套箍20內取出晶圓10,而往未圖示之半導體處理裝置搬運之設備前端模塊(EFEM)60的一部分。加載端口裝置40係被設於形成於設備前端模塊60內之晶圓搬運室66的壁部64,發揮做為用於移動晶圓10往半導體處理室之介面的一部分之功能。設備前端模塊60的晶圓搬運室66內,係使用風扇過濾器單元等,維持為一定之清淨環境。又,在晶圓搬運室66,設有具有用於自套箍20取出晶圓10之機械臂之搬運機器人62等。
加載端口裝置40係具有設置套箍20之載置座46。在載置座46之Z軸方向之上部,密封晶圓10以收容及搬運之套箍(FOUP)20,係成為可裝卸自如地載置。又,載置座46係在載置有套箍20之狀態下移動,藉此,可使套箍20相對於晶圓搬運室66而言連接。而且,在圖面中,Y軸係表示載置座46之移動方向,Z軸係表示鉛直方向之上下方向,X軸係表示垂直於這些Y軸及Z軸之方向。
圖1所示之加載端口裝置40,係具有用於打開套箍20的蓋部23之門體47。加載端口裝置40係當套箍20被載置於載置座46時,首先,藉移動載置座46,移動套箍20至套箍20的一部分卡合到壁部64的開口之位置。之後,加載端口裝置40係使用門體47,以開放套箍20的蓋部23。藉此,加載端口裝置40係可使在套箍20中收容晶圓10之晶圓收容室21a與晶圓搬運室66,透過框體部22的主開口22a以氣密連結。
又,圖1所示之加載端口裝置40,也發揮清淨化做為晶圓收容容器之套箍20內之晶圓收容容器內清淨化裝置之功能。加載端口裝置40係具有:前吹掃噴嘴41,自套箍20的主開口22a進行清淨化;以及底吹掃噴嘴42,自套箍20的做為吹掃端口之底部導出端口24及底部導入端口25進行清淨化。前吹掃噴嘴41係被配置於連結在晶圓搬運室66之主開口22a附近。前吹掃噴嘴41係往套箍20的主開口22a,釋出清淨化氣體,導入清淨化氣體到套箍20內。而且,清淨化套箍20內之清淨化氣體,雖然未特別侷限,但是,最好使用氮氣等之惰性氣體或乾燥空氣等,氮氣尤佳。
底吹掃噴嘴42係自載置座46突出,連結在被設於套箍20底部之底部導出端口24或底部導入端口25。在圖1中雖然簡略化地表示,但是,底吹掃噴嘴42係具有:導入噴嘴,連結在套箍20的底部導入端口25(參照圖2);以及排出噴嘴,連結在套箍20的底部導出端口24(參照圖2)。底吹掃噴嘴42的導入噴嘴,係釋出清淨化氣體,透過套箍20的底部導入端口25,導入清淨化氣體到晶圓收容室21a內。又,導入噴嘴釋出清淨化氣體之同時,底吹掃噴嘴42的排出噴嘴,係透過套箍20的底部導出端口24,可排出晶圓收容室21a的氣體。藉此,具有底吹掃噴嘴42之加載端口裝置40,係可高效地清淨化晶圓收容室21a的環境氣體。
由前吹掃噴嘴41及底吹掃噴嘴42所做之清淨化氣體之導入,係被加載端口裝置40的控制部43所控制。控制部43係開閉被設於供給清淨化氣體到例如前吹掃噴嘴41及底吹掃噴嘴42之配管部之電磁閥,藉此,控制清淨化氣體往套箍20內之導入。又,控制部43也可以係使用底吹掃噴嘴42的排出噴嘴,調整來自套箍20之氣體之排出流量,藉此,控制清淨化氣體往套箍20內之導入。而且,由底吹掃噴嘴42所做之套箍20內之氣體之排出,也可以係強制排氣或自然排氣。
如下所述,在套箍20設有檢出機構30,加載端口裝置40係具有與套箍20的檢出機構30通訊之收訊部44。收訊部44係接收套箍20內之環境氣體之檢出結果等之資訊。收訊部44係具有數據機等,至少可與被設於載置在載置座46之套箍20之檢出機構30的發訊部32(參照圖6)通訊。又,收訊部44係對於檢出機構30的發訊部32,可發訊包含控制訊號之各種訊號。
