TWI678770B - 具離子交換玻璃處理之中介層的暫態電子裝置 - Google Patents

具離子交換玻璃處理之中介層的暫態電子裝置 Download PDF

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Publication number
TWI678770B
TWI678770B TW105109922A TW105109922A TWI678770B TW I678770 B TWI678770 B TW I678770B TW 105109922 A TW105109922 A TW 105109922A TW 105109922 A TW105109922 A TW 105109922A TW I678770 B TWI678770 B TW I678770B
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TW
Taiwan
Prior art keywords
interposer
glass substrate
die
glass
electronic device
Prior art date
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TW105109922A
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English (en)
Chinese (zh)
Other versions
TW201709431A (zh
Inventor
史考特Ｊ Ｈ 林
Scott J. H. Limb
葛雷格里Ｌ 懷汀
Gregory L. Whiting
Original Assignee
美商帕洛阿爾托研究中心公司
Palo Alto Research Center Incorporated
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Application filed by 美商帕洛阿爾托研究中心公司, Palo Alto Research Center Incorporated filed Critical 美商帕洛阿爾托研究中心公司
Publication of TW201709431A publication Critical patent/TW201709431A/zh
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Publication of TWI678770B publication Critical patent/TWI678770B/zh

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
    • H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
    • H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
    • H03K19/17748—Structural details of configuration resources
    • H03K19/17768—Structural details of configuration resources for security

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Wire Bonding (AREA)
  • Geometry (AREA)
  • Logic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Micromachines (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW105109922A 2015-04-23 2016-03-29 具離子交換玻璃處理之中介層的暫態電子裝置 TWI678770B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/694,132 2015-04-23
US14/694,132 US9780044B2 (en) 2015-04-23 2015-04-23 Transient electronic device with ion-exchanged glass treated interposer

Publications (2)

Publication Number Publication Date
TW201709431A TW201709431A (zh) 2017-03-01
TWI678770B true TWI678770B (zh) 2019-12-01

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TW105109922A TWI678770B (zh) 2015-04-23 2016-03-29 具離子交換玻璃處理之中介層的暫態電子裝置

Country Status (5)

Country Link
US (3) US9780044B2 (cg-RX-API-DMAC7.html)
EP (1) EP3086363B1 (cg-RX-API-DMAC7.html)
JP (1) JP6533757B2 (cg-RX-API-DMAC7.html)
KR (1) KR102315467B1 (cg-RX-API-DMAC7.html)
TW (1) TWI678770B (cg-RX-API-DMAC7.html)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9154138B2 (en) 2013-10-11 2015-10-06 Palo Alto Research Center Incorporated Stressed substrates for transient electronic systems
US9780044B2 (en) 2015-04-23 2017-10-03 Palo Alto Research Center Incorporated Transient electronic device with ion-exchanged glass treated interposer
US10012250B2 (en) 2016-04-06 2018-07-03 Palo Alto Research Center Incorporated Stress-engineered frangible structures
US9853001B1 (en) 2016-06-28 2017-12-26 International Business Machines Corporation Prevention of reverse engineering of security chips
US10224297B2 (en) 2016-07-26 2019-03-05 Palo Alto Research Center Incorporated Sensor and heater for stimulus-initiated fracture of a substrate
US10026579B2 (en) 2016-07-26 2018-07-17 Palo Alto Research Center Incorporated Self-limiting electrical triggering for initiating fracture of frangible glass
US10903173B2 (en) 2016-10-20 2021-01-26 Palo Alto Research Center Incorporated Pre-conditioned substrate
US10026651B1 (en) 2017-06-21 2018-07-17 Palo Alto Research Center Incorporated Singulation of ion-exchanged substrates
KR102334153B1 (ko) * 2017-07-07 2021-12-02 지멘스 악티엔게젤샤프트 전기 단락 디바이스
US11437731B2 (en) * 2017-09-13 2022-09-06 Metawave Corporation Method and apparatus for a passive radiating and feed structure
US10650181B2 (en) * 2017-09-21 2020-05-12 Nokia Solutions And Networks Oy Spatial location of vias in a printed circuit board
US10626048B2 (en) 2017-12-18 2020-04-21 Palo Alto Research Center Incorporated Dissolvable sealant for masking glass in high temperature ion exchange baths
US11569198B2 (en) * 2018-01-03 2023-01-31 Intel Corporation Stacked semiconductor die architecture with multiple layers of disaggregation
US10717669B2 (en) 2018-05-16 2020-07-21 Palo Alto Research Center Incorporated Apparatus and method for creating crack initiation sites in a self-fracturing frangible member
US11107645B2 (en) 2018-11-29 2021-08-31 Palo Alto Research Center Incorporated Functionality change based on stress-engineered components
US10947150B2 (en) 2018-12-03 2021-03-16 Palo Alto Research Center Incorporated Decoy security based on stress-engineered substrates
US10969205B2 (en) * 2019-05-03 2021-04-06 Palo Alto Research Center Incorporated Electrically-activated pressure vessels for fracturing frangible structures
US12013043B2 (en) 2020-12-21 2024-06-18 Xerox Corporation Triggerable mechanisms and fragment containment arrangements for self-destructing frangible structures and sealed vessels
US11904986B2 (en) 2020-12-21 2024-02-20 Xerox Corporation Mechanical triggers and triggering methods for self-destructing frangible structures and sealed vessels
US20240237206A1 (en) * 2021-06-22 2024-07-11 The Regents Of The University Of Colorado, A Body Corporate Fully Printed Sensor with Internal Ion Reservoirs
US20230085646A1 (en) * 2021-09-22 2023-03-23 Jeremy D Ecton Embedded glass core patch
CN117995806A (zh) * 2022-10-31 2024-05-07 奥特斯奥地利科技与系统技术有限公司 封装件和制造封装件的方法
CN118692923B (zh) * 2024-08-26 2025-01-03 广东佛智芯微电子技术研究有限公司 玻璃基多芯片异构集成结构及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201347173A (zh) * 2011-12-01 2013-11-16 美國伊利諾大學理事會 經設計以承受可程式化變換之暫態裝置
TW201411802A (zh) * 2012-09-10 2014-03-16 United Microelectronics Corp 半導體封裝結構以及用於半導體封裝結構之轉接板
WO2014169218A2 (en) * 2013-04-12 2014-10-16 The Board Of Trustees Of The University Of Illinois Materials, electronic systems and modes for active and passive transience
US20150037914A1 (en) * 2013-07-31 2015-02-05 Micron Technology, Inc. Method for manufacturing tested apparatus and method for manufacturing system including tested apparatus
US20150102852A1 (en) * 2013-10-11 2015-04-16 Palo Alto Research Center Incorporated Stressed Substrates For Transient Electronic Systems

