JP2020113629A - 処理装置 - Google Patents
処理装置 Download PDFInfo
- Publication number
- JP2020113629A JP2020113629A JP2019002944A JP2019002944A JP2020113629A JP 2020113629 A JP2020113629 A JP 2020113629A JP 2019002944 A JP2019002944 A JP 2019002944A JP 2019002944 A JP2019002944 A JP 2019002944A JP 2020113629 A JP2020113629 A JP 2020113629A
- Authority
- JP
- Japan
- Prior art keywords
- processing
- pump units
- room
- unit
- process modules
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/16—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
- F24F3/167—Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F7/00—Ventilation
- F24F7/04—Ventilation with ducting systems, e.g. by double walls; with natural circulation
- F24F7/06—Ventilation with ducting systems, e.g. by double walls; with natural circulation with forced air circulation, e.g. by fan positioning of a ventilator in or against a conduit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Treating Waste Gases (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Photoreceptors In Electrophotography (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
Abstract
Description
第1の実施形態の処理装置について説明する。図1は、第1の実施形態の処理装置の構成例を示す斜視図である。図2は、図1の処理装置の側面図である。図3及び図4は、図1の処理装置の平面図であり、図3は第1の部屋に設置された処理部の平面図であり、図4は第1の部屋の階下の第2の部屋に設置された排気ユニットの平面図である。なお、図3における領域Mは、メンテナンスのための領域、キャリアCを搬入するための領域等である。また、図4における領域Mは、ポンプユニット61や接続配管631等のメンテナンスのための領域である。以下では、処理装置の左右方向をX方向、前後方向をY方向、高さ方向をZ方向として説明する。
第2の実施形態の処理装置について説明する。図6は、第2の実施形態の処理装置の構成例を示す斜視図である。図7は、図6の処理装置の側面図である。図8は、図6の処理装置の平面図であり、第1の部屋の階下の第2の部屋に設置された排気ユニットの平面図である。なお、図8における領域Mは、ポンプユニット61や接続配管631等のメンテナンスのための領域である。以下では、処理装置の左右方向をX方向、前後方向をY方向、高さ方向をZ方向として説明する。
10 処理部
20 ローダモジュール
30 処理モジュール
40 プロセスモジュール
60 排気部
61 ポンプユニット
62 排ガス処理装置
63 収納キャビネット
R1 第1の部屋
R2 第2の部屋
W ウエハ
Claims (10)
- 第1の部屋に連接配置された複数のプロセスモジュールと、前記第1の部屋に配置され、前記複数のプロセスモジュールで処理する基板を収納したキャリアを収容するローダモジュールと、を含む処理部と、
前記第1の部屋に隣接する第2の部屋に前記複数のプロセスモジュールの各々に対応して配置される複数のポンプユニットと、
を備え、
前記複数のポンプユニットの設置面積は、前記処理部の設置面積以下である、
処理装置。 - 前記第2の部屋は、前記第1の部屋の下方に位置する、
請求項1に記載の処理装置。 - 前記複数のポンプユニットは、前記複数のプロセスモジュールと同じ方向に並んで配置される、
請求項1又は2に記載の処理装置。 - 前記第2の部屋に前記複数のポンプユニットの各々に対応して配置される複数の排ガス処理装置を備え、
前記複数のポンプユニットと前記複数の排ガス処理装置の合計の設置面積は、前記処理部の設置面積以下である、
請求項1乃至3のいずれか一項に記載の処理装置。 - 前記第2の部屋における前記複数のポンプユニットの上方に配置され、対応する前記複数のプロセスモジュールと前記複数のポンプユニットとを接続する接続配管の一部を収納する収納キャビネットを備える、
請求項4に記載の処理装置。 - 前記収納キャビネットは、やぐら状に形成されており、
前記複数のポンプユニットは、前記収納キャビネットの内側空間に配置される、
請求項5に記載の処理装置。 - 前記収納キャビネットは、前記排ガス処理装置に固定される、
請求項5に記載の処理装置。 - 対応する前記複数のプロセスモジュールと前記複数のポンプユニットとを接続する前記接続配管の長さは同一である、
請求項5乃至7のいずれか一項に記載の処理装置。 - 前記複数のポンプユニットの少なくとも一部は、隣接して配置される、
請求項1乃至8のいずれか一項に記載の処理装置。 - 前記複数のポンプユニットの各々は、隣り合う前記ポンプユニットに対して間隔を有して配置される、
請求項1乃至8のいずれか一項に記載の処理装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019002944A JP7175201B2 (ja) | 2019-01-10 | 2019-01-10 | 処理装置 |
KR1020190175975A KR102562008B1 (ko) | 2019-01-10 | 2019-12-27 | 처리 장치 |
TW108148557A TWI824093B (zh) | 2019-01-10 | 2019-12-31 | 處理裝置(一) |
US16/736,241 US11581198B2 (en) | 2019-01-10 | 2020-01-07 | Processing apparatus |