在圖1中,加載端口裝置40的被載置於載置座46之套箍20,係用於在半導體工場內等,收容保管晶圓10,或者,在半導體工場內的裝置間搬運晶圓10之收容容器。套箍20係具備具有箱型(略成立方體)外形之晶圓收容部21,在晶圓收容部21的內部,形成有用於收納晶圓10在內部之晶圓收容室21a。
如圖1所示,晶圓收容部21係具有框體部22、及相對於框體部22而言裝卸自如之蓋部23。如做為卸下蓋部23後之狀態之套箍20之立體圖之圖2所示,在框體部22的側面,形成有用於自晶圓收容室21a搬出晶圓10,又,搬入晶圓10到晶圓收容室21a之主開口22a。在框體部22的內部,係配置有用於使被保持成水平之複數晶圓10,於鉛直方向重疊之架子(省略圖示),被載置於此之晶圓10,係使其間隔為一定,被收容在套箍20的內部。
如圖1所示,蓋部23係裝卸自如地被設於框體部22的主開口22a。加載端口裝置40係相對於蓋部23而言卡合門體47,使與蓋部23相卡合之門體47移動到晶圓搬運室66內,藉此,可打開框體部22的主開口22a。
如圖2所示,框體部22係具有做為晶圓收容部21的底壁之收容部底壁22b。收容部底壁22b係與晶圓收容部21的側壁及頂壁一體成形。當框體部22的主開口22a被蓋部23閉鎖時,收容晶圓10之晶圓收容室21a,係被晶圓收容部21的收容部底壁22b、側壁、頂壁及蓋部23包圍周邊,成為密閉空間。
如圖2所示,在收容部底壁22b設有:底部導出端口24,做為兩個吹掃端口;以及底部導入端口25。在底部導出端口24與底部導入端口25的內部,形成有自外部連接晶圓收容室21a之流路24a。亦即,圖1所示之底吹掃噴嘴42的導入噴嘴係自下方連接到底部導入端口25,透過被形成於底部導入端口25內之流路,清淨化氣體被導入到晶圓收容室21a。
又,底吹掃噴嘴42的排出噴嘴係自下方連接到底部導出端口24,透過被形成於底部導出端口24內之流路24a,晶圓收容室21a的氣體係排出到套箍20的外部。
如圖2所示,套箍20係具有被設於收容部底壁22b下方之底板26。在底板26形成有複數貫穿孔,使得加載端口裝置40的底吹掃噴嘴42,可連接到套箍20的底部導出端口24及底部導入端口25。又,在底板26形成有使套箍20相對於載置座46而言定位之定位銷48所卡合之卡合部等。
圖3係針對被載置於載置座46之套箍20,使收容部底壁22b的局部以剖面表示之局部剖面圖。如圖3所示,套箍20係具有檢出晶圓收容室21a的氣體之狀態等之檢出機構30。如圖3所示,檢出機構30係具有:本體部31,被設於收容部底壁22b的下方;氣體檢出偵知器56(參照圖5),被配置於底部導出端口24的流路24a;以及配線部59,連接氣體檢出偵知器56與本體部31。而且,氣體檢出偵知器56與配線部59的一部分,也係後述之內建偵知器之過濾器構造體50的一部分。
如圖3所示,檢出機構30的本體部31,係關於做為Z軸方向之高度方向,被配置於收容部底壁22b與底板26之間,檢出機構30之厚度係與被形成於收容部底壁22b與底板26間之間隙相同,或者,比間隙還要薄。套箍20係利用為了收容被設於載置座46之定位銷48等,而產生之上下方向之間隙,以配置本體部31,藉此,可實現小型化。
圖6係表示檢出機構30之概略迴路構造之示意圖。如圖6所示,檢出機構30係具有:氣體檢出偵知器56,檢出接觸到偵知器之氣體,或者,偵知器周邊的氣體;數據處理部37,被輸入來自氣體檢出偵知器56之訊號;以及電源部33,供給電力到氣體檢出偵知器56及數據處理部37。數據處理部37與電源部33,係內建於圖3所示之本體部31。
圖4係圖3所示之底部導出端口24周邊之局部放大圖。在被形成於底部導出端口24內部之流路24a,配置有包含做為檢出機構30一部分之氣體檢出偵知器56之內建偵知器之過濾器構造體50。如圖4及做為底部導出端口24之剖面圖之圖5所示,底部導出端口24係具有在內部形成流路24a之上機身24b及下機身24e、過濾器加壓器24c及止回閥24d。
如圖4所示,底部導出端口24的上機身24b,係構成底部導出端口24的外框的上半部,被埋入形成於收容部底壁22b之貫穿孔。上機身24b係具有圓筒形狀,在上機身24b的上底部形成有複數孔或狹縫,使得氣體可移動在晶圓收容室21a與底部導出端口24的流路24a之間。
如圖4所示,底部導出端口24的下機身24e,係構成底部導出端口24的外框的下半部,其一部分係被配置於被形成於底板26(參照圖3)之貫穿孔。下機身24e係具有與上機身24b相對稱之圓筒形狀,在下機身24e的下底部形成有貫穿孔,使得透過底部導出端口24的流路24a,晶圓收容室21a的氣體被排出(參照圖5)。
如做為剖面圖之圖5所示,過濾器加壓器24c與止回閥24d,係被配置於由上機身24b與下機身24e所形成之空間內部。止回閥24d係被配置於下機身24e的貫穿孔之正上方,防止外部的氣體往流路24a及晶圓收容室21a回流。過濾器加壓器24c係被配置於止回閥24的正上方,止回閥24d係藉過濾器加壓器24c與下機身24e,在上下方向被夾持。在過濾器加壓器24c,形成有與圖4所示之上機身24b同樣之貫穿孔或狹縫,氣體係通過過濾器加壓器24c,可沿著流路24a流動。
如圖5所示,內建偵知器之過濾器構造體50,係被配置於自外部連接晶圓收容室21a之流路24a。過濾器構造體50係具有:第1過濾器53,去除被包含於氣體中之塵埃;第2過濾器54,被配置於比第1過濾器53還要靠近晶圓收容室21a側;以及氣體檢出偵知器56,被配置於第1過濾器53與第2過濾器54之間。
第1過濾器53最好粒子捕集率(粒子徑0.3μm)(JIS B9908:2011 形式1)大於第2過濾器54。第1過濾器53之粒子捕集率(粒子徑0.3μm),係可例如99.95~99.999%。第1過濾器53只要係通過氣體,而且,可阻止浮遊在半導體工場內之塵埃通過者即可,其並未特別侷限,但是,可採用例如準HEPA過濾器、HEPA過濾器、ULPA過濾器、其他之空氣過濾器等,最好採用HEPA過濾器。
第2過濾器54係與第1過濾器53同樣地可通過氣體,且阻止做為液體之水之通過。第2過濾器54最好耐水度(JIS L1092:2009)大於第1過濾器53,第2過濾器54之耐水度可係例如1~1000kpa。又,第2過濾器54係壓損小於第1過濾器53,但是,自防止氣體通過流路24a時,通氣阻力過度變高之觀點看來,其係很好。第2過濾器54可採用例如使用PTFE、PFA、ETFE其他氟系樹脂等之憎水性過濾器。
氣體檢出偵知器56係檢出接觸之氣體之溫度、濕度、壓力、成分及氣體中的塵埃中之至少一者。氣體檢出偵知器56可例舉溫度計、氧氣濃度計、水分(水蒸氣)濃度計、氮氣濃度計、差壓計、粒子計數器等。
