TWI690404B - 樹脂成形品的製造裝置與製造方法、樹脂成形系統 - Google Patents

樹脂成形品的製造裝置與製造方法、樹脂成形系統 Download PDF

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Publication number
TWI690404B
TWI690404B TW107137653A TW107137653A TWI690404B TW I690404 B TWI690404 B TW I690404B TW 107137653 A TW107137653 A TW 107137653A TW 107137653 A TW107137653 A TW 107137653A TW I690404 B TWI690404 B TW I690404B
Authority
TW
Taiwan
Prior art keywords
resin molded
platen
molded product
mold
manufacturing
Prior art date
Application number
TW107137653A
Other languages
English (en)
Chinese (zh)
Other versions
TW201916998A (zh
Inventor
市橋秀男
下多祐輔
Original Assignee
日商Ｔｏｗａ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商Ｔｏｗａ股份有限公司 filed Critical 日商Ｔｏｗａ股份有限公司
Publication of TW201916998A publication Critical patent/TW201916998A/zh
Application granted granted Critical
Publication of TWI690404B publication Critical patent/TWI690404B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B29C45/66—Mould opening, closing or clamping devices mechanical
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
TW107137653A 2017-10-25 2018-10-25 樹脂成形品的製造裝置與製造方法、樹脂成形系統 TWI690404B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017206003A JP6560727B2 (ja) 2017-10-25 2017-10-25 樹脂成形品の製造装置、樹脂成形システム、および樹脂成形品の製造方法
JP2017-206003 2017-10-25

Publications (2)

Publication Number Publication Date
TW201916998A TW201916998A (zh) 2019-05-01
TWI690404B true TWI690404B (zh) 2020-04-11

Family

ID=66254717

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107137653A TWI690404B (zh) 2017-10-25 2018-10-25 樹脂成形品的製造裝置與製造方法、樹脂成形系統

Country Status (5)

Country Link
JP (1) JP6560727B2 (ja)
KR (1) KR102264543B1 (ja)
CN (1) CN109702943B (ja)
SG (1) SG10201808663YA (ja)
TW (1) TWI690404B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI825473B (zh) * 2020-10-20 2023-12-11 日商山田尖端科技股份有限公司 樹脂密封裝置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7341112B2 (ja) * 2020-10-06 2023-09-08 Ｔｏｗａ株式会社 樹脂成形品の製造方法
JP6900139B1 (ja) * 2020-12-22 2021-07-07 株式会社浅野研究所 熱成形装置および熱成形方法
JP7035243B1 (ja) * 2021-03-10 2022-03-14 Ｔｏｗａ株式会社 樹脂成形装置および樹脂成形品の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0631736A (ja) * 1992-07-14 1994-02-08 Apic Yamada Kk 成形装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236038U (ja) * 1988-09-02 1990-03-08
JPH0929747A (ja) * 1995-07-19 1997-02-04 Ricoh Co Ltd 金型断熱装置
JPH1174297A (ja) 1997-08-29 1999-03-16 Nec Corp 電子デバイス等の薄肉化樹脂封止方法及びその装置
JP4625488B2 (ja) * 2007-09-10 2011-02-02 三菱重工プラスチックテクノロジー株式会社 型盤、型締め装置、射出成形機
JP5215445B2 (ja) * 2011-10-17 2013-06-19 ファナック株式会社 温調配管付きアダプタプレートを備えた射出成形機
CN204011392U (zh) * 2014-07-01 2014-12-10 比亚迪股份有限公司 汽车、igbt模块及其底板组件
JP6440599B2 (ja) * 2015-08-28 2018-12-19 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0631736A (ja) * 1992-07-14 1994-02-08 Apic Yamada Kk 成形装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI825473B (zh) * 2020-10-20 2023-12-11 日商山田尖端科技股份有限公司 樹脂密封裝置

Also Published As

Publication number Publication date
JP2019077105A (ja) 2019-05-23
KR20190046660A (ko) 2019-05-07
JP6560727B2 (ja) 2019-08-14
SG10201808663YA (en) 2019-05-30
CN109702943B (zh) 2021-05-04
TW201916998A (zh) 2019-05-01
KR102264543B1 (ko) 2021-06-14
CN109702943A (zh) 2019-05-03

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