CN202010027599.3A CN111430269A (zh) | 2019-01-10 | 2020-01-10 | 处理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019002944A JP7175201B2 (ja) | 2019-01-10 | 2019-01-10 | 処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020113629A true JP2020113629A (ja) | 2020-07-27 |
JP7175201B2 JP7175201B2 (ja) | 2022-11-18 |
Family
ID=71516785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019002944A Active JP7175201B2 (ja) | 2019-01-10 | 2019-01-10 | 処理装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11581198B2 (ja) |
JP (1) | JP7175201B2 (ja) |
KR (1) | KR102562008B1 (ja) |
CN (1) | CN111430269A (ja) |
TW (1) | TWI824093B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220133779A (ko) | 2021-03-25 | 2022-10-05 | 도쿄엘렉트론가부시키가이샤 | 배관 구조 및 처리 장치 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2610156A (en) * | 2021-04-29 | 2023-03-01 | Edwards Ltd | Semiconductor processing system |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1097962A (ja) * | 1996-09-19 | 1998-04-14 | Tokyo Electron Ltd | 処理装置及び処理システム |
JP2005150173A (ja) * | 2003-11-12 | 2005-06-09 | Hitachi High-Technologies Corp | 真空処理装置 |
WO2018003072A1 (ja) * | 2016-06-30 | 2018-01-04 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法および記録媒体 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5642978A (en) * | 1993-03-29 | 1997-07-01 | Jenoptik Gmbh | Device for handling disk-shaped objects in a handling plane of a local clean room |
JPH09320997A (ja) * | 1996-05-28 | 1997-12-12 | Ebara Corp | ポリッシング装置と洗浄装置の配管構造 |
JPH10116758A (ja) * | 1996-10-08 | 1998-05-06 | Hitachi Ltd | 半導体製造工場 |
GB9625916D0 (en) * | 1996-12-13 | 1997-01-29 | Gencoa Limited | Low friction coating |
JP3678563B2 (ja) * | 1997-11-19 | 2005-08-03 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JPH11204449A (ja) * | 1998-01-14 | 1999-07-30 | Tokyo Electron Ltd | 縦型熱処理装置 |
US6451272B1 (en) * | 1999-12-21 | 2002-09-17 | Ethicon, Inc. | Monitoring of sterilant apparatus and method for monitoring sterilant |
JP2004044089A (ja) * | 2002-07-08 | 2004-02-12 | Solar System Kk | 災害支援システム |
JP4133208B2 (ja) * | 2002-10-22 | 2008-08-13 | 東京エレクトロン株式会社 | 基板処理装置 |
JP4115331B2 (ja) * | 2003-05-09 | 2008-07-09 | 株式会社日立国際電気 | 基板処理装置 |
JP4000174B2 (ja) * | 2006-11-13 | 2007-10-31 | 東京エレクトロン株式会社 | 処理システム |
WO2011090717A1 (en) * | 2009-12-28 | 2011-07-28 | Gvd Corporation | Coating methods, systems, and related articles |
CN103155133A (zh) * | 2010-08-06 | 2013-06-12 | 东京毅力科创株式会社 | 基板处理系统、搬送模块、基板处理方法和半导体元件的制造方法 |
US9580834B2 (en) * | 2013-03-11 | 2017-02-28 | William Marsh Rice University | Growth methods for controlled large-area fabrication of high-quality graphene analogs |
US9527062B2 (en) * | 2013-05-09 | 2016-12-27 | North Carolina State University | Process for scalable synthesis of molybdenum disulfide monolayer and few-layer films |
US20150345010A1 (en) * | 2013-09-30 | 2015-12-03 | University Of Dayton | Methods of magnetically enhanced physical vapor deposition |
US20150118487A1 (en) * | 2013-10-25 | 2015-04-30 | Colin A. Wolden | Plasma-assisted nanofabrication of two-dimensional metal chalcogenide layers |
