TWI695424B - 磨削裝置 - Google Patents
磨削裝置 Download PDFInfo
- Publication number
- TWI695424B TWI695424B TW105143901A TW105143901A TWI695424B TW I695424 B TWI695424 B TW I695424B TW 105143901 A TW105143901 A TW 105143901A TW 105143901 A TW105143901 A TW 105143901A TW I695424 B TWI695424 B TW I695424B
- Authority
- TW
- Taiwan
- Prior art keywords
- grinding
- wafer
- holding
- holding surface
- crack
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 claims abstract description 26
- 238000001514 detection method Methods 0.000 claims abstract description 26
- 238000005406 washing Methods 0.000 claims description 27
- 239000004575 stone Substances 0.000 claims description 23
- 235000012431 wafers Nutrition 0.000 description 96
- 238000006073 displacement reaction Methods 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000005286 illumination Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02013—Grinding, lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning In General (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016-022554 | 2016-02-09 | ||
JP2016022554A JP6622610B2 (ja) | 2016-02-09 | 2016-02-09 | 研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201729277A TW201729277A (zh) | 2017-08-16 |
TWI695424B true TWI695424B (zh) | 2020-06-01 |
Family
ID=59543656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105143901A TWI695424B (zh) | 2016-02-09 | 2016-12-29 | 磨削裝置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6622610B2 (ja) |
KR (1) | KR102513203B1 (ja) |
CN (1) | CN107042433B (ja) |
TW (1) | TWI695424B (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6920141B2 (ja) * | 2017-09-05 | 2021-08-18 | 株式会社ディスコ | 研磨装置 |
CN108000324A (zh) * | 2017-12-15 | 2018-05-08 | 大连理工常州研究院有限公司 | 一种用于机械制造的双驱动打磨装置 |
KR102037747B1 (ko) * | 2018-01-08 | 2019-10-29 | 에스케이실트론 주식회사 | 웨이퍼 연마 장치 |
JP2019169608A (ja) * | 2018-03-23 | 2019-10-03 | 株式会社ディスコ | 研削装置 |
SG11202008643PA (en) * | 2018-04-09 | 2020-10-29 | Tokyo Electron Ltd | Laser processing device, laser processing system, and laser processing method |
CN109015333A (zh) * | 2018-09-06 | 2018-12-18 | 国家电网有限公司 | 一种发电机碳刷弧面研磨装置 |
CN109434671A (zh) * | 2018-10-11 | 2019-03-08 | 德淮半导体有限公司 | 一种晶圆加工设备及加工方法 |
US11400563B2 (en) * | 2018-12-07 | 2022-08-02 | Disco Corporation | Processing method for disk-shaped workpiece |
JP7364338B2 (ja) * | 2019-01-22 | 2023-10-18 | 株式会社ディスコ | 保持面洗浄装置 |
JP2021074825A (ja) * | 2019-11-11 | 2021-05-20 | 株式会社ディスコ | 保持面洗浄装置 |
CN113770883A (zh) * | 2021-09-08 | 2021-12-10 | 国网福建省电力有限公司营销服务中心 | 电能表回收处理线及其工作方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013222712A (ja) * | 2012-04-12 | 2013-10-28 | Disco Abrasive Syst Ltd | 加工装置 |
JP2014075379A (ja) * | 2012-10-02 | 2014-04-24 | Nikon Corp | 異物除去方法、異物除去用の工具、並びに露光方法及び装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3708440A (en) | 1972-02-14 | 1973-01-02 | Upjohn Co | Reclaiming scrap polyisocyanurate foam with an aliphatic diol and a dialkanolamine |
