JP6450653B2 - 格納ユニット、搬送装置、及び、基板処理システム - Google Patents
格納ユニット、搬送装置、及び、基板処理システム Download PDFInfo
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- JP6450653B2 JP6450653B2 JP2015126402A JP2015126402A JP6450653B2 JP 6450653 B2 JP6450653 B2 JP 6450653B2 JP 2015126402 A JP2015126402 A JP 2015126402A JP 2015126402 A JP2015126402 A JP 2015126402A JP 6450653 B2 JP6450653 B2 JP 6450653B2
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- 238000003860 storage Methods 0.000 title claims description 66
- 239000000758 substrate Substances 0.000 title claims description 66
- 238000000034 method Methods 0.000 claims description 22
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 66
- 235000012431 wafers Nutrition 0.000 description 38
- 101000581272 Homo sapiens Midasin Proteins 0.000 description 7
- 102100027666 Midasin Human genes 0.000 description 7
- 239000007795 chemical reaction product Substances 0.000 description 6
- 238000005192 partition Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- 230000006837 decompression Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
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- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
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- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
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- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
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- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Description
Claims (7)
- 清浄化のために基板を格納する格納ユニットであって、
前方において開口し、鉛直方向において多段に複数の基板を格納するための第1空間、及び、前記第1空間の後方の第2空間を提供する容器と、
前記第1空間と前記第2空間との間に設けられた整流板と、
前記第2空間に連通する排気ダクトと、
を備え、
前記整流板は、前記第1空間に面する有効領域を有し、該有効領域は、
前記整流板に直交する第1方向と前記鉛直方向とに直交する第2方向における前記第1空間の中央に面する第1領域と、
前記第2方向における前記第1領域の一方側又は両側で延在する第2領域と、
を含み、
前記第1領域には、該第1領域にわたって分布するように複数の貫通孔が形成されており、
前記第2領域は、前記第1領域のコンダクタンスよりも低いコンダクタンスを有する、
格納ユニット。 - 前記第2領域は、前記第1領域の前記一方側に設けられており、且つ、前記第1領域よりも、前記第2空間の側の前記排気ダクトの開口の近くに設けられている、
請求項1に記載の格納ユニット。 - 前記第2領域は、前記第2方向における前記第1領域の両側で延在しており、且つ、前記第2空間の側の前記排気ダクトの開口に対して、前記第2方向において対称に延在している、請求項1に記載の格納ユニット。
- 前記有効領域は、前記第2領域の上側において前記第2方向に延びる第3領域を含み、
前記第3領域には、該第3領域にわたって分布するように複数の貫通孔が形成されている、
請求項1〜3の何れか一項に記載の格納ユニット。 - 前記第1領域は、前記第1空間において多段に格納される複数の基板それぞれの中央に対面するように延在している、請求項1〜4の何れか一項に記載の格納ユニット。
- 搬送チャンバを提供するチャンバ本体と、
前記搬送チャンバに設けられた搬送ロボットと、
請求項1〜5の何れか一項に記載の格納ユニットであり、前記第1空間が前記搬送チャンバに連通するように前記チャンバ本体に接続された該格納ユニットと、
前記搬送チャンバ及び前記第1空間に向かう気体の流れを発生する送風機と、
を備える搬送装置。 - 請求項6に記載の搬送装置と、
予備減圧のためのチャンバを提供し、前記搬送装置の前記チャンバ本体に接続されたロードロックモジュールと、
減圧可能な搬送チャンバを提供し、該搬送チャンバ内に搬送ロボットを有し、前記ロードロックモジュールに接続されたトランスファモジュールと、
基板を処理するためのプロセスモジュールであり、前記トランスファモジュールに接続された該プロセスモジュールと、
を備える基板処理システム。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015126402A JP6450653B2 (ja) | 2015-06-24 | 2015-06-24 | 格納ユニット、搬送装置、及び、基板処理システム |
US15/187,989 US10777437B2 (en) | 2015-06-24 | 2016-06-21 | Storage unit, transfer apparatus, and substrate processing system |
KR1020160077616A KR102357510B1 (ko) | 2015-06-24 | 2016-06-21 | 격납 유닛, 반송 장치, 및 기판 처리 시스템 |
TW105119623A TWI702678B (zh) | 2015-06-24 | 2016-06-22 | 收納單元、搬送裝置及基板處理系統 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015126402A JP6450653B2 (ja) | 2015-06-24 | 2015-06-24 | 格納ユニット、搬送装置、及び、基板処理システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017011150A JP2017011150A (ja) | 2017-01-12 |
JP6450653B2 true JP6450653B2 (ja) | 2019-01-09 |
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Application Number | Title | Priority Date | Filing Date |
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JP2015126402A Active JP6450653B2 (ja) | 2015-06-24 | 2015-06-24 | 格納ユニット、搬送装置、及び、基板処理システム |
Country Status (4)
Country | Link |
---|---|
US (1) | US10777437B2 (ja) |
JP (1) | JP6450653B2 (ja) |
KR (1) | KR102357510B1 (ja) |
TW (1) | TWI702678B (ja) |
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KR102162366B1 (ko) * | 2014-01-21 | 2020-10-06 | 우범제 | 퓸 제거 장치 |
KR102164544B1 (ko) * | 2014-01-22 | 2020-10-12 | 삼성전자 주식회사 | 가스 충진부를 구비하는 웨이퍼 스토리지 장치를 포함하는 반도체 제조 장치 |
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