US20160093491A1 (en) * | 2014-09-29 | 2016-03-31 | University Of North Texas | LARGE SCALE AND THICKNESS-MODULATED MoS2 NANOSHEETS |
US9543144B2 (en) * | 2014-12-31 | 2017-01-10 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Vapor deposition of chalcogenide-containing films |
US9859115B2 (en) * | 2015-02-13 | 2018-01-02 | National Taiwan University | Semiconductor devices comprising 2D-materials and methods of manufacture thereof |
-
2019
- 2019-01-10 JP JP2019002944A patent/JP7175201B2/ja active Active
- 2019-12-27 KR KR1020190175975A patent/KR102562008B1/ko active IP Right Grant
- 2019-12-31 TW TW108148557A patent/TWI824093B/zh active
-
2020
- 2020-01-07 US US16/736,241 patent/US11581198B2/en active Active
- 2020-01-10 CN CN202010027599.3A patent/CN111430269A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1097962A (ja) * | 1996-09-19 | 1998-04-14 | Tokyo Electron Ltd | 処理装置及び処理システム |
JP2005150173A (ja) * | 2003-11-12 | 2005-06-09 | Hitachi High-Technologies Corp | 真空処理装置 |
WO2018003072A1 (ja) * | 2016-06-30 | 2018-01-04 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法および記録媒体 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220133779A (ko) | 2021-03-25 | 2022-10-05 | 도쿄엘렉트론가부시키가이샤 | 배관 구조 및 처리 장치 |
Also Published As
Publication number | Publication date |
---|---|
TWI824093B (zh) | 2023-12-01 |
KR102562008B1 (ko) | 2023-08-02 |
US11581198B2 (en) | 2023-02-14 |
US20200227287A1 (en) | 2020-07-16 |
KR20200087075A (ko) | 2020-07-20 |
CN111430269A (zh) | 2020-07-17 |
JP7175201B2 (ja) | 2022-11-18 |
TW202040630A (zh) | 2020-11-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI717034B (zh) | 側儲存倉、電子裝置處理系統、和處理基板的方法 | |
JP6347560B2 (ja) | 基板処理装置 | |
JP7105751B2 (ja) | 処理装置 | |
JP5806811B2 (ja) | 基板処理装置、基板処理方法および半導体装置の製造方法 | |
US9698037B2 (en) | Substrate processing apparatus | |
JP2019161116A (ja) | Efem | |
JP2009010009A (ja) | 基板処理装置及び半導体装置の製造方法 | |
TWI830825B (zh) | 晶圓儲存器 | |
TW202300427A (zh) | 側面儲存盒、設備前端模組、及用於操作efem的方法 | |
KR20210066937A (ko) | 측면 저장 포드들, 장비 전단부 모듈들, 및 이를 동작시키기 위한 방법들 | |
KR102562008B1 (ko) | 처리 장치 | |
KR100905262B1 (ko) | 기판 처리 장치 및 반도체 장치의 제조 방법 | |
JP5923197B2 (ja) | 基板処理装置および半導体装置の製造方法 | |
KR102198732B1 (ko) | 기판 처리 장치, 반도체 장치의 제조 방법 및 기록매체 | |
JP2011044633A (ja) | 基板処理装置 | |
CN111430268B (zh) | 处理装置 | |
JP2004119627A (ja) | 半導体製造装置 | |
KR20200108467A (ko) | 처리 장치, 배기 시스템, 반도체 장치의 제조 방법 | |
CN221632512U (zh) | 立式反应炉装置 | |
JP2004023032A (ja) | 半導体製造装置 | |
JP2006134901A (ja) | 基板処理装置 | |
CN117198931A (zh) | 一种立式反应炉装置 | |
JP2020150150A (ja) | 基板処理装置、半導体装置の製造方法及びプログラム | |
JP2007258255A (ja) | 基板処理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210614 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20220519 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220607 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220712 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20221011 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20221108 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7175201 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |