KR101813326B1 - 반송 방법 및 검사 시스템 - Google Patents

반송 방법 및 검사 시스템 Download PDF

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Publication number
KR101813326B1
KR101813326B1 KR1020150134412A KR20150134412A KR101813326B1 KR 101813326 B1 KR101813326 B1 KR 101813326B1 KR 1020150134412 A KR1020150134412 A KR 1020150134412A KR 20150134412 A KR20150134412 A KR 20150134412A KR 101813326 B1 KR101813326 B1 KR 101813326B1
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South Korea
Prior art keywords
inspection
arm
substrate
gas
unit
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English (en)
Korean (ko)
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KR20160037773A (ko
Inventor
히로키 호사카
마사히코 아키야마
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도쿄엘렉트론가부시키가이샤
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Publication of KR20160037773A publication Critical patent/KR20160037773A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Robotics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020150134412A 2014-09-29 2015-09-23 반송 방법 및 검사 시스템 Active KR101813326B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-198444 2014-09-29
JP2014198444A JP6400412B2 (ja) 2014-09-29 2014-09-29 搬送方法及び検査システム

Publications (2)

Publication Number Publication Date
KR20160037773A KR20160037773A (ko) 2016-04-06
KR101813326B1 true KR101813326B1 (ko) 2017-12-28

Family

ID=55584124

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150134412A Active KR101813326B1 (ko) 2014-09-29 2015-09-23 반송 방법 및 검사 시스템

Country Status (5)

Country Link
US (1) US10006961B2 (enExample)
JP (1) JP6400412B2 (enExample)
KR (1) KR101813326B1 (enExample)
CN (1) CN105470182B (enExample)
TW (1) TWI673505B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6615698B2 (ja) * 2016-06-20 2019-12-04 東京エレクトロン株式会社 搬送装置および搬送方法、ならびに検査システム
JP6655516B2 (ja) * 2016-09-23 2020-02-26 東京エレクトロン株式会社 基板検査装置
US11097907B2 (en) * 2017-07-10 2021-08-24 Tokyo Electron Limited Substrate transfer device and substrate transfer method
JP6813816B2 (ja) * 2018-04-05 2021-01-13 東京エレクトロン株式会社 接合システムおよび接合方法
JP7349240B2 (ja) * 2018-10-05 2023-09-22 東京エレクトロン株式会社 基板倉庫及び基板検査方法
JP7390934B2 (ja) * 2020-03-03 2023-12-04 東京エレクトロン株式会社 検査装置
CN114073832B (zh) * 2020-08-17 2023-02-03 锥能机器人嘉兴有限公司 封锁装置
JP2024126928A (ja) * 2023-03-08 2024-09-20 株式会社村田製作所 検査装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4789821B2 (ja) * 2007-02-05 2011-10-12 東京エレクトロン株式会社 基板処理装置の検査方法
JP2013254812A (ja) 2012-06-06 2013-12-19 Tokyo Electron Ltd ウエハ検査用インターフェース及びウエハ検査装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07254635A (ja) * 1994-03-15 1995-10-03 Hitachi Ltd 半導体製造装置
JP3783075B2 (ja) * 2001-12-13 2006-06-07 東京エレクトロン株式会社 プローブ装置及びローダ装置
JP4832151B2 (ja) * 2006-04-25 2011-12-07 株式会社東京精密 プローブカード受け渡し方法、プローバ及びプローブカード供給・回収システム
JP4767896B2 (ja) * 2007-03-29 2011-09-07 東京エレクトロン株式会社 被検査体の搬送装置及び検査装置
JP4959457B2 (ja) * 2007-07-26 2012-06-20 東京エレクトロン株式会社 基板搬送モジュール及び基板処理システム
JP2015115517A (ja) * 2013-12-13 2015-06-22 シンフォニアテクノロジー株式会社 基板搬送装置及びｅｆｅｍ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4789821B2 (ja) * 2007-02-05 2011-10-12 東京エレクトロン株式会社 基板処理装置の検査方法
JP2013254812A (ja) 2012-06-06 2013-12-19 Tokyo Electron Ltd ウエハ検査用インターフェース及びウエハ検査装置

Also Published As

Publication number Publication date
TW201625970A (zh) 2016-07-16
US10006961B2 (en) 2018-06-26
JP2016072356A (ja) 2016-05-09
TWI673505B (zh) 2019-10-01
US20160091562A1 (en) 2016-03-31
JP6400412B2 (ja) 2018-10-03
CN105470182A (zh) 2016-04-06
KR20160037773A (ko) 2016-04-06
CN105470182B (zh) 2018-07-27

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