TWI673570B - 異向性導電接著劑、連接體之製造方法及電子零件之連接方法 - Google Patents

異向性導電接著劑、連接體之製造方法及電子零件之連接方法 Download PDF

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TWI673570B
TWI673570B TW104103513A TW104103513A TWI673570B TW I673570 B TWI673570 B TW I673570B TW 104103513 A TW104103513 A TW 104103513A TW 104103513 A TW104103513 A TW 104103513A TW I673570 B TWI673570 B TW I673570B
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light
anisotropic conductive
absorption peak
absorber
photopolymerization initiator
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TW104103513A
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TW201535052A (zh
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稲瀬圭亮
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日商迪睿合股份有限公司
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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    • C09J9/02—Electrically-conducting adhesives
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    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
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Abstract

本發明藉由使用光硬化型之接著劑，於低溫下進行電子零件之連接，並且改善電子零件之連接不良。
本發明之異向性導電接著劑具有由剝離基材支持之黏合劑樹脂層，黏合劑樹脂層含有光聚合性化合物、光聚合起始劑、光吸收劑及導電性粒子，光吸收劑之光吸收峰波長大於光聚合起始劑之光吸收峰波長且差20nm以上。

Description

異向性導電接著劑、連接體之製造方法及電子零件之連接方法
本發明係關於一種含有光聚合性化合物、光聚合起始劑及光吸收劑之異向性導電接著劑、使用其之連接體之製造方法及電子零件之連接方法。本申請案以在日本於2014年3月11日提出申請之日本專利申請編號日本專利特願2014-047585為基礎而主張優先權，該申請藉由參照而引用至本申請案中。
一直以來，作為電視或PC顯示器、智慧型手機、攜帶型遊戲機、數位影音播放器、平板PC、可佩戴式終端或車載用顯示器等各種顯示手段或顯示輸入手段，大量使用有液晶顯示裝置或觸控面板裝置。近年來，於此種顯示裝置或觸控面板裝置中，就微距化、輕量薄型化等觀點而言，採用有將IC晶片直接安裝於基板上之所謂COG(chip on glass，玻璃覆晶)，或將形成有各種電路之可撓性基板直接安裝於基板上之所謂FOG(film on glass，玻璃上薄膜)。
例如，如圖7所示，採用COG安裝方式之液晶顯示裝置100具有發揮用於液晶顯示的主功能之液晶顯示面板104，該液晶顯示面板104具有由玻璃基板等構成之相互對向的兩片透明基板102、103。並且，液晶 顯示面板104中，該等兩透明基板102、103藉由框狀之密封件105而相互貼合，並且設置有於由兩透明基板102、103及密封件105圍繞成之空間內封入液晶106而成之面板顯示部107。
透明基板102、103於相互對向之兩內側表面以相互交叉之方式形成有由ITO(銦錫氧化物)等構成之條狀的一對透明電極108、109。並且，兩透明基板102、103藉由該等兩透明電極108、109之該交叉部位構成作為液晶顯示之最小單位的像素。