如概示過濾器構造體50中之第1及第2過濾器53、54及氣體檢出偵知器56之構造之圖7(a)及圖5所示,在過濾器構造體50中,第1過濾器53與第2過濾器54,係夾持氣體檢出偵知器56,以在做為氣體通過方向之上下方向上重疊。又,如圖5所示,過濾器構造體50係被上機身24b的上底與過濾器加壓器24c,在上下方向上夾持,被固定於流路24a內。藉這種構造,上機身24b與過濾器加壓器24c可支撐過濾器構造體50全體,可使過濾器構造體50的支撐構造簡單化。
在過濾器構造體50係包含有連接到氣體檢出偵知器56,使氣體檢出偵知器56之檢出訊號傳遞到本體部31(參照圖3)之配線部59的一部分。配線部59的一邊之端部,係連接在氣體檢出偵知器56中之第1過濾器53側的面。配線部59係通過第1過濾器53與第2過濾器54之間,被往流路24a的外部拉出,而且,如圖4所示,被往底部導出端口24的外部拉出。而且,如圖3所示,配線部59的另一邊之端部係連接到本體部31。
而且,如圖6所示,本體部31係相對於氣體檢出偵知器56而言,透過配線部59,可供給電力到電源部33。配線部59可藉FPC或其他印刷電路板、或電線等構成,但是,其並未特別侷限。
如圖6所示,數據處理部37係具有發訊部32與通訊控制部36。由氣體檢出偵知器56所做之檢出結果,係做為來自氣體檢出偵知器56之輸出訊號,輸入到數據處理部37的發訊部32。發訊部32係使由氣體檢出偵知器56所做之檢出結果,無線發訊到加載端口裝置40的收訊部44(參照圖1)。
圖6所示之發訊部32,也可以係在由氣體檢出偵知器56所做之檢出結果之外,使表示檢出機構30中之蓄電部34之電壓成為大於既定值後之情事之資訊等,無線發訊往加載端口裝置40的收訊部44(參照圖1)。又,發訊部32係也可自加載端口裝置40的收訊部44,接收關於檢出機構30之控制訊號。發訊部32係以數據機或天線等所構成,但是,發訊部32之具體構造,並未特別侷限。
如圖6所示,電源部33係具有:蓄電部34,可充放電;以及接收部35,接收來自外部之能源供給,充電蓄電部34。蓄電部34係例示例如全固體電池、電氣雙層電容(EDLC)、鋰離子二次電池等,並未特別侷限,但是,電解質利用固體陶瓷材料之全固體電池,係自防止空間之污染,提高安全性之觀點等看來,非常良好。接收部35係例舉例如:發電元件,轉換電磁能源以外之能源為電能以發電;以及電源接收元件,自外部接收電磁能源。發電元件係例舉太陽電池、振動發電元件等,電源接收元件係例示非接觸充電用之電源接收線圈等。本實施形態之接收部35,係具有對應具有圖1所示供電部45之供電線圈之非接觸充電之電源接收線圈。圖6所示之接收部35,可自被設於圖1所示加載端口裝置40中之載置座46的表面之供電部45,接收由電磁感應所做之電力供給。
圖6所示數據處理部37中之通訊控制部36,係控制自電源部33往發訊部32及氣體檢出偵知器56之電力之供給。例如通訊控制部36係在發訊部32不進行通訊之非通訊期間中,可切斷自電源部33往發訊部32之電力供給。藉此,因為使發訊部32為待機狀態(睡眠狀態),可減少消耗電力,可有效利用電源部33之電力。
又,通訊控制部36係可控制發訊部32,使得當蓄電部34之電壓大於既定值時,使該資訊往加載端口裝置40的收訊部44無線發訊。藉這種構造,在與套箍20一同被搬運時,即使檢出機構30中之蓄電部34之電壓小於既定值後,也透過加載端口裝置40之供電部45進行充電,藉此,當蓄電部34之電壓回復到超過既定值後,檢出機構30成為可動作。
