SG10201808663YA - Resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method - Google Patents

Resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method

Info

Publication number
SG10201808663YA
SG10201808663YA SG10201808663YA SG10201808663YA SG10201808663YA SG 10201808663Y A SG10201808663Y A SG 10201808663YA SG 10201808663Y A SG10201808663Y A SG 10201808663YA SG 10201808663Y A SG10201808663Y A SG 10201808663YA SG 10201808663Y A SG10201808663Y A SG 10201808663YA
Authority
SG
Singapore
Prior art keywords
molded product
resin molded
product manufacturing
platen
resin
Prior art date
Application number
SG10201808663YA
Other languages
English (en)
Inventor
Ichihashi Hideo
Shimoda Yusuke
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of SG10201808663YA publication Critical patent/SG10201808663YA/en

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
SG10201808663YA 2017-10-25 2018-10-02 Resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method SG10201808663YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017206003A JP6560727B2 (ja) 2017-10-25 2017-10-25 樹脂成形品の製造装置、樹脂成形システム、および樹脂成形品の製造方法

Publications (1)

Publication Number Publication Date
SG10201808663YA true SG10201808663YA (en) 2019-05-30

Family

ID=66254717

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201808663YA SG10201808663YA (en) 2017-10-25 2018-10-02 Resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method

Country Status (5)

Country Link
JP (1) JP6560727B2 (ja)
KR (1) KR102264543B1 (ja)
CN (1) CN109702943B (ja)
SG (1) SG10201808663YA (ja)
TW (1) TWI690404B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7341112B2 (ja) * 2020-10-06 2023-09-08 Ｔｏｗａ株式会社 樹脂成形品の製造方法
JP7445974B2 (ja) * 2020-10-20 2024-03-08 アピックヤマダ株式会社 樹脂封止装置
JP6900139B1 (ja) * 2020-12-22 2021-07-07 株式会社浅野研究所 熱成形装置および熱成形方法
JP7035243B1 (ja) * 2021-03-10 2022-03-14 Ｔｏｗａ株式会社 樹脂成形装置および樹脂成形品の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236038U (ja) * 1988-09-02 1990-03-08
JPH0631736A (ja) * 1992-07-14 1994-02-08 Apic Yamada Kk 成形装置
JPH0929747A (ja) * 1995-07-19 1997-02-04 Ricoh Co Ltd 金型断熱装置
JPH1174297A (ja) 1997-08-29 1999-03-16 Nec Corp 電子デバイス等の薄肉化樹脂封止方法及びその装置
JP4625488B2 (ja) * 2007-09-10 2011-02-02 三菱重工プラスチックテクノロジー株式会社 型盤、型締め装置、射出成形機
JP5215445B2 (ja) * 2011-10-17 2013-06-19 ファナック株式会社 温調配管付きアダプタプレートを備えた射出成形機
CN204011392U (zh) * 2014-07-01 2014-12-10 比亚迪股份有限公司 汽车、igbt模块及其底板组件
JP6440599B2 (ja) * 2015-08-28 2018-12-19 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法

Also Published As

Publication number Publication date
JP2019077105A (ja) 2019-05-23
KR20190046660A (ko) 2019-05-07
TWI690404B (zh) 2020-04-11
JP6560727B2 (ja) 2019-08-14
CN109702943B (zh) 2021-05-04
TW201916998A (zh) 2019-05-01
KR102264543B1 (ko) 2021-06-14
CN109702943A (zh) 2019-05-03

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