TWI676231B - 基板處理裝置、對位裝置、基板處理方法及對位方法 - Google Patents

基板處理裝置、對位裝置、基板處理方法及對位方法 Download PDF

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Publication number
TWI676231B
TWI676231B TW107124622A TW107124622A TWI676231B TW I676231 B TWI676231 B TW I676231B TW 107124622 A TW107124622 A TW 107124622A TW 107124622 A TW107124622 A TW 107124622A TW I676231 B TWI676231 B TW I676231B
Authority
TW
Taiwan
Prior art keywords
substrate
substrate processing
unit
light
light emitting
Prior art date
Application number
TW107124622A
Other languages
English (en)
Chinese (zh)
Other versions
TW201921564A (zh
Inventor
桒原丈二
Joji Kuwahara
Original Assignee
日商斯庫林集團股份有限公司
SCREEN Holdings Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司, SCREEN Holdings Co., Ltd. filed Critical 日商斯庫林集團股份有限公司
Publication of TW201921564A publication Critical patent/TW201921564A/zh
Application granted granted Critical
Publication of TWI676231B publication Critical patent/TWI676231B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
TW107124622A 2017-08-08 2018-07-17 基板處理裝置、對位裝置、基板處理方法及對位方法 TWI676231B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017153099A JP7021877B2 (ja) 2017-08-08 2017-08-08 基板処理装置、位置合わせ装置および位置合わせ方法
JP2017-153099 2017-08-08

Publications (2)

Publication Number Publication Date
TW201921564A TW201921564A (zh) 2019-06-01
TWI676231B true TWI676231B (zh) 2019-11-01

Family

ID=65274167

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107124622A TWI676231B (zh) 2017-08-08 2018-07-17 基板處理裝置、對位裝置、基板處理方法及對位方法

Country Status (5)

Country Link
US (1) US10585362B2 (https=)
JP (1) JP7021877B2 (https=)
KR (1) KR102134961B1 (https=)
CN (1) CN109390266B (https=)
TW (1) TWI676231B (https=)

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* Cited by examiner, † Cited by third party
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JP6923344B2 (ja) 2017-04-13 2021-08-18 株式会社Ｓｃｒｅｅｎホールディングス 周縁処理装置および周縁処理方法
US10871722B2 (en) * 2018-07-16 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Photomask purging system and method
JP7108509B2 (ja) * 2018-09-21 2022-07-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、位置合わせ装置および位置合わせ方法
US12027400B2 (en) * 2020-05-26 2024-07-02 Asm Ip Holding B.V. Automatic system calibration for wafer handling
KR102721980B1 (ko) 2022-02-24 2024-10-25 삼성전자주식회사 기판 정렬 장치 및 이를 이용한 기판 정렬 방법

Citations (3)

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US20040031779A1 (en) * 2002-05-17 2004-02-19 Cahill Steven P. Method and system for calibrating a laser processing system and laser marking system utilizing same
US20070112465A1 (en) * 2002-04-19 2007-05-17 Iraj Sadighi Vision system
US20100109202A1 (en) * 2008-11-04 2010-05-06 Molecular Imprints, Inc. Substrate Alignment

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JP2002319612A (ja) 2001-04-20 2002-10-31 Shin Etsu Handotai Co Ltd ウェーハ搬送装置、気相成長装置およびウェーハ搬送方法
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US20070112465A1 (en) * 2002-04-19 2007-05-17 Iraj Sadighi Vision system
US20040031779A1 (en) * 2002-05-17 2004-02-19 Cahill Steven P. Method and system for calibrating a laser processing system and laser marking system utilizing same
US20100109202A1 (en) * 2008-11-04 2010-05-06 Molecular Imprints, Inc. Substrate Alignment

Also Published As

Publication number Publication date
CN109390266B (zh) 2023-06-20
TW201921564A (zh) 2019-06-01
KR102134961B1 (ko) 2020-07-16
JP2019033170A (ja) 2019-02-28
US20190049865A1 (en) 2019-02-14
JP7021877B2 (ja) 2022-02-17
US10585362B2 (en) 2020-03-10
CN109390266A (zh) 2019-02-26
KR20190016435A (ko) 2019-02-18

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