兩透明基板102、103中，一片透明基板103之平面尺寸形成為大於另一片透明基板102之平面尺寸，於該較大地形成之透明基板103的緣部103a形成有透明電極109之端子部109a。又，於兩透明電極108、109上形成有實施過特定之摩擦處理的配向膜111、112，藉由該配向膜111、112限制液晶分子之初始配向。進而，於兩透明電極108、109之外側配設有一對偏光板118、119，藉由該等兩偏光板118、119限制來自背光源等光源120之透射光的振動方向。
於端子部109a上經由異向性導電膜114而熱壓接有液晶驅動用IC115。異向性導電膜114係於熱硬化型之黏合劑樹脂中混入導電性粒子並製成膜狀者，藉由在2個導體間進行加熱壓接而可利用導電粒子獲得導體間之電導通，並利用黏合劑樹脂保持導體間之機械連接。液晶驅動用IC115係藉由選擇性地對像素施加液晶驅動電壓，而使液晶之配向部分地變化而可進行特定液晶顯示。再者，作為構成異向性導電膜114之接著劑，通常使用可靠性最高的熱硬化性之接著劑。
於經由此種異向性導電膜114將液晶驅動用IC115連接至端 子部109a之情形時，首先，藉由未圖示之預壓接手段於透明電極109之端子部109a上預壓接異向性導電膜114。繼而，於異向性導電膜114上載置液晶驅動用IC115後，如圖8所示，一面藉由熱壓頭等熱壓接手段121將液晶驅動用IC115與異向性導電膜114一併按壓向端子部109a側，一面使熱壓接手段121發熱。藉由利用該熱壓接手段121進行之發熱，異向性導電膜114產生熱硬化反應，藉此，經由異向性導電膜114將液晶驅動用IC115接著於端子部109a上。
然而，於使用此種異向性導電膜之連接方法中，熱加壓溫度高，對液晶驅動用IC115等電子零件或透明基板103之熱衝擊增大。此外，於連接異向性導電膜後，於溫度降低至常溫時，因與該熱壓接手段121抵接的電子零件與透明基板103之溫度差，有可能於透明基板103之端子部109a產生翹曲。因此，有引起於端子部109a周邊的液晶畫面產生之顯示不均或液晶驅動用IC115之連接不良等不良情況之虞。該傾向伴隨透明基板103之窄邊緣化或玻璃之薄型化而顯著地顯現。
[專利文獻1]日本特開2008-252098號公報
因此，業界亦提出使用紫外線硬化型之接著劑代替此種使用熱硬化型之接著劑之異向性導電膜114的連接方法。於使用紫外線硬化型之接著劑的連接方法中，未使用熱壓接手段，於常溫下按壓液晶驅動用IC115等電子零件，並自透明基板103之背面側照射紫外線，藉此使黏合劑樹脂硬化。因此，可防止因電子零件或透明基板之加熱溫度差所引起的透 明基板103或液晶驅動用IC115之翹曲。
然而，即便於使用紫外線硬化型之接著劑的連接方法中，亦有如下之虞：若於黏合劑樹脂之黏度高的狀態下進行加壓，則無法充分地壓入導電性粒子，即便連接電阻於連接初期良好，亦會因連接後之經時、環境因素而使導通電阻上升。
本發明係解決上述課題者，其目的在於提供一種藉由使用光硬化型之接著劑而於低溫下進行電子零件之連接，並且改善電子零件之連接不良的異向性導電接著劑、連接體之製造方法及電子零件之連接方法。
為了解決上述課題，本發明之異向性導電接著劑含有光聚合性化合物、光聚合起始劑及光吸收劑，上述光吸收劑之光吸收峰波長大於上述光聚合起始劑之光吸收峰波長，且差20nm以上。
又，本發明之連接體之製造方法在載置於平台上之透明基板上，經由光硬化系異向性導電接著劑而配置電子零件，一面藉由壓接工具將上述電子零件按壓於上述透明基板，一面利用光照射器進行光照射，上述光硬化系異向性導電接著劑含有光聚合性化合物、光聚合起始劑及光吸收劑，上述光吸收劑之光吸收峰波長大於上述光聚合起始劑之光吸收峰波長，且差20nm以上，上述光照射器照射含有上述光聚合起始劑之光吸收峰及上述光吸收劑之光吸收峰的波長之光。
又，本發明之電子零件之連接方法在載置於平台上之透明基板上，經由光硬化系異向性導電接著劑而配置電子零件，一面藉由壓接工具將上述電子零件按壓於上述透明基板，一面利用光照射器進行光照射，上述光硬化系異向性導電接著劑含有光聚合性化合物、光聚合起始劑及光 吸收劑，上述光吸收劑之光吸收峰波長大於上述光聚合起始劑之光吸收峰波長，且差20nm以上，上述光照射器係照射含有上述光聚合起始劑之光吸收峰及上述光吸收劑之光吸收峰的波長之光。
根據本發明，作為異向性導電接著劑，使用光吸收劑之光吸收峰波長較光聚合起始劑之光吸收峰波長大20nm以上者作為光聚合起始劑及光吸收劑。藉此，不會相互阻礙光聚合起始劑與光吸收劑之各紫外線吸收，可分別進行黏合劑樹脂之硬化反應的進行及利用發熱之黏合劑樹脂之熔融。因此，可製造具有良好連接性之連接體。
1‧‧‧異向性導電膜
2‧‧‧剝離膜
3‧‧‧黏合劑樹脂層
4‧‧‧導電性粒子
10‧‧‧液晶顯示面板
11、12‧‧‧透明基板
13‧‧‧密封件
14‧‧‧液晶
15‧‧‧面板顯示部
16、17‧‧‧透明電極
18‧‧‧液晶驅動用IC
20‧‧‧COG安裝部
21‧‧‧可撓性基板
22‧‧‧FOG安裝部
24‧‧‧配向膜
25、26‧‧‧偏光板
30‧‧‧連接裝置
31‧‧‧平台
33‧‧‧壓接頭
35‧‧‧紫外線照射器
圖1係作為連接體之一例而揭示的液晶顯示面板之剖面圖。
圖2係表示液晶驅動用IC與透明基板之連接步驟之剖面圖。
圖3係表示異向性導電膜之剖面圖。
圖4係表示本發明之異向性導電膜的光聚合起始劑與光吸收劑的光吸收峰波長之關係的曲線圖。
圖5係表示測量實施例及比較例之連接體樣品的翹曲量之步驟的側視圖。
圖6係表示測量實施例及比較例之連接體樣品的連接電阻之步驟的立體圖。
圖7係液晶顯示面板之剖面圖。
圖8係表示於液晶顯示面板之透明基板連接IC晶片的步驟之剖面圖。
以下，對應用本發明之異向性導電接著劑、連接體之製造方法及電子零件之連接方法，一面參照圖式，一面詳細地進行說明。再者，本發明並不僅限定於以下之實施形態，當然可於不脫離本發明之主旨的範圍內進行各種變更。又，圖式係示意性者，存在各尺寸之比率等與現實者不同之情形。具體的尺寸等應參考以下之說明而加以判斷。又，當然於圖式彼此間亦含有相互之尺寸的關係或比率不同之部分。
以下，以進行於液晶顯示面板之玻璃基板安裝作為電子零件的液晶驅動用IC晶片之所謂COG(chip on glass)安裝的情形為例進行說明。該液晶顯示面板10如圖1所示，對向配置有由玻璃基板等構成之兩片透明基板11、12，且該等透明基板11、12藉由框狀之密封件13而相互貼合。並且，液晶顯示面板10係藉由在由透明基板11、12圍繞成之空間內封入液晶14而形成面板顯示部15。
透明基板11、12於相互對向之兩內側表面以相互交叉的方式形成有由ITO(銦錫氧化物)等構成之條狀的一對透明電極16、17。並且，兩透明電極16、17藉由該等兩透明電極16、17之該交叉部位而構成作為液晶顯示之最小單位的像素。
兩片透明基板11、12中，一片透明基板12之平面尺寸形成為大於另一片透明基板11之平面尺寸，於該較大地形成之透明基板12的緣部12a設置有COG安裝部20，該COG安裝部20安裝有作為電子零件之液晶驅動用IC18，又，於COG安裝部20之外側附近，設置有FOG安裝部22，該FOG安裝部22安裝有作為電子零件之形成有液晶驅動電路的可撓性基板 21。再者，於COG安裝部20形成有透明電極17之端子部17a及與設置於液晶驅動用IC18之IC側對準標記24重疊的基板側對準標記23。
再者，液晶驅動用IC18可藉由選擇性地對像素施加液晶驅動電壓，使液晶之配向部分地變化而進行特定液晶顯示。又，如圖2所示，液晶驅動用IC18形成有經由異向性導電膜1而與透明電極17之端子部17a導通連接的電極端子19。電極端子19例如可較佳地使用銅凸塊或金凸塊，或對銅凸塊實施鍍金者等。
又，液晶驅動用IC18於安裝面18a形成有藉由與基板側對準標記23重疊而進行對透明基板12之對準的IC側對準標記24。再者，由於透明基板12之透明電極17的配線間距或液晶驅動用IC18之電極端子19的微距化不斷發展，因此對液晶驅動用IC18與透明基板12要求高精度之對準調整。
於各安裝部20、22形成有透明電極17之端子部17a。於端子部17a，使用異向性導電膜1作為含有光聚合起始劑之電路連接用接著劑而連接液晶驅動用IC18或可撓性基板21。異向性導電膜1含有導電性粒子4，經由導電性粒子4而使液晶驅動用IC18或可撓性基板21之電極與形成於透明基板12的緣部12a之透明電極17的端子部17a電性連接。該異向性導電膜1為紫外線硬化型之接著劑，藉由下述紫外線照射器35照射紫外線，並且藉由壓接頭33進行按壓，藉此流動化而將導電性粒子4於端子部17a與液晶驅動用IC18或可撓性基板21之各電極間壓碎，於導電性粒子4被壓碎之狀態下進行硬化。藉此，異向性導電膜1將透明基板12與液晶驅動用IC18或可撓性基板21電性、機械連接。
又，於兩透明電極16、17上形成有實施過特定之摩擦處理的配向膜24，藉由該配向膜24限制液晶分子之初始配向。進而，於兩片透明基板11、12之外側配設有一對偏光板25、26，藉由該等兩偏光板25、26限制來自背光源等光源(未圖示)之透射光的振動方向。
[光硬化系異向性導電膜]
於本發明中，可使用光硬化系之異向性導電膜(ACF，Anisotropic Conductive Film)1。異向性導電膜1可為光陽離子系或光自由基系之任一者，可根據目的而進行適當選擇。