JPH01171762A (ja) * | 1987-12-28 | 1989-07-06 | Shibayama Kikai Kk | 半導体のウエハ研削盤の吸着チャック洗浄装置 |
JPH01205950A (ja) * | 1988-02-12 | 1989-08-18 | Disco Abrasive Syst Ltd | ポーラスチャックテーブルの洗浄方法およびその装置 |
JP3155861B2 (ja) * | 1993-05-18 | 2001-04-16 | ローム株式会社 | 薄板状基板の移送装置 |
JP4079289B2 (ja) | 1998-02-18 | 2008-04-23 | 株式会社ディスコ | チャックテーブル洗浄装置 |
JP3504543B2 (ja) * | 1999-03-03 | 2004-03-08 | 株式会社日立製作所 | 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法 |
US6817057B2 (en) * | 2001-08-30 | 2004-11-16 | Micron Technology, Inc. | Spindle chuck cleaner |
US6910956B1 (en) * | 2003-12-22 | 2005-06-28 | Powerchip Semiconductor Corp. | Wafer grinding apparatus |
JP5164559B2 (ja) * | 2007-12-27 | 2013-03-21 | 株式会社ディスコ | 研削装置 |
JP5180661B2 (ja) * | 2008-04-18 | 2013-04-10 | 株式会社ディスコ | スピンナ洗浄装置および加工装置 |
JP2013122956A (ja) * | 2011-12-09 | 2013-06-20 | Disco Abrasive Syst Ltd | 加工装置 |
JP2014053510A (ja) * | 2012-09-07 | 2014-03-20 | Toshiba Corp | 端面加工方法及び端面加工装置 |
JP6109010B2 (ja) * | 2013-08-14 | 2017-04-05 | 株式会社ディスコ | 研削装置 |
JP2015079072A (ja) * | 2013-10-16 | 2015-04-23 | キヤノン株式会社 | 基板割れ処理システムを搭載した露光装置 |
-
2016
- 2016-02-09 JP JP2016022554A patent/JP6622610B2/ja active Active
- 2016-12-29 TW TW105143901A patent/TWI695424B/zh active
-
2017
- 2017-01-26 CN CN201710057507.4A patent/CN107042433B/zh active Active
- 2017-02-06 KR KR1020170016142A patent/KR102513203B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013222712A (ja) * | 2012-04-12 | 2013-10-28 | Disco Abrasive Syst Ltd | 加工装置 |
JP2014075379A (ja) * | 2012-10-02 | 2014-04-24 | Nikon Corp | 異物除去方法、異物除去用の工具、並びに露光方法及び装置 |
Also Published As
Publication number | Publication date |
---|---|
JP6622610B2 (ja) | 2019-12-18 |
CN107042433B (zh) | 2020-10-09 |
JP2017140663A (ja) | 2017-08-17 |
CN107042433A (zh) | 2017-08-15 |
TW201729277A (zh) | 2017-08-16 |
KR20170094497A (ko) | 2017-08-18 |
KR102513203B1 (ko) | 2023-03-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI695424B (zh) | 磨削裝置 | |
CN108115551B (zh) | 基片处理装置、基片处理方法和存储介质 | |
TWI393199B (zh) | 基板處理裝置 | |
JP5006053B2 (ja) | 基板処理装置 | |
JP6906859B2 (ja) | 加工装置 | |
TWI732933B (zh) | 加工裝置 | |
KR102499098B1 (ko) | 기판 처리 장치, 기판 처리 방법 및 기억 매체 | |
JP2008155292A (ja) | 基板の加工方法および加工装置 | |
JP2007214457A (ja) | ウェーハ加工装置及び方法 | |
US20200185241A1 (en) | Cutting apparatus and wafer processing method using cutting apparatus | |
US20150017745A1 (en) | Polishing method and polishing apparatus | |
US20190291239A1 (en) | Grinding apparatus | |
TW202042966A (zh) | 磨削裝置 | |
TWI744482B (zh) | 晶圓的起伏檢測方法及磨削裝置 | |
TW201834051A (zh) | 工件的檢查方法、工件的檢查裝置及加工裝置 | |
US11673229B2 (en) | Processing apparatus | |
TW202129746A (zh) | 切割裝置以及切割方法 | |
CN110692124A (zh) | 吸杂层形成装置、吸杂层形成方法以及计算机存储介质 | |
JP2023083014A (ja) | ウェーハの製造方法および研削装置 | |
JP2013222712A (ja) | 加工装置 | |
JP2010005717A (ja) | 加工装置 | |
JP7370265B2 (ja) | 加工方法及び加工装置 | |
JP2006035353A (ja) | Cmp装置、cmp研磨方法、及び、半導体装置の製造方法 | |
TW202329315A (zh) | 磨削裝置 | |
JP2024082035A (ja) | チャックテーブルの検査方法 |