數據處理部37的通訊控制部36,係不僅控制自電源部33供給電力往發訊部32,也控制自電源部33往氣體檢出偵知器56之電力供給,或者,發訊部32或氣體檢出偵知器56之動作。通訊控制部36係以例如微處理器等構成,但是,通訊控制部36之具體構造,並未特別侷限。
圖1所示加載端口裝置40的收訊部44、及包括在檢出機構30之發訊部32(參照圖6),係無線通訊由氣體檢出偵知器56所做之檢出結果或其他控制資訊等。收訊部44與發訊部32間之通訊所使用之無線頻率,並未特別侷限,但是,可為如WiFi及藍芽(註冊商標)之2.4GHz帶,也可以為比2.4GHz帶之通訊距離更長之sub-GHz(920MHz帶)。又,關於此無線頻率,最好使用以IrDA規格等而被規格化之紅外線通訊。因為紅外線通訊係傳送速度比其他方式還要差,其可通訊範圍被侷限,所以,與必須在工場內使用之其他頻率帶中之無線通訊之干涉等所造成之影響較少,又,可防止對於這種其他無線通訊,施加由干涉等所致之影響。
由氣體檢出偵知器56所做之檢出結果,例如可用於判斷是否進行由加載端口裝置40所做之晶圓收容室21a之清淨化處理,或者,晶圓10之品質管理,但是,檢出結果之使用方法並未特別侷限。
如上所述,被配置於底部導出端口24的流路24a之內建有偵知器之過濾器構造體50(參照圖5等),係在做為防水通氣過濾器之第2過濾器54,與做為防塵過濾器之第1過濾器53之兩個過濾器間,配置有氣體檢出偵知器56。藉此,過濾器構造體50係接觸晶圓收容室21a的氣體到氣體檢出偵知器56,可進行晶圓收容室21a的氣體之檢出,同時第2過濾器54阻止來自晶圓收容室21a之水之侵入,藉此,當使用水等液體洗淨晶圓收容室21a時,也可防止氣體檢出偵知器56被水等液體濡濕之情事。
又,檢出機構30的本體部31,係透過配線部59,被配置於底部導出端口24的流路24a的外部,所以,在套箍20中,於洗淨晶圓收容室21a時,也防止本體部31被水濡濕。因此,在套箍20中,在洗淨晶圓收容室21a時,無須卸下內建偵知器之過濾器構造體50及檢出機構30,內建偵知器之過濾器構造體50,係可良好地保持套箍20之維修性。
又,內建偵知器之過濾器構造體50係具有第1過濾器53,所以,可防止晶圓收容室21a的塵埃流出到外部之問題,也可防止來自外部之塵埃係透過流路24a,流入晶圓收容室21a之問題。又,設有過濾器構造體50之流路24a,係自晶圓收容室21a排出氣體之底部導出端口24的一部分,所以,在這種套箍20中,無須另外設置用於檢出氣體之流路,在小型化之觀點看來,其很有利,同時在清淨化晶圓收容室21a之吹掃中,也非常適合檢出晶圓收容室21a的氣體。
而且,過濾器構造體50也可配置於導入清淨化氣體往晶圓收容室21a之底部導入端口25的流路。即使這種構造,除了自底部導入端口25,導入清淨化氣體往晶圓收容室21a時之外,也可很適合於檢出晶圓收容室21a的氣體。
以上,雖然表示實施形態以說明本發明,但是,本發明並不僅侷限於上述實施形態,當然係存在有很多其他之實施形態或變形例等。例如搬運晶圓10之晶圓收容容器係不侷限於套箍20,在用於搬運晶圓10之前開箱包裝箱(FOSB)等之其他容器,也可設置過濾器構造體50。又,在被收容於晶圓收容容器之晶圓,並不只是所謂使用於半導體製造之矽晶圓,也包含其他之半導體基板、如被使用於液晶面板製造之玻璃基板之半導體基板以外之薄板狀材料。
圖7(b)係表示本發明第1變形例之內建偵知器之過濾器構造體150之示意剖面圖。在圖1所示之套箍20的流路24a,也可以取代圖7(a)所示之過濾器構造體50,配置圖7(b)所示之過濾器構造體150。過濾器構造體150係與過濾器構造體50同樣地,具有:第1過濾器53;第2過濾器54,被配置於比第1過濾器53還要靠近晶圓收容室21a側;以及氣體檢出偵知器56。
但是,在過濾器構造體150中,第1過濾器53與第2過濾器54,係夾著隔板158以隔開既定間隔地配置,氣體檢出偵知器56係被設於第1過濾器53中之晶圓收容室21a側的面。過濾器構造體150係第1過濾器53與第2過濾器54,隔開既定間隔配置,所以,其與圖7(a)所示之過濾器構造體50相比較下,第1過濾器53係成為不太會被來自晶圓收容室21a側之水所濡濕之構造。
又,圖7(b)所示之過濾器構造體150,係來自晶圓收容室21a側之水很難進入,所以,可使第2過濾器54較薄,可使過濾器構造體150全體之壓損較小。又,關於氣體檢出偵知器56,也係自第2過濾器54隔開間隔配置,藉此,成為不太會被來自晶圓收容室21a側之水所濡濕之構造。此外,內建偵知器之過濾器構造體150,係發揮與圖7(a)所示之過濾器構造體50同樣之效果。
圖7(c)係表示本發明第2變形例之內建偵知器之過濾器構造體250之示意剖面圖。過濾器構造體250係除了氣體檢出偵知器56被設於第2過濾器54中之晶圓收容室21a側的相反側的面之點外,其與第1變形例之過濾器構造體150相同。在過濾器構造體250中,其與圖7(b)所示之過濾器構造體150相比較下,可使氣體檢出偵知器56接近晶圓收容室21a配置。此外,過濾器構造體250係發揮與過濾器構造體50,150同樣之效果。
圖7(d)係表示本發明第3變形例之內建偵知器之過濾器構造體350之示意剖面圖。過濾器構造體350係除了第2過濾器354係面積小於第1過濾器53,被設於氣體檢出偵知器56中之晶圓收容室21a側的面之點外,其與實施形態之過濾器構造體50相同。在過濾器構造體350中,其與圖7(a)所示之過濾器構造體50相比較下,可使第2過濾器54之面積較小,所以,可使過濾器構造體350全體之壓損較小。此外,過濾器構造體350係發揮與過濾器構造體50同樣之效果。
10‧‧‧晶圓
20‧‧‧套箍
21‧‧‧晶圓收容部
21a‧‧‧晶圓收容室
22‧‧‧框體部
22a‧‧‧主開口
22b‧‧‧收容部底壁
23‧‧‧蓋部
24‧‧‧底部導出端口
24a‧‧‧流路
24b‧‧‧上機身
24c‧‧‧過濾器加壓器
24d‧‧‧止回閥
24e‧‧‧下機身
25‧‧‧底部導入端口
26‧‧‧底板
30‧‧‧檢出機構
31‧‧‧本體部
32‧‧‧發訊部
33‧‧‧電源部
34‧‧‧蓄電部
35‧‧‧接收部
36‧‧‧通訊控制部
37‧‧‧數據處理部
50‧‧‧內建偵知器之過濾器構造體(過濾器構造體)
53‧‧‧第1過濾器
54,354‧‧‧第2過濾器
56‧‧‧氣體檢出偵知器
59‧‧‧配線部
40‧‧‧加載端口裝置
41‧‧‧前吹掃噴嘴
42‧‧‧底吹掃噴嘴
43‧‧‧控制部
44‧‧‧收訊部
45‧‧‧供電部
46‧‧‧載置座
47‧‧‧門體
48‧‧‧定位銷
60‧‧‧設備前端模塊(EFEM)
62‧‧‧搬運機器人
64‧‧‧壁部
66‧‧‧晶圓搬運室
