TWI681694B - 各向異性導電薄膜、及其連接方法 - Google Patents

各向異性導電薄膜、及其連接方法 Download PDF

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Publication number
TWI681694B
TWI681694B TW105100817A TW105100817A TWI681694B TW I681694 B TWI681694 B TW I681694B TW 105100817 A TW105100817 A TW 105100817A TW 105100817 A TW105100817 A TW 105100817A TW I681694 B TWI681694 B TW I681694B
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TW
Taiwan
Prior art keywords
circuit element
conductive film
anisotropic conductive
terminal
layer
Prior art date
Application number
TW105100817A
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English (en)
Chinese (zh)
Other versions
TW201633863A (zh
Inventor
大關裕樹
Original Assignee
日商迪睿合股份有限公司
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Application filed by 日商迪睿合股份有限公司 filed Critical 日商迪睿合股份有限公司
Publication of TW201633863A publication Critical patent/TW201633863A/zh
Application granted granted Critical
Publication of TWI681694B publication Critical patent/TWI681694B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesive Tapes (AREA)
TW105100817A 2015-01-22 2016-01-12 各向異性導電薄膜、及其連接方法 TWI681694B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2015-010310 2015-01-22
JP2015010310A JP6474620B2 (ja) 2015-01-22 2015-01-22 異方性導電フィルム、及び接続方法

Publications (2)

Publication Number Publication Date
TW201633863A TW201633863A (zh) 2016-09-16
TWI681694B true TWI681694B (zh) 2020-01-01

Family

ID=56416899

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105100817A TWI681694B (zh) 2015-01-22 2016-01-12 各向異性導電薄膜、及其連接方法

Country Status (5)

Country Link
JP (1) JP6474620B2 (enExample)
KR (1) KR102006090B1 (enExample)
CN (1) CN107112658B (enExample)
TW (1) TWI681694B (enExample)
WO (1) WO2016117350A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6798165B2 (ja) 2016-07-06 2020-12-09 スズキ株式会社 車両用排気管のマウント装置
KR102412246B1 (ko) * 2017-06-07 2022-06-23 쇼와덴코머티리얼즈가부시끼가이샤 반도체용 필름형 접착제, 반도체 장치의 제조 방법 및 반도체 장치
JPWO2019050006A1 (ja) * 2017-09-11 2020-08-20 日立化成株式会社 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
WO2019050012A1 (ja) * 2017-09-11 2019-03-14 日立化成株式会社 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
JP6939542B2 (ja) 2017-12-28 2021-09-22 株式会社オートネットワーク技術研究所 電気接続装置
CN112210321A (zh) * 2019-07-12 2021-01-12 臻鼎科技股份有限公司 导电粘着剂以及使用其的电磁波屏蔽膜和电路板
WO2023276792A1 (ja) * 2021-07-01 2023-01-05 日東電工株式会社 接合シートおよび電子部品の製造方法
JP7552782B1 (ja) 2023-04-24 2024-09-18 株式会社レゾナック 半導体用フィルム状接着剤、半導体用フィルム状接着剤の製造方法、接着剤テープ、半導体装置の製造方法及び半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08148211A (ja) * 1994-11-25 1996-06-07 Hitachi Chem Co Ltd 接続部材及び該接続部材を用いた電極の接続構造・接続方法
TW201020305A (en) * 2004-06-09 2010-06-01 Hitachi Chemical Co Ltd Circuit connecting material and circuit component connecting structure
TW201442584A (zh) * 2013-03-28 2014-11-01 迪睿合股份有限公司 回路構件之接續方法及接合體

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06103819A (ja) * 1992-09-21 1994-04-15 Hitachi Chem Co Ltd 異方導電性接着フィルム
JP4844003B2 (ja) * 2005-05-10 2011-12-21 日立化成工業株式会社 回路接続材料、回路部材の接続構造及び回路部材の接続方法。
EP2055757A4 (en) * 2006-08-22 2009-12-16 Hitachi Chemical Co Ltd CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE OF A CIRCUIT MEMBER AND METHOD FOR PRODUCING THE CONNECTING STRUCTURE OF A CIRCUIT MEMBER
KR101140067B1 (ko) * 2007-10-15 2012-04-30 히다치 가세고교 가부시끼가이샤 회로 접속용 접착 필름 및 회로 접속 구조체
JP2009277769A (ja) 2008-05-13 2009-11-26 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路部材の接続構造
JP5690648B2 (ja) * 2011-04-28 2015-03-25 デクセリアルズ株式会社 異方性導電フィルム、接続方法及び接続構造体
JP5650611B2 (ja) * 2011-08-23 2015-01-07 デクセリアルズ株式会社 異方性導電フィルム、異方性導電フィルムの製造方法、接続方法、及び接合体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08148211A (ja) * 1994-11-25 1996-06-07 Hitachi Chem Co Ltd 接続部材及び該接続部材を用いた電極の接続構造・接続方法
TW201020305A (en) * 2004-06-09 2010-06-01 Hitachi Chemical Co Ltd Circuit connecting material and circuit component connecting structure
TW201442584A (zh) * 2013-03-28 2014-11-01 迪睿合股份有限公司 回路構件之接續方法及接合體

Also Published As

Publication number Publication date
CN107112658A (zh) 2017-08-29
TW201633863A (zh) 2016-09-16
KR102006090B1 (ko) 2019-07-31
KR20170083113A (ko) 2017-07-17
WO2016117350A1 (ja) 2016-07-28
CN107112658B (zh) 2019-07-12
JP2016134366A (ja) 2016-07-25
JP6474620B2 (ja) 2019-02-27

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