TWI675125B - 蝕刻液、補給液以及銅配線的形成方法 - Google Patents

蝕刻液、補給液以及銅配線的形成方法 Download PDF

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Publication number
TWI675125B
TWI675125B TW107116147A TW107116147A TWI675125B TW I675125 B TWI675125 B TW I675125B TW 107116147 A TW107116147 A TW 107116147A TW 107116147 A TW107116147 A TW 107116147A TW I675125 B TWI675125 B TW I675125B
Authority
TW
Taiwan
Prior art keywords
membered ring
compound
group
heteroaromatic
etching solution
Prior art date
Application number
TW107116147A
Other languages
English (en)
Chinese (zh)
Other versions
TW201900929A (zh
Inventor
浜口仁美
高垣愛
菱川翔太
金美花
Original Assignee
日商Ｍｅｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｍｅｃ股份有限公司 filed Critical 日商Ｍｅｃ股份有限公司
Publication of TW201900929A publication Critical patent/TW201900929A/zh
Application granted granted Critical
Publication of TWI675125B publication Critical patent/TWI675125B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW107116147A 2017-05-22 2018-05-11 蝕刻液、補給液以及銅配線的形成方法 TWI675125B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-100648 2017-05-22
JP2017100648A JP6736088B2 (ja) 2017-05-22 2017-05-22 エッチング液、補給液および銅配線の形成方法

Publications (2)

Publication Number Publication Date
TW201900929A TW201900929A (zh) 2019-01-01
TWI675125B true TWI675125B (zh) 2019-10-21

Family

ID=64449104

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107116147A TWI675125B (zh) 2017-05-22 2018-05-11 蝕刻液、補給液以及銅配線的形成方法

Country Status (4)

Country Link
JP (1) JP6736088B2 (ko)
KR (1) KR102153612B1 (ko)
CN (1) CN108934126B (ko)
TW (1) TWI675125B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2020226125A1 (ko) * 2019-05-09 2020-11-12
JP7129711B2 (ja) 2020-01-24 2022-09-02 メック株式会社 エッチング液、補給液および銅配線の形成方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8383437B2 (en) * 2011-04-01 2013-02-26 Samsung Display Co., Ltd. Echtant and method for manufacturing display device using the same
TWI480360B (zh) * 2009-04-03 2015-04-11 Du Pont 蝕刻劑組成物及方法
TWI542735B (zh) * 2013-04-15 2016-07-21 Mec股份有限公司 蝕刻液、補給液及銅配線之形成方法
TWI565834B (zh) * 2010-08-16 2017-01-11 美商恩特葛瑞斯股份有限公司 銅或銅合金用之蝕刻液

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6398975B1 (en) * 1997-09-24 2002-06-04 Interuniversitair Microelektronica Centrum (Imec) Method and apparatus for localized liquid treatment of the surface of a substrate
JP4224436B2 (ja) 2003-07-25 2009-02-12 メック株式会社 エッチング剤と補給液及びこれを用いた銅配線の製造方法
JP2007180172A (ja) * 2005-12-27 2007-07-12 Mec Kk 基板の製造方法
JP2007332430A (ja) 2006-06-16 2007-12-27 Asahi Kagaku Kogyo Co Ltd エッチング組成液
JP4472006B2 (ja) 2007-09-04 2010-06-02 メック株式会社 エッチング液及び導体パターンの形成方法
JP4521460B2 (ja) 2008-02-20 2010-08-11 メック株式会社 エッチング液及びこれを用いた銅配線の形成方法
KR101186110B1 (ko) * 2009-01-14 2012-09-27 솔브레인 주식회사 금속막의 화학 기계적 연마용 슬러리 조성물
JP5219304B2 (ja) * 2010-12-14 2013-06-26 メック株式会社 エッチング剤及びこれを用いたエッチング方法
TW201410917A (zh) * 2012-09-03 2014-03-16 Dongwoo Fine Chem Co Ltd 蝕刻劑以及使用該蝕刻劑於製造顯示裝置之方法
JP6164614B2 (ja) * 2013-12-06 2017-07-19 メック株式会社 エッチング液、補給液及び銅配線の形成方法
JP6494254B2 (ja) * 2014-11-18 2019-04-03 関東化學株式会社 銅、モリブデン金属積層膜エッチング液組成物、該組成物を用いたエッチング方法および該組成物の寿命を延ばす方法
JP6273524B2 (ja) * 2016-08-30 2018-02-07 メック株式会社 エッチング液、補給液及び銅配線の形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI480360B (zh) * 2009-04-03 2015-04-11 Du Pont 蝕刻劑組成物及方法
TWI565834B (zh) * 2010-08-16 2017-01-11 美商恩特葛瑞斯股份有限公司 銅或銅合金用之蝕刻液
US8383437B2 (en) * 2011-04-01 2013-02-26 Samsung Display Co., Ltd. Echtant and method for manufacturing display device using the same
TWI542735B (zh) * 2013-04-15 2016-07-21 Mec股份有限公司 蝕刻液、補給液及銅配線之形成方法

Also Published As

Publication number Publication date
CN108934126A (zh) 2018-12-04
KR102153612B1 (ko) 2020-09-08
TW201900929A (zh) 2019-01-01
JP6736088B2 (ja) 2020-08-05
KR20180127908A (ko) 2018-11-30
CN108934126B (zh) 2021-12-28
JP2018193602A (ja) 2018-12-06

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