如圖3所示，異向性導電膜1於成為基材之剝離膜2上形成有含有導電性粒子4之黏合劑樹脂層(接著劑層)3。如圖2所示，異向性導電膜1藉由使黏合劑樹脂層3介隔存在於液晶顯示面板10之形成於透明基板12的透明電極17之端子部17a與液晶驅動用IC18的電極端子19之間，而連接液晶顯示面板10與液晶驅動用IC18並使其等導通。
作為剝離膜2，可使用異向性導電膜通常使用之例如聚對苯二甲酸乙二酯膜等基材。
異向性導電膜1於黏合劑樹脂層3中含有膜形成樹脂、光聚合起始劑、光聚合性化合物、光吸收劑及導電性粒子4。異向性導電膜1藉由含有光吸收劑，而於下述液晶驅動用IC18之連接步驟中，光吸收劑因紫外線照射而發熱，使黏合劑樹脂軟化。藉此，異向性導電膜1可藉由壓接頭33而將導電性粒子4在端子部17a與電極端子19之間充分地壓入。關於光吸收劑之發熱溫度，較佳為使黏合劑樹脂軟化至對壓入導電性粒子4而言為足夠之程度，並且對透明基板13或液晶驅動用IC18亦無熱衝擊之影響 的特定溫度，例如80~90℃左右，可根據光吸收劑之材料選擇而進行適當設定。
[光陽離子系]
光陽離子系之異向性導電膜1於黏合劑樹脂層3中含有膜形成樹脂、光陽離子聚合起始劑、光陽離子聚合性化合物及光吸收劑。
作為膜形成樹脂，較佳為平均分子量為10000~80000左右之樹脂。作為膜形成樹脂，可列舉：苯氧基樹脂、環氧樹脂、變性環氧樹脂、胺基甲酸酯樹脂等各種樹脂。其中，就膜形成狀態、連接可靠性等觀點而言，尤佳為苯氧基樹脂。
作為光陽離子聚合起始劑，例如可使用錪鹽、鋶鹽、芳香族重氮鹽、鏻鹽、硒鹽(selenonium)等鎓鹽或金屬芳烴錯合物、矽烷醇/鋁錯合物等錯合化合物、安息香甲苯磺酸酯、鄰硝基苄基甲苯磺酸酯等。又，作為形成鹽時之抗衡陰離子，可使用碳酸丙二酯、六氟銻酸鹽、六氟磷酸鹽、四氟硼酸鹽、四(五氟苯基)硼酸鹽等。
光陽離子聚合起始劑可僅單獨使用一種，亦可混合兩種以上使用。其中，芳香族鋶鹽由於在300nm以上之波長區域亦具有紫外線吸收特性，硬化性優異，故可較佳地使用。
光陽離子聚合性化合物係具有藉由陽離子種而進行聚合之官能基的化合物，可列舉：環氧化合物、乙烯醚化合物、環狀醚化合物等。
作為環氧化合物，係1分子中具有2個以上環氧基之化合物，例如可列舉：由表氯醇與雙酚A或雙酚F等衍生之雙酚型環氧樹脂、或聚環氧丙醚、聚環氧丙酯、芳香族環氧化合物、脂環式環氧化合物、酚 醛清漆型環氧化合物、環氧丙胺系環氧化合物、環氧丙酯系環氧化合物等。
光吸收劑係藉由在液晶驅動用IC18之連接步驟中照射紫外線而發熱，使黏合劑樹脂熔融者。於使用光陽離子聚合起始劑作為光聚合起始劑之情形時，光吸收劑例如可較佳地使用苯并三唑系、三系、二苯甲酮系等之紫外線吸收劑，並根據光陽離子聚合起始劑之吸收峰波長或紫外線照射器35之分光分佈、與黏合劑樹脂之其他成分的相溶性、紫外線吸收能力等而適當選擇。再者，於使用陽離子系聚合起始劑作為光聚合起始劑之情形時，亦可使用光自由基聚合起始劑作為藉由吸收紫外線而發熱之光吸收劑。
[光自由基系]
光自由基系之異向性導電膜1於黏合劑樹脂層3中含有膜形成樹脂、光自由基聚合起始劑、光自由基聚合性化合物及光吸收劑。
作為膜形成樹脂，可使用與光陽離子系相同者。
作為光自由基聚合起始劑，有安息香乙醚、安息香異丙醚等安息香醚、二苯基乙二酮、羥基環己基苯基酮等苯偶醯縮酮、二苯甲酮、苯乙酮等酮類及其衍生物、9-氧硫類、雙咪唑類等，於該等光聚合起始劑中，視需要亦可以任意比添加胺類、硫化合物、磷化合物等增感劑。此時，必須根據所使用之光源的波長或所需之硬化特性等而選擇最佳之光起始劑。
又，作為藉由光照射而產生活性自由基之化合物，可使用有機過氧化物系硬化劑。作為有機過氧化物，可自過氧化二醯基、過氧化二烷基、過氧化二碳酸酯、過氧化酯、過氧化縮酮、過氧化氫、過氧化矽基 等中使用1種或2種以上。
光自由基聚合性化合物係具有藉由活性自由基而進行聚合之官能基的物質，可列舉：丙烯酸酯化合物、甲基丙烯酸酯化合物、順丁烯二醯亞胺化合物等。
光自由基聚合性化合物可以單體、低聚物任一種狀態使用，亦可併用單體與低聚物。
作為丙烯酸酯化合物、甲基丙烯酸酯化合物，可列舉：環氧丙烯酸酯低聚物、丙烯酸胺基甲酸酯低聚物、聚醚丙烯酸酯低聚物、聚酯丙烯酸酯低聚物等光聚合性低聚物；三羥甲基丙烷三丙烯酸酯、聚乙二醇二丙烯酸酯、聚伸烷基二醇二丙烯酸酯、新戊四醇丙烯酸酯、丙烯酸2-氰基乙酯、丙烯酸環己酯、丙烯酸二環戊烯酯、丙烯酸二環戊烯氧基乙酯、丙烯酸2-(2-乙氧基乙氧基)乙酯、丙烯酸2-乙氧基乙酯、丙烯酸2-乙基己酯、丙烯酸正己酯、丙烯酸2-羥基乙酯、丙烯酸羥基丙酯、丙烯酸異莰酯、丙烯酸異癸酯、丙烯酸異辛酯、丙烯酸正月桂酯、丙烯酸2-甲氧基乙酯、丙烯酸2-苯氧基乙酯、丙烯酸四氫糠酯、新戊二醇二丙烯酸酯、二新戊四醇六丙烯酸酯等光聚合性單官能及多官能丙烯酸酯單體等。該等可使用1種或混合2種以上使用。
