TWI673505B - 搬送方法及檢查系統 - Google Patents

搬送方法及檢查系統 Download PDF

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Publication number
TWI673505B
TWI673505B TW104131263A TW104131263A TWI673505B TW I673505 B TWI673505 B TW I673505B TW 104131263 A TW104131263 A TW 104131263A TW 104131263 A TW104131263 A TW 104131263A TW I673505 B TWI673505 B TW I673505B
Authority
TW
Taiwan
Prior art keywords
inspection
transfer arm
transfer
substrate
unit
Prior art date
Application number
TW104131263A
Other languages
English (en)
Chinese (zh)
Other versions
TW201625970A (zh
Inventor
Hiroki Hosaka
保坂広樹
Masahiko Akiyama
秋山雅彦
Original Assignee
Tokyo Electron Limited
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited, 日商東京威力科創股份有限公司 filed Critical Tokyo Electron Limited
Publication of TW201625970A publication Critical patent/TW201625970A/zh
Application granted granted Critical
Publication of TWI673505B publication Critical patent/TWI673505B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
TW104131263A 2014-09-29 2015-09-22 搬送方法及檢查系統 TWI673505B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-198444 2014-09-29
JP2014198444A JP6400412B2 (ja) 2014-09-29 2014-09-29 搬送方法及び検査システム

Publications (2)

Publication Number Publication Date
TW201625970A TW201625970A (zh) 2016-07-16
TWI673505B true TWI673505B (zh) 2019-10-01

Family

ID=55584124

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104131263A TWI673505B (zh) 2014-09-29 2015-09-22 搬送方法及檢查系統

Country Status (5)

Country Link
US (1) US10006961B2 (enExample)
JP (1) JP6400412B2 (enExample)
KR (1) KR101813326B1 (enExample)
CN (1) CN105470182B (enExample)
TW (1) TWI673505B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6615698B2 (ja) * 2016-06-20 2019-12-04 東京エレクトロン株式会社 搬送装置および搬送方法、ならびに検査システム
JP6655516B2 (ja) * 2016-09-23 2020-02-26 東京エレクトロン株式会社 基板検査装置
WO2019012978A1 (ja) * 2017-07-10 2019-01-17 東京エレクトロン株式会社 基板搬送装置および基板搬送方法
JP6813816B2 (ja) * 2018-04-05 2021-01-13 東京エレクトロン株式会社 接合システムおよび接合方法
JP7349240B2 (ja) * 2018-10-05 2023-09-22 東京エレクトロン株式会社 基板倉庫及び基板検査方法
JP7390934B2 (ja) * 2020-03-03 2023-12-04 東京エレクトロン株式会社 検査装置
CN114073832B (zh) * 2020-08-17 2023-02-03 锥能机器人嘉兴有限公司 封锁装置
JP7861667B2 (ja) * 2023-03-08 2026-05-19 株式会社村田製作所 検査装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030112002A1 (en) * 2001-12-13 2003-06-19 Koji Kawaguchi Probe system
TW200915469A (en) * 2007-07-26 2009-04-01 Tokyo Electron Ltd Substrate transfer module and substrate processing system
TW201415050A (zh) * 2012-06-06 2014-04-16 東京威力科創股份有限公司 晶圓檢查用介面及晶圓檢查裝置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07254635A (ja) * 1994-03-15 1995-10-03 Hitachi Ltd 半導体製造装置
JP4832151B2 (ja) * 2006-04-25 2011-12-07 株式会社東京精密 プローブカード受け渡し方法、プローバ及びプローブカード供給・回収システム
JP4789821B2 (ja) * 2007-02-05 2011-10-12 東京エレクトロン株式会社 基板処理装置の検査方法
JP4767896B2 (ja) * 2007-03-29 2011-09-07 東京エレクトロン株式会社 被検査体の搬送装置及び検査装置
JP2015115517A (ja) * 2013-12-13 2015-06-22 シンフォニアテクノロジー株式会社 基板搬送装置及びｅｆｅｍ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030112002A1 (en) * 2001-12-13 2003-06-19 Koji Kawaguchi Probe system
TW200915469A (en) * 2007-07-26 2009-04-01 Tokyo Electron Ltd Substrate transfer module and substrate processing system
TW201415050A (zh) * 2012-06-06 2014-04-16 東京威力科創股份有限公司 晶圓檢查用介面及晶圓檢查裝置

Also Published As

Publication number Publication date
TW201625970A (zh) 2016-07-16
US10006961B2 (en) 2018-06-26
KR101813326B1 (ko) 2017-12-28
CN105470182A (zh) 2016-04-06
JP6400412B2 (ja) 2018-10-03
US20160091562A1 (en) 2016-03-31
CN105470182B (zh) 2018-07-27
JP2016072356A (ja) 2016-05-09
KR20160037773A (ko) 2016-04-06

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