TWI690979B - 基板處理裝置、基板處理裝置的洗淨方法 - Google Patents

基板處理裝置、基板處理裝置的洗淨方法 Download PDF

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Publication number
TWI690979B
TWI690979B TW107137195A TW107137195A TWI690979B TW I690979 B TWI690979 B TW I690979B TW 107137195 A TW107137195 A TW 107137195A TW 107137195 A TW107137195 A TW 107137195A TW I690979 B TWI690979 B TW I690979B
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TW
Taiwan
Prior art keywords
tank
liquid
treatment
processing
pipe
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TW107137195A
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English (en)
Chinese (zh)
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TW201923832A (zh
Inventor
杉岡真治
岸田拓也
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日商斯庫林集團股份有限公司
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Publication of TW201923832A publication Critical patent/TW201923832A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D35/00—Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
    • B01D35/02—Filters adapted for location in special places, e.g. pipe-lines, pumps, stop-cocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/048—Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
TW107137195A 2017-10-23 2018-10-22 基板處理裝置、基板處理裝置的洗淨方法 TWI690979B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017204671A JP7056852B2 (ja) 2017-10-23 2017-10-23 基板処理装置、基板処理装置の洗浄方法
JP2017-204671 2017-10-23

Publications (2)

Publication Number Publication Date
TW201923832A TW201923832A (zh) 2019-06-16
TWI690979B true TWI690979B (zh) 2020-04-11

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TW107137195A TWI690979B (zh) 2017-10-23 2018-10-22 基板處理裝置、基板處理裝置的洗淨方法

Country Status (5)

Country Link
JP (1) JP7056852B2 (ja)
KR (1) KR102382902B1 (ja)
CN (1) CN111316400A (ja)
TW (1) TWI690979B (ja)
WO (1) WO2019082661A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7181156B2 (ja) * 2019-05-31 2022-11-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理システム及び基板処理方法
CN112530790B (zh) * 2020-11-03 2022-01-11 长江存储科技有限责任公司 晶圆清洗装置和晶圆清洗方法
JP2022108144A (ja) * 2021-01-12 2022-07-25 株式会社ジャパンディスプレイ 浸漬処理装置
CN113053791B (zh) * 2021-04-23 2022-11-29 上海珩旭机电设备有限公司 氮气清洗装置
CN113714188A (zh) * 2021-09-15 2021-11-30 新阳硅密（上海）半导体技术有限公司 一种用于单片浸入式湿处理工艺的表面排气设备及方法
CN113787049A (zh) * 2021-09-15 2021-12-14 新阳硅密（上海）半导体技术有限公司 一种用于单片湿处理制程的槽式工艺方法
CN113600554B (zh) * 2021-10-09 2021-12-07 南通欧能达超声设备有限公司 一种超声波芯片清洗设备
CN115475797B (zh) * 2022-09-30 2024-04-05 肇庆绿宝石电子科技股份有限公司 一种叠层电容器及其制造方法、载条清洗液及制备方法
CN115921410A (zh) * 2022-12-14 2023-04-07 西安奕斯伟材料科技有限公司 清洗系统及方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201521106A (zh) * 2013-09-27 2015-06-01 Tokyo Electron Ltd 蝕刻方法、蝕刻裝置及記憶媒體

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3517134B2 (ja) 1998-12-03 2004-04-05 大日本スクリーン製造株式会社 基板処理装置
JP2002210422A (ja) 2001-01-16 2002-07-30 Sony Corp 被処理基板の洗浄処理装置と洗浄方法
JP5890198B2 (ja) 2011-03-25 2016-03-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理方法
JP2016063204A (ja) 2014-09-22 2016-04-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置の洗浄方法及び基板処理装置
JP6326387B2 (ja) 2015-03-19 2018-05-16 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201521106A (zh) * 2013-09-27 2015-06-01 Tokyo Electron Ltd 蝕刻方法、蝕刻裝置及記憶媒體

Also Published As

Publication number Publication date
KR20200060483A (ko) 2020-05-29
JP2019079881A (ja) 2019-05-23
WO2019082661A1 (ja) 2019-05-02
JP7056852B2 (ja) 2022-04-19
CN111316400A (zh) 2020-06-19
TW201923832A (zh) 2019-06-16
KR102382902B1 (ko) 2022-04-04

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