光吸收劑例如可較佳地使用苯并三唑系、三系、二苯甲酮系等之紫外線吸收劑，並根據光自由基聚合起始劑之吸收峰波長或紫外線照射器35之分光分佈、與黏合劑樹脂之其他成分的相溶性、紫外線吸收能力等而適當選擇。
此外，黏合劑樹脂亦可含有矽烷偶合劑等添加劑或無機填 料。作為矽烷偶合劑，可列舉：環氧系、胺基系、巰基-硫醚系、脲基系等。藉由添加矽烷偶合劑，有機材料與無機材料之界面的接著性得以提高。
作為導電性粒子4，可列舉異向性導電膜中所使用的公知之任一種導電性粒子。作為導電性粒子4，例如可列舉：鎳、鐵、銅、鋁、錫、鉛、鉻、鈷、銀、金等各種金屬或金屬合金之粒子，於金屬氧化物、碳、石墨、玻璃、陶瓷、塑膠等之粒子的表面塗佈有金屬者，或於該等粒子之表面進而塗佈有絕緣薄膜者等。於在樹脂粒子之表面塗佈有金屬者之情形時，作為樹脂粒子，例如可列舉：環氧樹脂、酚樹脂、丙烯酸樹脂、丙烯腈-苯乙烯(AS)樹脂、苯胍樹脂、二乙烯基苯系樹脂、苯乙烯系樹脂等之粒子。
[光聚合起始劑與光吸收劑之光吸收峰波長]
關於本發明之光硬化系之異向性導電膜1，光吸收劑之光吸收峰波長大於光聚合起始劑之光吸收峰波長，且差20nm以上。異向性導電膜1若自下述紫外線照射器35被照射紫外光，則光聚合起始劑吸收紫外光而產生酸或自由基。又，光吸收劑亦同樣地吸收紫外光並發熱。
此處，若光聚合起始劑之光吸收峰與光吸收劑之光吸收峰接近，則相互阻礙紫外光之吸收，硬化反應或發熱變得不充分。其結果有如下之虞：黏合劑樹脂未熔融，於導電性粒子4之壓入不足之狀態下進行黏合劑樹脂之硬化，又，因連接後之經時變化或環境變化而使導通電阻上升。
又，由於光吸收劑及光聚合起始劑之各光吸收峰波長通常具有如圖4所示之分佈，因此若光吸收劑之光吸收峰波長小於光聚合起始劑之光吸收峰波長，則即便差20nm以上，峰以外之吸收波長的重複範圍亦 會擴大，相互阻礙紫外光之吸收，硬化反應或發熱變得不充分。
另一方面，藉由使用光吸收劑之光吸收峰波長較光聚合起始劑之光吸收峰波長大20nm以上者作為光吸收劑及光聚合起始劑，可不阻礙光聚合起始劑與光吸收劑之各紫外線吸收，而分別進行黏合劑樹脂之硬化反應的進行，及利用發熱之黏合劑樹脂的熔融。
又，較佳本發明之光聚合起始劑的光吸收峰波長為290nm~330nm，光吸收劑之光吸收峰波長為320nm~360nm。
例如，藉由使用紫外光之吸收峰為310nm的光陽離子聚合起始劑，並使用紫外光之吸收峰為340~360nm的紫外線吸收劑，光陽離子聚合起始劑與紫外線吸收劑不會相互阻礙紫外光之吸收，可促進硬化反應或發熱。
[連接裝置]
繼而，對經由異向性導電膜1將液晶驅動用IC18連接至透明基板12的連接體之製造步驟中所使用之連接裝置30進行說明。
如圖1所示，連接裝置30具有：平台31，其具有光透過性；壓接頭33，其按壓液晶驅動用IC18，該液晶驅動用IC18經由異向性導電膜1而搭載於平台31上載置之透明基板12；及紫外線照射器35，其設置於平台31之背面側。
平台31例如係由石英等具有透光性之材料形成。又，平台31於正面載置透明基板12之緣部12a，並且與壓接頭33相面對，於背面配置有紫外線照射器35。
壓接頭33按壓液晶驅動用IC18，該液晶驅動用IC18經由異 向性導電膜1而搭載於透明基板12，藉由被未圖示之頭部移動機構保持，而自由地接近、遠離平台31。
紫外線照射器35藉由自平台31之背面側對設置於透明基板12之端子部17a的異向性導電膜1照射紫外光，而使光吸收劑發熱，並且於藉由透明電極17之端子部17a與液晶驅動用IC18之電極端子19而夾持導電性粒子4之狀態下使黏合劑樹脂硬化，而將液晶驅動用IC18與透明基板12之端子部17a導通連接。
紫外線照射器35可使用在光聚合起始劑之吸收峰波長區域具有最大發光波長之紫外線燈。又，紫外線照射器35可使用具有於光聚合起始劑之吸收峰波長區域及光吸收劑之吸收峰波長區域具有波峰之分光分佈的水銀燈，或遍及含有光聚合起始劑及光吸收劑之兩吸收峰波長的波長區域照射紫外線之金屬鹵素燈等。又，紫外線照射器35亦可併用於光聚合起始劑之吸收峰波長區域具有波峰的LED燈與於光吸收劑之吸收峰波長區域具有波峰的LED燈。
[連接步驟]
繼而，對使用上述連接裝置30之液晶驅動用IC18的連接步驟進行說明。首先，將透明基板12載置於暫貼用之平台上，將異向性導電膜1預壓接於透明電極17上。預壓接異向性導電膜1之方法如下：於透明基板12之透明電極17上，以使黏合劑樹脂層3成為透明電極17側之方式，配置異向性導電膜1。
