TWI679100B - 樹脂成形裝置及樹脂成形品製造方法 - Google Patents

樹脂成形裝置及樹脂成形品製造方法 Download PDF

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Publication number
TWI679100B
TWI679100B TW106118377A TW106118377A TWI679100B TW I679100 B TWI679100 B TW I679100B TW 106118377 A TW106118377 A TW 106118377A TW 106118377 A TW106118377 A TW 106118377A TW I679100 B TWI679100 B TW I679100B
Authority
TW
Taiwan
Prior art keywords
resin material
frame
resin
film
film tension
Prior art date
Application number
TW106118377A
Other languages
English (en)
Chinese (zh)
Other versions
TW201805137A (zh
Inventor
林口慎也
Shinya Hayashiguchi
荒木芳文
Yoshifumi Araki
Original Assignee
日商東和股份有限公司
Towa Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東和股份有限公司, Towa Corporation filed Critical 日商東和股份有限公司
Publication of TW201805137A publication Critical patent/TW201805137A/zh
Application granted granted Critical
Publication of TWI679100B publication Critical patent/TWI679100B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
    • B29C2043/3411—Feeding the material to the mould or the compression means using carrying means mounted onto arms, e.g. grippers, fingers, clamping frame, suction means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3483—Feeding the material to the mould or the compression means using band or film carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW106118377A 2016-08-01 2017-06-03 樹脂成形裝置及樹脂成形品製造方法 TWI679100B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2016-151026 2016-08-01
JP2016151026A JP6672103B2 (ja) 2016-08-01 2016-08-01 樹脂成形装置及び樹脂成形品製造方法

Publications (2)

Publication Number Publication Date
TW201805137A TW201805137A (zh) 2018-02-16
TWI679100B true TWI679100B (zh) 2019-12-11

Family

ID=61134186

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106118377A TWI679100B (zh) 2016-08-01 2017-06-03 樹脂成形裝置及樹脂成形品製造方法

Country Status (4)

Country Link
JP (1) JP6672103B2 (ko)
KR (1) KR102122318B1 (ko)
CN (1) CN107672103B (ko)
TW (1) TWI679100B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7417429B2 (ja) * 2020-01-17 2024-01-18 Ｔｏｗａ株式会社 樹脂成形装置、樹脂成形品の製造方法
JP7277936B2 (ja) * 2020-04-28 2023-05-19 アピックヤマダ株式会社 樹脂モールド装置
JP7277935B2 (ja) * 2020-04-28 2023-05-19 アピックヤマダ株式会社 樹脂モールド装置
JP7428384B2 (ja) * 2020-10-06 2024-02-06 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP2022061238A (ja) * 2020-10-06 2022-04-18 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
CN112635366B (zh) * 2020-12-24 2024-03-12 江苏汇成光电有限公司 一种uv机晶圆铁框定位装置
WO2022264374A1 (ja) * 2021-06-17 2022-12-22 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
CN113547683B (zh) * 2021-07-29 2023-03-24 广州聚仕达橡胶机械技术有限公司 一种橡胶自动热压成型生产设备及方法
WO2024190500A1 (ja) * 2023-03-13 2024-09-19 株式会社村田製作所 電子部品の製造方法および製造装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105082432A (zh) * 2014-05-22 2015-11-25 东和株式会社 树脂成型装置及树脂成型方法

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JPH06106629A (ja) * 1992-09-30 1994-04-19 Hitachi Chem Co Ltd シート状物の製造方法
JP4953619B2 (ja) * 2005-11-04 2012-06-13 Ｔｏｗａ株式会社 電子部品の樹脂封止成形装置
JP2008012741A (ja) * 2006-07-05 2008-01-24 Matsui Mfg Co 圧縮成形加工における粉粒体材料の充填装置
MY182097A (en) * 2007-03-13 2021-01-18 Towa Corp Method of compression molding for electronic part and apparatus therefor
JP2008254266A (ja) * 2007-04-03 2008-10-23 Towa Corp 電子部品の圧縮成形方法及び装置
JP2010247429A (ja) * 2009-04-15 2010-11-04 Apic Yamada Corp 樹脂封止装置とこれを用いた樹脂封止方法
JP5576197B2 (ja) * 2010-07-08 2014-08-20 Ｔｏｗａ株式会社 電子部品の圧縮成形方法及び成形装置
JP5627619B2 (ja) * 2012-02-28 2014-11-19 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止体の製造方法
JP2013184413A (ja) * 2012-03-08 2013-09-19 Sumitomo Heavy Ind Ltd 樹脂封止装置及び樹脂封止方法
JP6127660B2 (ja) * 2013-03-29 2017-05-17 株式会社カネカ 発光素子実装用リードフレーム、発光素子実装用樹脂成型体及びその製造方法、並びにトランスファ成型用金型
JP6057880B2 (ja) * 2013-11-28 2017-01-11 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給方法及び供給装置
JP6298719B2 (ja) * 2014-06-09 2018-03-20 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105082432A (zh) * 2014-05-22 2015-11-25 东和株式会社 树脂成型装置及树脂成型方法

Also Published As

Publication number Publication date
JP2018020445A (ja) 2018-02-08
JP6672103B2 (ja) 2020-03-25
CN107672103A (zh) 2018-02-09
CN107672103B (zh) 2020-08-21
KR20180014660A (ko) 2018-02-09
KR102122318B1 (ko) 2020-06-12
TW201805137A (zh) 2018-02-16

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