〔圖1]圖1係表示包含本發明一實施形態內建偵知器之過濾器構造體之晶圓收容容器,被載置於加載端口裝置後之狀態之示意圖。
〔圖2〕圖2係表示圖1所示晶圓收容容器的晶圓收容室之外觀圖。
〔圖3〕圖3係表示被包含於圖1所示晶圓收容容器之檢出機構之局部剖面圖。
〔圖4〕圖4係被包含於圖1所示晶圓收容容器之吹掃端口之局部放大圖。
〔圖5〕圖5係圖4所示吹掃端口及被配置於吹掃端口的內部之內建偵知器之過濾器構造體之剖面圖。
〔圖6〕圖6係表示圖3及圖4所示檢出機構之概略迴路構造之示意圖。
〔圖7〕圖7係表示實施形態及變形例之內建偵知器之過濾器構造體之示意剖面圖。
24‧‧‧底部導出端口
24a‧‧‧流路
24b‧‧‧上機身
24c‧‧‧過濾器加壓器
24d‧‧‧止回閥
24e‧‧‧下機身
50‧‧‧內建偵知器之過濾器構造體(過濾器構造體)
53‧‧‧第1過濾器
54‧‧‧第2過濾器
56‧‧‧氣體檢出偵知器
59‧‧‧配線部
Claims (13)
- 一種內建偵知器之過濾器構造體,被配置在晶圓搬運容器中,其特徵在於: 其具有: 第1過濾器; 第2過濾器,被配置於比前述第1過濾器還要靠近晶圓收容室側;以及 氣體檢出偵知器,被配置於前述第1過濾器與前述第2過濾器之間,檢出接觸之氣體的狀態。
- 如申請專利範圍第1項所述之內建偵知器之過濾器構造體,其中,前述第1過濾器係,去除被包含於氣體中之塵埃。
- 如申請專利範圍第2項所述之內建偵知器之過濾器構造體,其中,前述第1過濾器係,粒子捕集率大於前述第2過濾器。
- 如申請專利範圍第1項所述之內建偵知器之過濾器構造體,其中,前述第2過濾器係,阻止液體通過,使氣體通過。
- 如申請專利範圍第4項所述之內建偵知器之過濾器構造體,其中,前述第2過濾器係,耐水度大於前述第1過濾器。
- 如申請專利範圍第1項所述之內建偵知器之過濾器構造體,其中,前述氣體檢出偵知器所檢出之接觸之氣體的狀態係,溫度、濕度、壓力、成分及氣體中的塵埃中之至少一者。
- 如申請專利範圍第1項所述之內建偵知器之過濾器構造體,其中,前述內建偵知器之過濾器構造體係,被配置於自外部往前述晶圓收容室連接之流路。
- 如申請專利範圍第7項所述之內建偵知器之過濾器構造體,其中,前述第1過濾器與前述第2過濾器,係被隔開既定間隔配置, 前述氣體檢出偵知器係被設於前述第1過濾器中之前述晶圓收容室側的面。
- 如申請專利範圍第7項所述之內建偵知器之過濾器構造體,其中,前述第1過濾器與前述第2過濾器,係被隔開既定間隔配置, 前述氣體檢出偵知器,係被設於前述第2過濾器中之前述晶圓收容室側的相反側的面。
- 如申請專利範圍第1項所述之內建偵知器之過濾器構造體,其中,前述第1過濾器與前述第2過濾器,係夾持前述氣體檢出偵知器以重疊。
- 如申請專利範圍第7項所述之內建偵知器之過濾器構造體,其中,前述第2過濾器,係面積小於前述第1過濾器,被設於前述氣體檢出偵知器中之前述晶圓收容室側的面。
- 一種晶圓收容容器,其具有: 內建偵知器之過濾器構造體,如申請專利範圍第1項所述; 前述晶圓收容室;以及 吹掃端口,具有導入清淨化氣體往前述晶圓收容室,或者,自前述晶圓收容室排出氣體之前述流路。
- 如申請專利範圍第12項所述之晶圓收容容器,其中,設有前述內建偵知器之過濾器構造體之流路,係自前述晶圓收容室排出氣體之吹掃端口的一部分。
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