然後，於將黏合劑樹脂層3配置於透明電極17上後，自剝離膜2側藉由暫貼用之熱壓頭對黏合劑樹脂層3進行加熱及加壓，自黏合 劑樹脂層3將剝離膜2剝離，藉此僅將黏合劑樹脂層3暫貼於透明電極17上。利用暫貼用之熱壓頭的預壓接一面以微小之壓力(例如0.1MPa~2MPa左右)將剝離膜2之上表面按壓於透明電極17側，一面進行加熱(例如70~100℃左右)。
繼而，以將透明基板12載置於平台31上，經由黏合劑樹脂層3而使透明基板12之透明電極17與液晶驅動用IC18之電極端子19對向的方式，配置液晶驅動用IC18。
繼而，自平台31之背面側藉由紫外線照射器35而照射特定之紫外光，並且藉由壓接頭33，以特定之壓力按壓液晶驅動用IC18之上表面。紫外光透過平台31、透明基板12入射至黏合劑樹脂層3，而被光聚合起始劑及光吸收劑吸收。光聚合起始劑藉由吸收紫外光而產生酸或自由基，藉此進行黏合劑樹脂之硬化反應。又，光吸收劑藉由吸收紫外光而以特定溫度發熱(例如80~90℃)，使黏合劑樹脂熔融。
即，於本連接步驟中，藉由光吸收劑之發熱使黏合劑樹脂熔融，並於該狀態下，藉由壓接頭33進行按壓，藉此可使黏合劑樹脂自透明電極17之端子部17a與液晶驅動用IC18之電極端子19之間流出，並且充分地壓入導電性粒子4。並且，於在透明電極17之端子部17a與液晶驅動用IC18之電極端子19之間夾持有導電性粒子4的狀態下使黏合劑樹脂進行硬化。因此，於本連接步驟中，藉由在室溫下按壓液晶驅動用IC18，可一面抑制翹曲之影響或對液晶驅動用IC18等電子零件的熱衝擊之影響，一面製造與液晶驅動用IC18之電導通性及機械連接性良好的連接體。
此時，如上所述，異向性導電膜1使用光吸收劑之光吸收峰 波長較光聚合起始劑之光吸收峰波長大20nm以上者作為光聚合起始劑及光吸收劑。藉此，不會相互阻礙光聚合起始劑與光吸收劑之各紫外線吸收，可分別進行黏合劑樹脂之硬化反應的進行，及利用發熱之黏合劑樹脂之熔融。
又，光吸收劑之發熱由於相等地傳導至透明基板12與液晶驅動用IC18，故與藉由壓接頭33進行加熱之情形不同，亦不會於透明基板12與液晶驅動用IC18之間產生熱梯度，大幅改善由加熱溫度差所引起之翹曲的產生、伴隨翹曲之顯示不均或電子零件之連接不良等問題。
再者，利用紫外線照射器35之照射時間或照度、總照射量，根據黏合劑樹脂之組成或利用壓接頭33之壓力及時間，適當設定謀求由黏合劑樹脂之硬化反應的進行與利用壓接頭33之壓入所產生的連接可靠性、接著強度之提高的條件。
其後，連接裝置30藉由使壓接頭33向平台31之上方移動，而結束液晶驅動用IC18之正式壓接步驟。
於將液晶驅動用IC18連接至透明基板12之透明電極17上後，以相同之方式進行將可撓性基板21安裝於透明基板12的透明電極17上之所謂FOG(film on glass)安裝。此時亦可藉由同樣地使用異向性導電膜1，吸收來自紫外線照射器35之紫外光，而藉由光吸收劑之發熱進行黏合劑樹脂之熔融及因酸或自由基之產生所引起的硬化反應。
藉此，可製造經由異向性導電膜1而將透明基板12與液晶驅動用IC18或可撓性基板21連接之連接體。再者，該等COG安裝與FOG安裝亦可同時進行。
以上，以直接將液晶驅動用IC安裝於液晶顯示面板之玻璃基板上的COG安裝及直接將可撓性基板安裝於液晶顯示面板之基板上的FOG安裝為例進行了說明，但本技術只要為使用光硬化型之接著劑的連接體之製造步驟，則亦可應用於在透明基板上安裝電子零件以外之各種連接。
[其他]
又，本發明除使用上述紫外線硬化型之導電性接著劑以外，例如亦可使用藉由紅外光等其他波長之光線進行硬化的光硬化型之導電性接著劑。
上述中，對作為導電性之接著劑的具有膜形狀之異向性導電膜1進行了說明，但即便為糊狀亦並無問題。又，黏合劑樹脂層3亦可為如下構成：由不含導電性粒子4之黏合劑樹脂構成的絕緣性接著劑層與由含有導電性粒子4之黏合劑樹脂構成的導電性接著劑層積層而成。於該情形時，較佳於絕緣性接著劑層及導電性接著劑層中，分別含有吸收峰波長錯開之光吸收劑及光聚合起始劑。
又，本發明亦可用於連接步驟，該連接步驟利用由不含導電性粒子4之黏合劑樹脂層構成的絕緣性接著膜及使用不含導電性粒子4之糊狀的黏合劑樹脂之絕緣性接著膏。本發明之接著劑只要為含有光聚合起始劑及光吸收劑之電路連接用接著劑，則不限制導電性粒子4之有無，或膜或糊等形態。
再者，於本連接步驟中，亦可於平台31設置加熱器等加熱機構，而於由光吸收劑所產生之發熱溫度以下的溫度對透明基板12進行加熱。又，於本連接步驟中，亦可藉由壓接頭33，於由光吸收劑所產生之發熱溫度以下的溫度對液晶驅動用IC18進行加熱。藉此，可與光吸收劑之發 熱相輔相成而使黏合劑樹脂層3充分地熔融，並於端子部17a與電極端子19確實地壓入導電性粒子4，提高連接性。
[實施例]
