TWI687393B - 氮化硼凝集粒子、氮化硼凝集粒子之製造方法、含有該氮化硼凝集粒子之樹脂組成物、成形體及片材 - Google Patents

氮化硼凝集粒子、氮化硼凝集粒子之製造方法、含有該氮化硼凝集粒子之樹脂組成物、成形體及片材 Download PDF

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TWI687393B
TWI687393B TW104103996A TW104103996A TWI687393B TW I687393 B TWI687393 B TW I687393B TW 104103996 A TW104103996 A TW 104103996A TW 104103996 A TW104103996 A TW 104103996A TW I687393 B TWI687393 B TW I687393B
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particles
aggregated particles
boron nitride
agglomerated
sheet
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TW201536715A (zh
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池宮桂
山崎正典
鈴木拓也
武田一樹
澤村敏行
平松沙和
五十島健史
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日商三菱化學股份有限公司
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    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
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    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
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    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
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    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
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    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

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  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Paints Or Removers (AREA)
TW104103996A 2014-02-05 2015-02-05 氮化硼凝集粒子、氮化硼凝集粒子之製造方法、含有該氮化硼凝集粒子之樹脂組成物、成形體及片材 TWI687393B (zh)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2014-020423 2014-02-05
JP2014020423 2014-02-05
JP2014-020424 2014-02-05
JP2014020424 2014-02-05
JP2014207522 2014-10-08
JP2014-207522 2014-10-08
JP2014-259221 2014-12-22
JP2014259221 2014-12-22
JP2015-005428 2015-01-14
JP2015005428 2015-01-14
JP2015-005424 2015-01-14
JP2015005424 2015-01-14

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TW201536715A TW201536715A (zh) 2015-10-01
TWI687393B true TWI687393B (zh) 2020-03-11

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TW109103913A TWI757686B (zh) 2014-02-05 2015-02-05 氮化硼凝集粒子、氮化硼凝集粒子之製造方法、含有該氮化硼凝集粒子之樹脂組成物、成形體及片材

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US (2) US10106413B2 (https=)
EP (1) EP3103766A4 (https=)
JP (9) JP6493226B2 (https=)
KR (1) KR102400206B1 (https=)
CN (2) CN106029561B (https=)
MY (2) MY179291A (https=)
TW (2) TWI687393B (https=)
WO (1) WO2015119198A1 (https=)

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