TWI671157B - 切斷裝置 - Google Patents

切斷裝置 Download PDF

Info

Publication number
TWI671157B
TWI671157B TW106139040A TW106139040A TWI671157B TW I671157 B TWI671157 B TW I671157B TW 106139040 A TW106139040 A TW 106139040A TW 106139040 A TW106139040 A TW 106139040A TW I671157 B TWI671157 B TW I671157B
Authority
TW
Taiwan
Prior art keywords
cutting
cleaning
drying
cut
substrate
Prior art date
Application number
TW106139040A
Other languages
English (en)
Chinese (zh)
Other versions
TW201822942A (zh
Inventor
山本裕子
東秀和
宇澤秀俊
Original Assignee
東和股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東和股份有限公司 filed Critical 東和股份有限公司
Publication of TW201822942A publication Critical patent/TW201822942A/zh
Application granted granted Critical
Publication of TWI671157B publication Critical patent/TWI671157B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Dicing (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning In General (AREA)
TW106139040A 2016-12-19 2017-11-10 切斷裝置 TWI671157B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-245013 2016-12-19
JP2016245013A JP6612206B2 (ja) 2016-12-19 2016-12-19 切断装置

Publications (2)

Publication Number Publication Date
TW201822942A TW201822942A (zh) 2018-07-01
TWI671157B true TWI671157B (zh) 2019-09-11

Family

ID=62603344

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106139040A TWI671157B (zh) 2016-12-19 2017-11-10 切斷裝置

Country Status (4)

Country Link
JP (1) JP6612206B2 (ko)
KR (1) KR102120533B1 (ko)
CN (1) CN108206147A (ko)
TW (1) TWI671157B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7308621B2 (ja) * 2019-02-19 2023-07-14 株式会社ディスコ 搬送装置
JP7394712B2 (ja) * 2020-06-24 2023-12-08 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
JP2023010304A (ja) * 2021-07-09 2023-01-20 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法
JP2023013000A (ja) * 2021-07-15 2023-01-26 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法
JP2023023057A (ja) * 2021-08-04 2023-02-16 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW434671B (en) * 1997-04-02 2001-05-16 Tokyo Electron Ltd Cleaning and dry apparatus, wafer processing system and wafer processing method
CN101632163A (zh) * 2006-12-21 2010-01-20 朗姆研究公司 用于湿法清洗设备的混合复合材料晶片托架
TW201526189A (zh) * 2013-09-20 2015-07-01 Towa Corp 切斷裝置及切斷方法
TW201622882A (zh) * 2012-09-08 2016-07-01 西凱渥資訊處理科技公司 於射頻模組製造期間關於切除及清潔的系統及方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0737858A (ja) * 1993-07-19 1995-02-07 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH1197407A (ja) * 1997-09-16 1999-04-09 Dainippon Screen Mfg Co Ltd 基板乾燥装置
JP3745903B2 (ja) * 1998-08-13 2006-02-15 大日本スクリーン製造株式会社 基板処理装置
US20070251548A1 (en) * 2006-04-11 2007-11-01 Toppoly Optoelectronics Corp. Conveyor type wet-processing apparatus and treatment of substrate
JP5156459B2 (ja) * 2008-04-09 2013-03-06 Ｔｏｗａ株式会社 基板の切断方法及び装置
JP5399690B2 (ja) * 2008-11-28 2014-01-29 アピックヤマダ株式会社 切断装置
KR101097932B1 (ko) * 2009-12-03 2011-12-23 세메스 주식회사 약액 분사 장치 및 그것을 구비한 기판 처리 장치
JP2013080811A (ja) * 2011-10-04 2013-05-02 Disco Abrasive Syst Ltd 切削装置
CN104538332B (zh) * 2014-12-12 2017-06-27 深圳市华星光电技术有限公司 一种湿制程机台的腔室结构
CN205248239U (zh) * 2015-11-19 2016-05-18 江苏润丽光能科技发展有限公司 一种新型多晶硅片清洗机

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW434671B (en) * 1997-04-02 2001-05-16 Tokyo Electron Ltd Cleaning and dry apparatus, wafer processing system and wafer processing method
CN101632163A (zh) * 2006-12-21 2010-01-20 朗姆研究公司 用于湿法清洗设备的混合复合材料晶片托架
TW201622882A (zh) * 2012-09-08 2016-07-01 西凱渥資訊處理科技公司 於射頻模組製造期間關於切除及清潔的系統及方法
TW201526189A (zh) * 2013-09-20 2015-07-01 Towa Corp 切斷裝置及切斷方法

Also Published As

Publication number Publication date
KR102120533B1 (ko) 2020-06-08
JP2018101649A (ja) 2018-06-28
JP6612206B2 (ja) 2019-11-27
TW201822942A (zh) 2018-07-01
KR20180071157A (ko) 2018-06-27
CN108206147A (zh) 2018-06-26

Similar Documents

Publication Publication Date Title
TWI671157B (zh) 切斷裝置
KR102103356B1 (ko) 기판 세정 장치
TWI740094B (zh) 加工裝置、及製品的製造方法
KR101793337B1 (ko) 절단 장치 및 절단 방법
KR101733290B1 (ko) 절단 장치 및 절단 방법
JP2009218397A (ja) 基板の切断方法及び装置
TWI697042B (zh) 切斷裝置以及半導體封裝的搬送方法
JP2016134433A (ja) ダイシング装置
CN101447415A (zh) 半导体硅片清洗装置及其清洗方法
KR20070074426A (ko) 반도체 제조공정용 클리닝장치
JP2003163180A (ja) ワーク搬送装置及びダイシング装置
KR101643502B1 (ko) 절단 장치 및 절단 방법
JP7154195B2 (ja) 切断装置及び切断品の製造方法
JP6847525B2 (ja) 切削装置
JP2012004225A (ja) 被切断基板の治具及び製品基板の製造方法
TW202223982A (zh) 清洗單元、焊接模組以及焊接設備
KR20150076752A (ko) 반도체 패키지 건조 장치
KR20030003946A (ko) 반도체 패키지의 이물질 제거를 위한 에어 블로우 시스템
KR102300625B1 (ko) 반도체 패키지 건조 장치
JP2013506311A (ja) ピックアンドプレースマシン用プレースステーション
WO2024029244A1 (ja) 充填剤塗布装置
KR20230020758A (ko) 반도체 패키지 칩 스팀 세정장치
KR20240105091A (ko) 세정 조립체 및 이를 포함하는 기판 처리 장치
JP2003243333A (ja) スプレーチップ及び洗浄装置
KR20090009977U (ko) 반도체 패키지 제조용 세정 장치