Family Cites Families (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1138401A (en) 1965-05-06 1969-01-01 Mallory & Co Inc P R Bonding
US3601114A (en) 1969-01-21 1971-08-24 Norton Co Method and apparatus for cutting complex shapes
US3673667A (en) 1970-11-23 1972-07-04 Whittaker Corp Method for producing complex shapes by filled billet extrusion
US3666967A (en) 1971-05-12 1972-05-30 Us Navy Self-destruct aluminum-tungstic oxide films
US3882323A (en) 1973-12-17 1975-05-06 Us Navy Method and apparatus for protecting sensitive information contained in thin-film microelectonic circuitry
US4102664A (en) 1977-05-18 1978-07-25 Corning Glass Works Method for making glass articles with defect-free surfaces
US4139359A (en) 1977-11-02 1979-02-13 Ppg Industries, Inc. Method and apparatus for shaping glass sheets by roll forming
SE435352B (sv) 1983-05-04 1984-09-24 Hydro Betong Ab Konstruktionskropp for en berande konstruktion bestaende av ett antal med varandra sammanfogade skivor av plastmaterial, av exv uretanskum samt sett att tillverka sagda kropp
GB8322258D0 (en) 1983-08-18 1983-09-21 Holmes A Security and protection screens
JPH01273137A (ja) * 1988-04-25 1989-11-01 Hitachi Ltd 半導体集積回路の異常検出システム
FR2681472B1 (fr) 1991-09-18 1993-10-29 Commissariat Energie Atomique Procede de fabrication de films minces de materiau semiconducteur.
DE19958750B4 (de) 1999-12-07 2006-08-24 Robert Bosch Gmbh Leckwellenantenne
FR2823599B1 (fr) 2001-04-13 2004-12-17 Commissariat Energie Atomique Substrat demomtable a tenue mecanique controlee et procede de realisation
US20040031966A1 (en) 2002-08-16 2004-02-19 Forrest Stephen R. Organic photonic integrated circuit using a photodetector and a transparent organic light emitting device
JP2004075504A (ja) 2002-08-22 2004-03-11 Nippon Sheet Glass Co Ltd 板ガラスの複曲成形方法及びその装置
DE10305733B4 (de) 2003-02-12 2005-10-20 Saint Gobain Sekurit D Gmbh Verfahren zum Erzeugen von Sollbruchstellen in Glasscheiben, Glasscheibe mit Schwächungszone und Verwendung derselben
JP4115859B2 (ja) 2003-02-28 2008-07-09 株式会社日立製作所 陽極接合方法および電子装置
DE10309826B4 (de) 2003-03-05 2009-11-12 Schott Ag Verfahren zum Strukturieren von Phosphatgläsern durch zerstörungsfreien Ionenaustausch, strukturierte Phosphatgläser und deren Verwendung
US7002517B2 (en) 2003-06-20 2006-02-21 Anritsu Company Fixed-frequency beam-steerable leaky-wave microstrip antenna
EP1517073A1 (en) 2003-09-19 2005-03-23 Universita degli Studi di Trento ESP glass rupture disk
JP2007509315A (ja) 2003-10-09 2007-04-12 オカス コーポレーション ２層構造のボロメータ型赤外線センサ及びその製造方法
DE102004015546B4 (de) 2004-03-30 2011-05-12 Infineon Technologies Ag Halbleiterchip mit integrierter Schaltung und Verfahren zum Sichern einer integrierten Halbleiterschaltung
US20060270190A1 (en) 2005-05-25 2006-11-30 The Regents Of The University Of California Method of transferring a thin crystalline semiconductor layer
WO2007019277A2 (en) 2005-08-03 2007-02-15 California Institute Of Technology Method of forming semiconductor layers on handle substrates
US7880248B1 (en) 2005-10-17 2011-02-01 Teledyne Technologies Incorporated Destructor integrated circuit chip, interposer electronic device and methods
EP1949455A1 (en) 2005-11-18 2008-07-30 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device
US8168050B2 (en) 2006-07-05 2012-05-01 Momentive Performance Materials Inc. Electrode pattern for resistance heating element and wafer processing apparatus
JP2008153325A (ja) * 2006-12-15 2008-07-03 Hitachi Ulsi Systems Co Ltd 半導体装置
US7623560B2 (en) 2007-09-27 2009-11-24 Ostendo Technologies, Inc. Quantum photonic imagers and methods of fabrication thereof
WO2009150558A1 (en) 2008-06-13 2009-12-17 Nxp B.V. Intrusion protection using stress changes
KR20110044775A (ko) 2008-08-08 2011-04-29 코닝 인코포레이티드 강화 유리 제품 및 제조방법
KR20100063269A (ko) 2008-12-03 2010-06-11 주식회사 동부하이텍 이미지센서 및 그 제조방법
US8089285B2 (en) 2009-03-03 2012-01-03 International Business Machines Corporation Implementing tamper resistant integrated circuit chips
US8130072B2 (en) 2009-05-14 2012-03-06 Palo Alto Research Center Incorporated Vanadium oxide thermal microprobes
CN201532635U (zh) 2009-09-03 2010-07-21 百富计算机技术（深圳）有限公司 一种安全保护装置
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
FR2953213B1 (fr) 2009-12-01 2013-03-29 Saint Gobain Procede de structuration de surface par abrasion ionique,surface structuree et utilisations
TWI438162B (zh) 2010-01-27 2014-05-21 Wintek Corp 強化玻璃切割方法及強化玻璃切割預置結構
US8393175B2 (en) 2010-08-26 2013-03-12 Corning Incorporated Methods for extracting strengthened glass substrates from glass sheets
MX345668B (es) 2010-10-15 2016-03-30 The Invent Science Fund I Llc Antenas de dispersión por superficie.
US9167694B2 (en) * 2010-11-02 2015-10-20 Georgia Tech Research Corporation Ultra-thin interposer assemblies with through vias
US8607590B2 (en) 2010-11-30 2013-12-17 Corning Incorporated Methods for separating glass articles from strengthened glass substrate sheets
US8616024B2 (en) 2010-11-30 2013-12-31 Corning Incorporated Methods for forming grooves and separating strengthened glass substrate sheets
US8539794B2 (en) 2011-02-01 2013-09-24 Corning Incorporated Strengthened glass substrate sheets and methods for fabricating glass panels from glass substrate sheets
US20140300520A1 (en) 2011-04-07 2014-10-09 Polyvalor, Limited Partnership Full-space scanning end-switched crlh leaky-wave antenna
US8635887B2 (en) 2011-08-10 2014-01-28 Corning Incorporated Methods for separating glass substrate sheets by laser-formed grooves
TWI415809B (zh) 2011-08-12 2013-11-21 Wintek Corp 強化玻璃單元及其製作方法以及具有強化玻璃單元的覆蓋板
US20130082383A1 (en) * 2011-10-03 2013-04-04 Texas Instruments Incorporated Electronic assembly having mixed interface including tsv die
CN102617023B (zh) 2012-03-31 2014-12-31 洛阳兰迪玻璃机器股份有限公司 柱状曲面钢化玻璃加工装置
CN102617022B (zh) 2012-03-31 2014-10-22 洛阳兰迪玻璃机器股份有限公司 柱状曲面钢化玻璃加工方法
SE537874C2 (sv) * 2012-04-13 2015-11-03 Silex Microsystems Ab CTE-anpassad interposer och metod att tillverka en sådan
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
JP5752741B2 (ja) * 2012-09-26 2015-07-22 富士フイルム株式会社 多層基板および半導体パッケージ
US8765536B2 (en) 2012-09-28 2014-07-01 International Business Machines Corporation Stress engineered multi-layers for integration of CMOS and Si nanophotonics
US8816717B2 (en) 2012-10-17 2014-08-26 International Business Machines Corporation Reactive material for integrated circuit tamper detection and response
US9385435B2 (en) 2013-03-15 2016-07-05 The Invention Science Fund I, Llc Surface scattering antenna improvements
US9041205B2 (en) * 2013-06-28 2015-05-26 Intel Corporation Reliable microstrip routing for electronics components
JP6175606B2 (ja) * 2013-07-22 2017-08-09 株式会社アドウェルズ 接合方法
JP5582232B1 (ja) 2013-07-30 2014-09-03 日本電気硝子株式会社 曲面形状を有するガラス板の製造方法、曲面形状を有するガラス板及び曲面形状を有するガラス板の製造装置
US9790128B2 (en) 2013-08-07 2017-10-17 Corning Incorporated Laser controlled ion exchange process and glass articles formed therefrom
US9356603B2 (en) 2013-10-11 2016-05-31 Palo Alto Research Center Incorporated Thermally tempered glass substrate using CTE mismatched layers and paste mixtures for transient electronic systems
US9294098B2 (en) 2013-11-26 2016-03-22 Lawrence Livermore National Security, Llc System and method for on demand, vanishing, high performance electronic systems
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
WO2015116749A1 (en) * 2014-01-31 2015-08-06 Corning Incorporated Methods and apparatus for providing an interposer for interconnecting semiconductor chips
US9853361B2 (en) 2014-05-02 2017-12-26 The Invention Science Fund I Llc Surface scattering antennas with lumped elements
US9711852B2 (en) 2014-06-20 2017-07-18 The Invention Science Fund I Llc Modulation patterns for surface scattering antennas
US10381326B2 (en) * 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
FR3024136B1 (fr) 2014-07-24 2021-04-30 Saint Gobain Procede de rompage d'une feuille de verre
US9586857B2 (en) 2014-11-17 2017-03-07 International Business Machines Corporation Controlling fragmentation of chemically strengthened glass
US9780044B2 (en) 2015-04-23 2017-10-03 Palo Alto Research Center Incorporated Transient electronic device with ion-exchanged glass treated interposer
US9577047B2 (en) 2015-07-10 2017-02-21 Palo Alto Research Center Incorporated Integration of semiconductor epilayers on non-native substrates
US10012250B2 (en) 2016-04-06 2018-07-03 Palo Alto Research Center Incorporated Stress-engineered frangible structures
US10026579B2 (en) 2016-07-26 2018-07-17 Palo Alto Research Center Incorporated Self-limiting electrical triggering for initiating fracture of frangible glass
US10224297B2 (en) 2016-07-26 2019-03-05 Palo Alto Research Center Incorporated Sensor and heater for stimulus-initiated fracture of a substrate
US10903173B2 (en) 2016-10-20 2021-01-26 Palo Alto Research Center Incorporated Pre-conditioned substrate
US10026651B1 (en) 2017-06-21 2018-07-17 Palo Alto Research Center Incorporated Singulation of ion-exchanged substrates

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201347173A (zh) * 2011-12-01 2013-11-16 美國伊利諾大學理事會 經設計以承受可程式化變換之暫態裝置
TW201411802A (zh) * 2012-09-10 2014-03-16 United Microelectronics Corp 半導體封裝結構以及用於半導體封裝結構之轉接板
WO2014169218A2 (en) * 2013-04-12 2014-10-16 The Board Of Trustees Of The University Of Illinois Materials, electronic systems and modes for active and passive transience
US20150037914A1 (en) * 2013-07-31 2015-02-05 Micron Technology, Inc. Method for manufacturing tested apparatus and method for manufacturing system including tested apparatus
US20150102852A1 (en) * 2013-10-11 2015-04-16 Palo Alto Research Center Incorporated Stressed Substrates For Transient Electronic Systems

Also Published As

Publication number Publication date
JP2016208017A (ja) 2016-12-08
US10262954B2 (en) 2019-04-16
EP3086363A1 (en) 2016-10-26
EP3086363B1 (en) 2019-12-04
US20180005963A1 (en) 2018-01-04
KR20160126863A (ko) 2016-11-02
TW201709431A (zh) 2017-03-01
US20170084551A1 (en) 2017-03-23
US20200027847A1 (en) 2020-01-23
JP6533757B2 (ja) 2019-06-19
US10541215B1 (en) 2020-01-21
KR102315467B1 (ko) 2021-10-22
US9780044B2 (en) 2017-10-03

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