CN109390266B - 基板处理装置、对位装置、基板处理方法以及对位方法 - Google Patents

基板处理装置、对位装置、基板处理方法以及对位方法 Download PDF

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Publication number
CN109390266B
CN109390266B CN201810851969.8A CN201810851969A CN109390266B CN 109390266 B CN109390266 B CN 109390266B CN 201810851969 A CN201810851969 A CN 201810851969A CN 109390266 B CN109390266 B CN 109390266B
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China
Prior art keywords
substrate
light emitting
light
substrate processing
light receiving
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CN201810851969.8A
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Chinese (zh)
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CN109390266A (zh
Inventor
桑原丈二
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
CN201810851969.8A 2017-08-08 2018-07-30 基板处理装置、对位装置、基板处理方法以及对位方法 Active CN109390266B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017153099A JP7021877B2 (ja) 2017-08-08 2017-08-08 基板処理装置、位置合わせ装置および位置合わせ方法
JP2017-153099 2017-08-08

Publications (2)

Publication Number Publication Date
CN109390266A CN109390266A (zh) 2019-02-26
CN109390266B true CN109390266B (zh) 2023-06-20

Family

ID=65274167

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CN201810851969.8A Active CN109390266B (zh) 2017-08-08 2018-07-30 基板处理装置、对位装置、基板处理方法以及对位方法

Country Status (5)

Country Link
US (1) US10585362B2 (https=)
JP (1) JP7021877B2 (https=)
KR (1) KR102134961B1 (https=)
CN (1) CN109390266B (https=)
TW (1) TWI676231B (https=)

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JP6923344B2 (ja) 2017-04-13 2021-08-18 株式会社Ｓｃｒｅｅｎホールディングス 周縁処理装置および周縁処理方法
US10871722B2 (en) * 2018-07-16 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Photomask purging system and method
JP7108509B2 (ja) * 2018-09-21 2022-07-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、位置合わせ装置および位置合わせ方法
US12027400B2 (en) * 2020-05-26 2024-07-02 Asm Ip Holding B.V. Automatic system calibration for wafer handling
KR102721980B1 (ko) 2022-02-24 2024-10-25 삼성전자주식회사 기판 정렬 장치 및 이를 이용한 기판 정렬 방법

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JP2005019963A (ja) * 2003-06-03 2005-01-20 Tokyo Electron Ltd 基板処理装置及び基板受け渡し位置の調整方法
CN1574210A (zh) * 2003-06-16 2005-02-02 东京毅力科创株式会社 基板处理装置和基板搬送装置的位置对准方法
JP2005337912A (ja) * 2004-05-27 2005-12-08 Nikon Corp 位置計測装置、露光装置、及びデバイスの製造方法
JP2015026738A (ja) * 2013-07-26 2015-02-05 株式会社Ｓｃｒｅｅｎホールディングス 位置決め装置、位置決め方法および描画装置
CN106252196A (zh) * 2015-06-03 2016-12-21 东京毅力科创株式会社 基板处理装置和基板处理方法

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USRE38113E1 (en) * 1993-04-02 2003-05-06 Nikon Corporation Method of driving mask stage and method of mask alignment
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JP2002319612A (ja) 2001-04-20 2002-10-31 Shin Etsu Handotai Co Ltd ウェーハ搬送装置、気相成長装置およびウェーハ搬送方法
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JP2005019963A (ja) * 2003-06-03 2005-01-20 Tokyo Electron Ltd 基板処理装置及び基板受け渡し位置の調整方法
CN1573568A (zh) * 2003-06-03 2005-02-02 东京毅力科创株式会社 基板处理装置及基板交接位置的调整方法
CN1574210A (zh) * 2003-06-16 2005-02-02 东京毅力科创株式会社 基板处理装置和基板搬送装置的位置对准方法
JP2005337912A (ja) * 2004-05-27 2005-12-08 Nikon Corp 位置計測装置、露光装置、及びデバイスの製造方法
JP2015026738A (ja) * 2013-07-26 2015-02-05 株式会社Ｓｃｒｅｅｎホールディングス 位置決め装置、位置決め方法および描画装置
CN106252196A (zh) * 2015-06-03 2016-12-21 东京毅力科创株式会社 基板处理装置和基板处理方法

Also Published As

Publication number Publication date
TW201921564A (zh) 2019-06-01
KR102134961B1 (ko) 2020-07-16
JP2019033170A (ja) 2019-02-28
US20190049865A1 (en) 2019-02-14
JP7021877B2 (ja) 2022-02-17
US10585362B2 (en) 2020-03-10
CN109390266A (zh) 2019-02-26
KR20190016435A (ko) 2019-02-18
TWI676231B (zh) 2019-11-01

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