CN108934126B - 蚀刻液、补给液以及铜布线的形成方法 - Google Patents

蚀刻液、补给液以及铜布线的形成方法 Download PDF

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Publication number
CN108934126B
CN108934126B CN201810480094.5A CN201810480094A CN108934126B CN 108934126 B CN108934126 B CN 108934126B CN 201810480094 A CN201810480094 A CN 201810480094A CN 108934126 B CN108934126 B CN 108934126B
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China
Prior art keywords
membered ring
compound
heteroaromatic
etching solution
group
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CN201810480094.5A
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English (en)
Chinese (zh)
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CN108934126A (zh
Inventor
浜口仁美
高垣爱
菱川翔太
金美花
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MEC Co Ltd
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MEC Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CN201810480094.5A 2017-05-22 2018-05-18 蚀刻液、补给液以及铜布线的形成方法 Active CN108934126B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-100648 2017-05-22
JP2017100648A JP6736088B2 (ja) 2017-05-22 2017-05-22 エッチング液、補給液および銅配線の形成方法

Publications (2)

Publication Number Publication Date
CN108934126A CN108934126A (zh) 2018-12-04
CN108934126B true CN108934126B (zh) 2021-12-28

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Country Status (4)

Country Link
JP (1) JP6736088B2 (ko)
KR (1) KR102153612B1 (ko)
CN (1) CN108934126B (ko)
TW (1) TWI675125B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2020226125A1 (ko) * 2019-05-09 2020-11-12
JP7129711B2 (ja) 2020-01-24 2022-09-02 メック株式会社 エッチング液、補給液および銅配線の形成方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007180172A (ja) * 2005-12-27 2007-07-12 Mec Kk 基板の製造方法
TW201105780A (en) * 2009-04-03 2011-02-16 Du Pont Etchant composition and method
TW201213613A (en) * 2010-08-16 2012-04-01 Advanced Tech Materials Etching solution for copper or copper alloy
TW201410917A (zh) * 2012-09-03 2014-03-16 Dongwoo Fine Chem Co Ltd 蝕刻劑以及使用該蝕刻劑於製造顯示裝置之方法
CN103820783A (zh) * 2010-12-14 2014-05-28 Mec股份有限公司 使用蚀刻剂的蚀刻方法
CN104955985A (zh) * 2013-04-15 2015-09-30 Mec股份有限公司 蚀刻液、补给液及铜配线的形成方法
CN105980603A (zh) * 2013-12-06 2016-09-28 Mec股份有限公司 蚀刻液、补给液以及铜布线的形成方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6398975B1 (en) * 1997-09-24 2002-06-04 Interuniversitair Microelektronica Centrum (Imec) Method and apparatus for localized liquid treatment of the surface of a substrate
JP4224436B2 (ja) 2003-07-25 2009-02-12 メック株式会社 エッチング剤と補給液及びこれを用いた銅配線の製造方法
JP2007332430A (ja) 2006-06-16 2007-12-27 Asahi Kagaku Kogyo Co Ltd エッチング組成液
JP4472006B2 (ja) 2007-09-04 2010-06-02 メック株式会社 エッチング液及び導体パターンの形成方法
JP4521460B2 (ja) 2008-02-20 2010-08-11 メック株式会社 エッチング液及びこれを用いた銅配線の形成方法
KR101186110B1 (ko) * 2009-01-14 2012-09-27 솔브레인 주식회사 금속막의 화학 기계적 연마용 슬러리 조성물
KR101778296B1 (ko) * 2011-04-01 2017-09-14 삼성디스플레이 주식회사 식각액, 이를 이용한 표시 장치의 제조 방법
JP6494254B2 (ja) * 2014-11-18 2019-04-03 関東化學株式会社 銅、モリブデン金属積層膜エッチング液組成物、該組成物を用いたエッチング方法および該組成物の寿命を延ばす方法
JP6273524B2 (ja) * 2016-08-30 2018-02-07 メック株式会社 エッチング液、補給液及び銅配線の形成方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007180172A (ja) * 2005-12-27 2007-07-12 Mec Kk 基板の製造方法
TW201105780A (en) * 2009-04-03 2011-02-16 Du Pont Etchant composition and method
TW201213613A (en) * 2010-08-16 2012-04-01 Advanced Tech Materials Etching solution for copper or copper alloy
CN103820783A (zh) * 2010-12-14 2014-05-28 Mec股份有限公司 使用蚀刻剂的蚀刻方法
TW201410917A (zh) * 2012-09-03 2014-03-16 Dongwoo Fine Chem Co Ltd 蝕刻劑以及使用該蝕刻劑於製造顯示裝置之方法
CN104955985A (zh) * 2013-04-15 2015-09-30 Mec股份有限公司 蚀刻液、补给液及铜配线的形成方法
CN105980603A (zh) * 2013-12-06 2016-09-28 Mec股份有限公司 蚀刻液、补给液以及铜布线的形成方法

Also Published As

Publication number Publication date
CN108934126A (zh) 2018-12-04
KR102153612B1 (ko) 2020-09-08
TW201900929A (zh) 2019-01-01
JP6736088B2 (ja) 2020-08-05
KR20180127908A (ko) 2018-11-30
JP2018193602A (ja) 2018-12-06
TWI675125B (zh) 2019-10-21

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