繼而，對本技術之實施例進行說明。本實施例對變更異向性導電膜之組成及硬化條件而製造的透明基板與IC晶片之連接體樣品，根據導通電阻值(Ω)及翹曲量對IC晶片與透明基板之連接狀態進行評價。
作為連接中所使用之接著劑，準備由含有光陽離子聚合起始劑與陽離子聚合性化合物之黏合劑樹脂層構成的異向性導電膜。
使用外形為1.8mm×34mm、厚度0.5mm形成有導通測量用配線之評價用IC作為評價元件。
使用厚度0.5mm之塗佈有ITO的玻璃作為連接評價用IC之評價基材。
於該玻璃基板經由異向性導電膜而配置評價用IC，藉由壓接工具(10.0mm×40.0mm)進行加壓，並且藉由紫外線照射進行連接，藉此形成連接體樣品。壓接工具於加壓面實施有厚度0.05mm之氟樹脂加工。又，紫外線照射器(SP-9：牛尾電機股份有限公司製造)之照度於365nm為300mW/cm2，於310nm為210mW/cm2，紫外線之照射大小設為寬度約4.0mm×長度約44.0mm。
[實施例1]
於實施例1中，作為異向性導電膜之黏合劑樹脂層，製作混合有：苯氧基樹脂(YP-70：新日鐵住金化學股份有限公司製造)；20質量份
液狀環氧樹脂(EP828：三菱化學股份有限公司製造)；30質量份
固態環氧樹脂(YD014：新日鐵住金化學股份有限公司製造)；20質量份
導電性粒子(AUL704：積水化學工業股份有限公司製造)；30質量份
光陽離子聚合起始劑(SP-170：ADEKA股份有限公司製造)；5質量份
光吸收劑(LA-36：ADEKA股份有限公司製造)；5質量份
之樹脂溶液，使用將該樹脂溶液塗佈於PET膜上並使之乾燥，成形為厚度20μm之膜狀者。
光陽離子聚合起始劑(SP-170)之吸收峰波長約為310nm，光吸收劑(LA-36)之吸收峰波長約為340nm，其差為30nm。
壓接工具之按壓條件係於室溫下為70MPa、5秒。紫外線照射器之照射時間為5秒。
[實施例2]
於實施例2中，使用除於黏合劑樹脂層中摻合光吸收劑(LA-31：ADEKA股份有限公司製造)5質量份以外，與實施例1為相同之組成的異向性導電膜。
光陽離子聚合起始劑(SP-170)之吸收峰波長約為310nm，光吸收劑(LA-31)之吸收峰波長為345nm，其差為35nm。
壓接工具之按壓條件及紫外線照射器之照射時間與實施例1相同。
[實施例3]
於實施例3中，使用除於黏合劑樹脂層中摻合光自由基聚合起始劑(OXE1：BASF公司製造)5質量份作為光吸收劑以外，與實施例1為相同 之組成的異向性導電膜。
光陽離子聚合起始劑(SP-170)之吸收峰波長約為310nm，光吸收劑(OXE01)之吸收峰為330nm，其差為20nm。
壓接工具之按壓條件及紫外線照射器之照射時間與實施例1相同。
[比較例1]
於比較例1中，使用除於黏合劑樹脂層中未摻合光吸收劑以外，與實施例1為相同之組成的異向性導電膜。
壓接工具之按壓條件及紫外線照射器之照射時間與實施例1相同。
[比較例2]
於比較例2中，使用除於黏合劑樹脂層中摻合光吸收劑(LA-46：ADEKA股份有限公司製造)5質量份以外，與實施例1為相同之組成的異向性導電膜。
光陽離子聚合起始劑(SP-170)之吸收峰波長約為310nm，光吸收劑(LA-46)之吸收峰波長約為290nm，光吸收劑之光吸收峰波長小於光聚合起始劑之光吸收峰波長，其差為20nm。
壓接工具之按壓條件及紫外線照射器之照射時間與實施例1相同。
[比較例3]
於比較例3中，將壓接工具之按壓條件設為100℃、70MPa、5秒，除此以外，設為與比較例1相同之條件。
[翹曲之測量]
翹曲之測量方法使用觸針式表面粗度計(SE-3H：小阪研究所股份有限公司製造)，如圖5所示，自接合體樣品之玻璃基板40下表面用觸針41進行掃描，測量評價用IC之連接後的玻璃基板面之翹曲量(μm)。
[導通電阻之測量]
對實施例1、2、比較例1~3之連接體，使用數位萬用表，測量連接初期及可靠性試驗後之導通電阻(Ω)。導通電阻值之測量如圖6所示，將數位萬用表連接至與評價用IC之凸塊42連接之塗佈有ITO的玻璃之配線43，而藉由所謂四端子法測量流通電流2mA時之導通電阻值。可靠性試驗之條件設為85℃85%RH500hr。
如表1所示，於實施例1~3中，雖為與比較例1同等之翹曲量，但含有光吸收劑之實施例1~3與比較例1相比，初始連接電阻及可靠性試驗後之連接電阻均較低，顯示出良好之連接性。其原因在於，實施 例1~3中於黏合劑樹脂層因光吸收劑之發熱而熔融的狀態下進行按壓，故可藉由排除黏合劑樹脂而充分地壓入導電性粒子，於該狀態下成功使之硬化。另一方面，於比較例1中，係於室溫下進行壓接，故未自電極端子間排除黏合劑樹脂，無法充分地壓入導電性粒子。因此，與實施例1及2相比，於連接初期導通電阻增高，於可靠性試驗後，導通電阻進一步上升。
