TWI670141B - 滾筒構件、以及基板洗淨方法 - Google Patents

滾筒構件、以及基板洗淨方法 Download PDF

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Publication number
TWI670141B
TWI670141B TW104131754A TW104131754A TWI670141B TW I670141 B TWI670141 B TW I670141B TW 104131754 A TW104131754 A TW 104131754A TW 104131754 A TW104131754 A TW 104131754A TW I670141 B TWI670141 B TW I670141B
Authority
TW
Taiwan
Prior art keywords
substrate
cleaning
roller member
protrusion
pencil
Prior art date
Application number
TW104131754A
Other languages
English (en)
Chinese (zh)
Other versions
TW201615340A (zh
Inventor
Tomoatsu Ishibashi
石橋知淳
Original Assignee
Ebara Corporation
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corporation, 日商荏原製作所股份有限公司 filed Critical Ebara Corporation
Publication of TW201615340A publication Critical patent/TW201615340A/zh
Application granted granted Critical
Publication of TWI670141B publication Critical patent/TWI670141B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW104131754A 2014-10-31 2015-09-25 滾筒構件、以及基板洗淨方法 TWI670141B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-223754 2014-10-31
JP2014223754A JP6316730B2 (ja) 2014-10-31 2014-10-31 ロール部材、ペンシル部材、及びそれらの少なくともいずれか一方を含む基板処理装置

Publications (2)

Publication Number Publication Date
TW201615340A TW201615340A (zh) 2016-05-01
TWI670141B true TWI670141B (zh) 2019-09-01

Family

ID=55853472

Family Applications (2)

Application Number Title Priority Date Filing Date
TW104131754A TWI670141B (zh) 2014-10-31 2015-09-25 滾筒構件、以及基板洗淨方法
TW107140682A TWI678260B (zh) 2014-10-31 2015-09-25 滾筒構件、鉛筆構件、以及包含前述二者至少任一方之基板處理裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW107140682A TWI678260B (zh) 2014-10-31 2015-09-25 滾筒構件、鉛筆構件、以及包含前述二者至少任一方之基板處理裝置

Country Status (7)

Country Link
US (2) US10471481B2 (https=)
JP (1) JP6316730B2 (https=)
KR (1) KR102443489B1 (https=)
CN (2) CN113276024B (https=)
MY (1) MY178652A (https=)
SG (1) SG10201508996WA (https=)
TW (2) TWI670141B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6956578B2 (ja) * 2017-09-19 2021-11-02 株式会社荏原製作所 ブレークイン装置及びブレークインシステム
JP7224128B2 (ja) * 2018-08-09 2023-02-17 株式会社荏原製作所 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法
JP7536039B2 (ja) * 2019-12-13 2024-08-19 株式会社荏原製作所 基板洗浄装置、研磨装置、バフ処理装置、基板洗浄方法、基板処理装置、および機械学習器
CN112420574B (zh) * 2020-11-25 2024-02-02 杭州众硅电子科技有限公司 一种可隔离防护晶圆的晶圆处理装置
JP7564693B2 (ja) * 2020-11-26 2024-10-09 株式会社Ｓｃｒｅｅｎホールディングス 下面ブラシ、ブラシユニットおよび基板洗浄装置
JP7672908B2 (ja) * 2021-07-28 2025-05-08 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
US20230178360A1 (en) * 2021-12-06 2023-06-08 Tung An Development Ltd. Device Having Cleaning Bodies
KR20250120334A (ko) * 2022-12-07 2025-08-08 티씨엔브이, 엘엘씨 원통형 브러시 및 그 제조 방법

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TW200704479A (en) * 2005-05-26 2007-02-01 Nitto Denko Corp Cleaning sheet and cleaning method using same

Also Published As

Publication number Publication date
JP2016092158A (ja) 2016-05-23
US20200030855A1 (en) 2020-01-30
SG10201508996WA (en) 2016-05-30
KR102443489B1 (ko) 2022-09-15
US11642704B2 (en) 2023-05-09
CN105575851A (zh) 2016-05-11
TW201615340A (zh) 2016-05-01
KR20160052343A (ko) 2016-05-12
US20160126113A1 (en) 2016-05-05
CN105575851B (zh) 2021-08-27
TW201906689A (zh) 2019-02-16
MY178652A (en) 2020-10-20
TWI678260B (zh) 2019-12-01
CN113276024B (zh) 2023-08-29
CN113276024A (zh) 2021-08-20
JP6316730B2 (ja) 2018-04-25
US10471481B2 (en) 2019-11-12

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