TWI675419B - 晶圓狀物件之處理方法及設備 - Google Patents

晶圓狀物件之處理方法及設備 Download PDF

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Publication number
TWI675419B
TWI675419B TW104127601A TW104127601A TWI675419B TW I675419 B TWI675419 B TW I675419B TW 104127601 A TW104127601 A TW 104127601A TW 104127601 A TW104127601 A TW 104127601A TW I675419 B TWI675419 B TW I675419B
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TW
Taiwan
Prior art keywords
wafer
heater
processing chamber
chuck
rotating chuck
Prior art date
Application number
TW104127601A
Other languages
English (en)
Chinese (zh)
Other versions
TW201620039A (zh
Inventor
瑞尼 歐伯威格
Rainer Obweger
安得羅斯 格萊斯勒
Andreas Gleissner
湯瑪士 渥恩斯伯格
Thomas Wirnsberger
法蘭茲 古寧格
Franz Kumnig
亞歷山德羅 巴爾達羅
Alessandro Baldaro
克里斯琴 湯瑪士 費雪
Christian Thomas Fischer
牧弘 周
Mu Hung Chou
拉法爾 雷沙德 戴勒米茲
Rafal Ryszard Dylewicz
那森 拉夫多夫斯基
Nathan Lavdovsky
伊凡 Ｌ 貝里三世
Ivan L. Berry Iii
Original Assignee
奧地利商蘭姆研究股份公司
Lam Research Ag
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Publication date
Application filed by 奧地利商蘭姆研究股份公司, Lam Research Ag filed Critical 奧地利商蘭姆研究股份公司
Publication of TW201620039A publication Critical patent/TW201620039A/zh
Application granted granted Critical
Publication of TWI675419B publication Critical patent/TWI675419B/zh

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    • H10P72/0424—
    • H10P50/287—
    • H10P72/0436—
    • H10P72/0448—
    • H10P72/7626—

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Weting (AREA)
TW104127601A 2014-08-26 2015-08-25 晶圓狀物件之處理方法及設備 TWI675419B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/469,363 US10490426B2 (en) 2014-08-26 2014-08-26 Method and apparatus for processing wafer-shaped articles
US14/469,363 2014-08-26

Publications (2)

Publication Number Publication Date
TW201620039A TW201620039A (zh) 2016-06-01
TWI675419B true TWI675419B (zh) 2019-10-21

Family

ID=55403322

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104127601A TWI675419B (zh) 2014-08-26 2015-08-25 晶圓狀物件之處理方法及設備

Country Status (5)

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US (2) US10490426B2 (enExample)
JP (2) JP6632833B2 (enExample)
KR (1) KR102221266B1 (enExample)
CN (1) CN105390416B (enExample)
TW (1) TWI675419B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
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US11195730B2 (en) 2014-08-26 2021-12-07 Lam Research Ag Method and apparatus for processing wafer-shaped articles

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US9748120B2 (en) 2013-07-01 2017-08-29 Lam Research Ag Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus
US9597701B2 (en) * 2013-12-31 2017-03-21 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
US9657397B2 (en) * 2013-12-31 2017-05-23 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
US20180040502A1 (en) * 2016-08-05 2018-02-08 Lam Research Ag Apparatus for processing wafer-shaped articles
CN109923659B (zh) * 2016-11-09 2024-03-12 东京毅力科创Fsi公司 用于在处理室中处理微电子衬底的磁悬浮且旋转的卡盘
US11056358B2 (en) * 2017-11-14 2021-07-06 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer cleaning apparatus and method
KR102099433B1 (ko) * 2018-08-29 2020-04-10 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
GB201900912D0 (en) * 2019-01-23 2019-03-13 Lam Res Ag Apparatus for processing a wafer, and method of controlling such an apparatus
WO2022033337A1 (zh) 2020-08-10 2022-02-17 江西亿铂电子科技有限公司 一种显影盒、鼓盒和图像形成装置
US11454901B2 (en) 2020-08-10 2022-09-27 Jiangxi Yibo E-Tech Co. Ltd. Developing cartridge
KR102624576B1 (ko) * 2020-11-23 2024-01-16 세메스 주식회사 기판 처리 장치
JP7230077B2 (ja) 2021-02-12 2023-02-28 ウシオ電機株式会社 温度測定方法、光加熱方法及び光加熱装置
JP7625458B2 (ja) * 2021-03-22 2025-02-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7569752B2 (ja) * 2021-06-07 2024-10-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN115896744B (zh) * 2021-08-17 2025-02-21 北京北方华创微电子装备有限公司 半导体工艺设备
KR102705519B1 (ko) * 2022-02-21 2024-09-11 (주)디바이스이엔지 기판 식각 처리장치
JP2023169533A (ja) * 2022-05-17 2023-11-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

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Also Published As

Publication number Publication date
US20200090956A1 (en) 2020-03-19
KR20160024759A (ko) 2016-03-07
JP6890172B2 (ja) 2021-06-18
US20160064242A1 (en) 2016-03-03
JP2020065062A (ja) 2020-04-23
KR102221266B1 (ko) 2021-03-02
CN105390416A (zh) 2016-03-09
JP6632833B2 (ja) 2020-01-22
CN105390416B (zh) 2018-10-02
US11195730B2 (en) 2021-12-07
JP2016046531A (ja) 2016-04-04
US10490426B2 (en) 2019-11-26
TW201620039A (zh) 2016-06-01

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