於比較例2中，光吸收劑與光陽離子聚合起始劑的各吸收峰波長之差為20nm，但由於光吸收劑之光吸收峰波長小於光聚合起始劑之光吸收峰波長，故吸收波長於廣範圍內重疊，利用光陽離子聚合起始劑之紫外光的吸收被光吸收劑所阻礙，硬化反應之進行變得不充分。因此，雖然翹曲量大幅減少，但初始連接電阻高，於可靠性試驗後，導通電阻大幅上升。
於比較例3中，一面藉由壓接工具對評價用IC進行加熱按壓，一面照射紫外線。因此，由壓接工具所產生之熱偏向地傳導至評價用IC，若於壓接工具離開後急遽地冷卻，則評價用IC側之變形大於玻璃基板。並且，於比較例3中，藉由黏合劑樹脂層亦無法完全吸收該變形量之差，翹曲量增大。
另一方面，於實施例1~3中，藉由使光吸收劑吸收紫外線，而使黏合劑樹脂層發熱，故對評價用IC與玻璃基板施加大致相同之熱量。因此，評價用IC與玻璃基板之變形量大致相同，可藉由黏合劑樹脂層吸收變形量之差，故可相對減小翹曲量。
若對實施例1與實施例2進行比較，則實施例2相較於實施例1可謀求低電阻化。其原因在於，於實施例2中，光吸收劑之吸光度高， 釋出高於實施例1之反應熱，故更顯著地進行黏合劑樹脂層之熔融。藉此，於實施例2中，導電性粒子容易壓碎，相較於實施例1可謀求低電阻化。
又，於實施例3中，使用光自由基聚合起始劑作為光吸收劑，但由於其係自由基系之起始劑，故即便開環亦不會導致聚合，而僅產生熱。因此，藉由利用此時之熱使黏合劑樹脂層熔融，可充分地壓入導電性粒子，於該狀態下藉由光硬化劑進行硬化，藉此可進行良好之連接。

Claims (13)

  1. 一種光硬化系異向性導電接著劑，含有：光聚合性化合物、光聚合起始劑、及光吸收劑，該光吸收劑之光吸收峰波長大於該光聚合起始劑之光吸收峰波長，且差20nm以上。
  2. 如申請專利範圍第1項之光硬化系異向性導電接著劑，其中，該光吸收劑為紫外線吸收劑或自由基聚合起始劑。
  3. 如申請專利範圍第1或2項之光硬化系異向性導電接著劑，其中，該光聚合起始劑為光陽離子聚合起始劑。
  4. 如申請專利範圍第1或2項之光硬化系異向性導電接著劑，其中，該光聚合起始劑為光自由基聚合起始劑，該光吸收劑為紫外線吸收劑。
  5. 如申請專利範圍第1或2項之光硬化系異向性導電接著劑，其中，該光聚合起始劑之光吸收峰波長為290nm~330nm，該光吸收劑之光吸收峰波長為320nm~360nm。
  6. 如申請專利範圍第1或2項之光硬化系異向性導電接著劑，其係由剝離基材支持，形成為膜狀。
  7. 如申請專利範圍第1或2項之光硬化系異向性導電接著劑，其中，該光吸收劑為苯并三唑系之紫外線吸收劑及三
    Figure TWI673570B_C0001
    系之紫外線吸收劑之至少一種。
  8. 一種連接體之製造方法，在載置於平台上之透明基板上經由光硬化系異向性導電接著劑而配置電子零件，一面藉由壓接工具將該電子零件按壓至該透明基板，一面利用光照射器進行光照射，該光硬化系異向性導電接著劑含有光聚合性化合物、光聚合起始劑及光吸收劑，該光吸收劑之光吸收峰波長大於該光聚合起始劑之光吸收峰波長，且差20nm以上，該光照射器照射含有該光聚合起始劑之光吸收峰及該光吸收劑之光吸收峰的波長之光。
  9. 如申請專利範圍第8項之連接體之製造方法，其於室溫下，一面藉由壓接工具將該電子零件按壓向該透明基板，一面利用光照射器進行光照射。
  10. 如申請專利範圍第8項之連接體之製造方法，其中該平台及/或該壓接工具於藉由該光吸收劑吸收自該光照射器照射之光而發熱之溫度以下的溫度進行加熱。
  11. 如申請專利範圍第8項之連接體之製造方法，其中，該光吸收劑為苯并三唑系之紫外線吸收劑及三
    Figure TWI673570B_C0002
    系之紫外線吸收劑之至少一種。
  12. 一種電子零件之連接方法，在載置於平台上之透明基板上經由光硬化系異向性導電接著劑而配置電子零件，一面藉由壓接工具將該電子零件按壓於該透明基板，一面利用光照射器進行光照射者，該光硬化系異向性導電接著劑含有光聚合性化合物、光聚合起始劑及光吸收劑，該光吸收劑之光吸收峰波長大於該光聚合起始劑之光吸收峰波長，且差20nm以上，該光照射器照射含有該光聚合起始劑之光吸收峰及該光吸收劑之光吸收峰的波長之光。
  13. 如申請專利範圍第12項之電子零件之連接方法，其中，該光吸收劑為苯并三唑系之紫外線吸收劑及三
    Figure TWI673570B_C0003
    系之紫外線吸收劑之至少一種。
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