KR102382902B1 - 기판 처리 장치, 기판 처리 장치의 세정 방법 - Google Patents

기판 처리 장치, 기판 처리 장치의 세정 방법 Download PDF

Info

Publication number
KR102382902B1
KR102382902B1 KR1020207012429A KR20207012429A KR102382902B1 KR 102382902 B1 KR102382902 B1 KR 102382902B1 KR 1020207012429 A KR1020207012429 A KR 1020207012429A KR 20207012429 A KR20207012429 A KR 20207012429A KR 102382902 B1 KR102382902 B1 KR 102382902B1
Authority
KR
South Korea
Prior art keywords
tank
treatment
liquid
pipe
processing
Prior art date
Application number
KR1020207012429A
Other languages
English (en)
Korean (ko)
Other versions
KR20200060483A (ko
Inventor
신지 스기오카
다쿠야 기시다
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Publication of KR20200060483A publication Critical patent/KR20200060483A/ko
Application granted granted Critical
Publication of KR102382902B1 publication Critical patent/KR102382902B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D35/00—Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
    • B01D35/02—Filters adapted for location in special places, e.g. pipe-lines, pumps, stop-cocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/048—Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
KR1020207012429A 2017-10-23 2018-10-10 기판 처리 장치, 기판 처리 장치의 세정 방법 KR102382902B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-204671 2017-10-23
JP2017204671A JP7056852B2 (ja) 2017-10-23 2017-10-23 基板処理装置、基板処理装置の洗浄方法
PCT/JP2018/037802 WO2019082661A1 (ja) 2017-10-23 2018-10-10 基板処理装置、基板処理装置の洗浄方法

Publications (2)

Publication Number Publication Date
KR20200060483A KR20200060483A (ko) 2020-05-29
KR102382902B1 true KR102382902B1 (ko) 2022-04-04

Family

ID=66247386

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207012429A KR102382902B1 (ko) 2017-10-23 2018-10-10 기판 처리 장치, 기판 처리 장치의 세정 방법

Country Status (5)

Country Link
JP (1) JP7056852B2 (ja)
KR (1) KR102382902B1 (ja)
CN (1) CN111316400A (ja)
TW (1) TWI690979B (ja)
WO (1) WO2019082661A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7181156B2 (ja) * 2019-05-31 2022-11-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理システム及び基板処理方法
CN112530790B (zh) * 2020-11-03 2022-01-11 长江存储科技有限责任公司 晶圆清洗装置和晶圆清洗方法
JP2022108144A (ja) * 2021-01-12 2022-07-25 株式会社ジャパンディスプレイ 浸漬処理装置
CN113053791B (zh) * 2021-04-23 2022-11-29 上海珩旭机电设备有限公司 氮气清洗装置
CN113714188A (zh) * 2021-09-15 2021-11-30 新阳硅密（上海）半导体技术有限公司 一种用于单片浸入式湿处理工艺的表面排气设备及方法
CN113787049A (zh) * 2021-09-15 2021-12-14 新阳硅密（上海）半导体技术有限公司 一种用于单片湿处理制程的槽式工艺方法
CN113600554B (zh) * 2021-10-09 2021-12-07 南通欧能达超声设备有限公司 一种超声波芯片清洗设备
CN115475797B (zh) * 2022-09-30 2024-04-05 肇庆绿宝石电子科技股份有限公司 一种叠层电容器及其制造方法、载条清洗液及制备方法
CN115921410A (zh) * 2022-12-14 2023-04-07 西安奕斯伟材料科技有限公司 清洗系统及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000173972A (ja) 1998-12-03 2000-06-23 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2002210422A (ja) * 2001-01-16 2002-07-30 Sony Corp 被処理基板の洗浄処理装置と洗浄方法
KR101332976B1 (ko) 2011-03-25 2013-11-25 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 기판처리방법
JP2016063204A (ja) 2014-09-22 2016-04-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置の洗浄方法及び基板処理装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015070080A (ja) * 2013-09-27 2015-04-13 東京エレクトロン株式会社 エッチング方法、エッチング装置および記憶媒体
JP6326387B2 (ja) 2015-03-19 2018-05-16 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000173972A (ja) 1998-12-03 2000-06-23 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2002210422A (ja) * 2001-01-16 2002-07-30 Sony Corp 被処理基板の洗浄処理装置と洗浄方法
KR101332976B1 (ko) 2011-03-25 2013-11-25 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 기판처리방법
JP2016063204A (ja) 2014-09-22 2016-04-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置の洗浄方法及び基板処理装置

Also Published As

Publication number Publication date
TWI690979B (zh) 2020-04-11
KR20200060483A (ko) 2020-05-29
JP2019079881A (ja) 2019-05-23
WO2019082661A1 (ja) 2019-05-02
JP7056852B2 (ja) 2022-04-19
CN111316400A (zh) 2020-06-19
TW201923832A (zh) 2019-06-16

Similar Documents

Publication Publication Date Title
KR102382902B1 (ko) 기판 처리 장치, 기판 처리 장치의 세정 방법
JP4828948B2 (ja) 基板処理装置
TWI402902B (zh) 基板處理裝置及基板處理方法
JP2006066727A (ja) 半導体製造装置及び薬液交換方法
JP2010021215A (ja) 洗浄システム及び洗浄液循環方法
JP5977058B2 (ja) 処理液供給装置および処理液供給方法
JP6223906B2 (ja) 処理液交換方法および液処理装置
JP2002210422A (ja) 被処理基板の洗浄処理装置と洗浄方法
KR101915358B1 (ko) 반도체 세정장치 및 이에 적용된 세정 방법
JP3582680B2 (ja) 洗浄装置
KR100949096B1 (ko) 기판 세정 방법
JP2000183024A (ja) 基板処理装置
KR100794585B1 (ko) 습식 세정 장치 및 방법
CN107644822B (zh) 半导体干燥设备和半导体干燥用处理液体循环与过滤方法
JP3701811B2 (ja) 基板処理方法及び基板処理装置
KR100873939B1 (ko) 기판 세정유닛 및 상기 기판 세정유닛의 배기 처리 방법,그리고 이를 구비하는 기판 처리 장치
KR100664787B1 (ko) 세정조의 약액 배출시스템
WO2023282064A1 (ja) 基板処理システム、及び基板処理方法
JP2010225832A (ja) 基板処理装置および基板処理方法
JP4227694B2 (ja) ウエハーの表面処理装置
JP3648096B2 (ja) 処理装置
KR100567128B1 (ko) 웨이퍼 세정 설비 및 이를 이용한 금속 잔유물 제거방법
KR100632044B1 (ko) 웨이퍼의 세정장치 및 방법
JP2022151639A (ja) 基板処理装置、基板処理方法及びコンピュータ読み取り可能な記録媒体
JP6592316B2 (ja) 半導体基板処理装置、フォトレジストを剥離する方法、および半導体装置の製造方法

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant