CN113276024B - 笔部件以及基板处理装置 - Google Patents

笔部件以及基板处理装置 Download PDF

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Publication number
CN113276024B
CN113276024B CN202110546709.1A CN202110546709A CN113276024B CN 113276024 B CN113276024 B CN 113276024B CN 202110546709 A CN202110546709 A CN 202110546709A CN 113276024 B CN113276024 B CN 113276024B
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China
Prior art keywords
substrate
cleaning
pen
slit
slits
Prior art date
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CN202110546709.1A
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English (en)
Chinese (zh)
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CN113276024A (zh
Inventor
石桥知淳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Publication date
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Priority to CN202110546709.1A priority Critical patent/CN113276024B/zh
Publication of CN113276024A publication Critical patent/CN113276024A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN202110546709.1A 2014-10-31 2015-10-29 笔部件以及基板处理装置 Active CN113276024B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110546709.1A CN113276024B (zh) 2014-10-31 2015-10-29 笔部件以及基板处理装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014-223754 2014-10-31
JP2014223754A JP6316730B2 (ja) 2014-10-31 2014-10-31 ロール部材、ペンシル部材、及びそれらの少なくともいずれか一方を含む基板処理装置
CN202110546709.1A CN113276024B (zh) 2014-10-31 2015-10-29 笔部件以及基板处理装置
CN201510724374.2A CN105575851B (zh) 2014-10-31 2015-10-29 辊部件以及基板处理装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201510724374.2A Division CN105575851B (zh) 2014-10-31 2015-10-29 辊部件以及基板处理装置

Publications (2)

Publication Number Publication Date
CN113276024A CN113276024A (zh) 2021-08-20
CN113276024B true CN113276024B (zh) 2023-08-29

Family

ID=55853472

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202110546709.1A Active CN113276024B (zh) 2014-10-31 2015-10-29 笔部件以及基板处理装置
CN201510724374.2A Active CN105575851B (zh) 2014-10-31 2015-10-29 辊部件以及基板处理装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201510724374.2A Active CN105575851B (zh) 2014-10-31 2015-10-29 辊部件以及基板处理装置

Country Status (7)

Country Link
US (2) US10471481B2 (https=)
JP (1) JP6316730B2 (https=)
KR (1) KR102443489B1 (https=)
CN (2) CN113276024B (https=)
MY (1) MY178652A (https=)
SG (1) SG10201508996WA (https=)
TW (2) TWI670141B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6956578B2 (ja) * 2017-09-19 2021-11-02 株式会社荏原製作所 ブレークイン装置及びブレークインシステム
JP7224128B2 (ja) * 2018-08-09 2023-02-17 株式会社荏原製作所 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法
JP7536039B2 (ja) * 2019-12-13 2024-08-19 株式会社荏原製作所 基板洗浄装置、研磨装置、バフ処理装置、基板洗浄方法、基板処理装置、および機械学習器
CN112420574B (zh) * 2020-11-25 2024-02-02 杭州众硅电子科技有限公司 一种可隔离防护晶圆的晶圆处理装置
JP7564693B2 (ja) * 2020-11-26 2024-10-09 株式会社Ｓｃｒｅｅｎホールディングス 下面ブラシ、ブラシユニットおよび基板洗浄装置
JP7672908B2 (ja) * 2021-07-28 2025-05-08 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
US20230178360A1 (en) * 2021-12-06 2023-06-08 Tung An Development Ltd. Device Having Cleaning Bodies
KR20250120334A (ko) * 2022-12-07 2025-08-08 티씨엔브이, 엘엘씨 원통형 브러시 및 그 제조 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5846335A (en) * 1994-06-28 1998-12-08 Ebara Corporation Method for cleaning workpiece
JP2000311878A (ja) * 1999-04-27 2000-11-07 Dainippon Screen Mfg Co Ltd 基板洗浄装置
US6554010B1 (en) * 1999-07-26 2003-04-29 Tokyo Electron Limited Substrate cleaning tool, having permeable cleaning head
CN101121247A (zh) * 2006-08-11 2008-02-13 中芯国际集成电路制造(上海)有限公司 研磨头的清洗装置

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US2480023A (en) * 1948-05-28 1949-08-23 Knickerbocker Rubber Company Massage brush
US3583555A (en) * 1969-01-31 1971-06-08 George E Karsnak Cleaning apparatus for conveyor belts or the like
US4217737A (en) * 1979-04-16 1980-08-19 Merit Abrasive Products, Inc. Abrasive flap drum
JP3114156B2 (ja) * 1994-06-28 2000-12-04 株式会社荏原製作所 洗浄方法および装置
JPH08141521A (ja) 1994-11-24 1996-06-04 Sumitomo Metal Ind Ltd 洗浄装置
US5779526A (en) * 1996-02-27 1998-07-14 Gill; Gerald L. Pad conditioner
EP0837493B8 (en) * 1996-10-21 2007-11-07 Ebara Corporation Cleaning apparatus
EP0937509A4 (en) 1996-11-08 2005-01-19 Aion Co Ltd SPONGE ROLLER TO CLEAN
US6502273B1 (en) * 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
TW358764B (en) * 1997-07-07 1999-05-21 Super Silicon Crystal Res Inst A method of double-side lapping a wafer and an apparatus therefor
US6202658B1 (en) * 1998-11-11 2001-03-20 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
JP4091187B2 (ja) * 1998-12-08 2008-05-28 株式会社荏原製作所 洗浄具、基板洗浄装置及び基板洗浄方法
JP2000270929A (ja) * 1999-03-26 2000-10-03 Shibaura Mechatronics Corp 洗浄用ブラシ
US6406358B1 (en) * 1999-08-05 2002-06-18 Micron Technology, Inc. Method and apparatus for cleaning a surface of a microelectronic substrate
US6467120B1 (en) * 1999-09-08 2002-10-22 International Business Machines Corporation Wafer cleaning brush profile modification
US6367613B1 (en) * 2000-04-28 2002-04-09 Preston D. Montgomery Belt cleaning sprocket
US6904637B2 (en) * 2001-10-03 2005-06-14 Applied Materials, Inc. Scrubber with sonic nozzle
JP2004273530A (ja) * 2003-03-05 2004-09-30 Nec Kyushu Ltd 洗浄装置およびその方法
TWI286096B (en) * 2003-08-08 2007-09-01 Entegris Inc Methods and materials for making a monolithic porous pad onto a rotatable base
JP2007000860A (ja) * 2005-05-26 2007-01-11 Nitto Denko Corp 清浄用シート及びそれを用いた清浄方法
CN1872546A (zh) * 2005-05-26 2006-12-06 日东电工株式会社 清洁片及使用该清洁片的清洁方法
KR101155623B1 (ko) * 2010-01-08 2012-06-13 세메스 주식회사 기판 세정 유닛 및 이를 갖는 기판 세정 장치
US20140230170A1 (en) * 2011-09-26 2014-08-21 Entegris, Inc. Post-cmp cleaning apparatus and method
US9202723B2 (en) * 2011-11-29 2015-12-01 Illinois Tool Works, Inc. Brush with cantilevered nodules
US20130255721A1 (en) * 2012-04-03 2013-10-03 Illinois Tool Works Inc. Concave nodule sponge brush
JP6352158B2 (ja) * 2014-11-20 2018-07-04 株式会社荏原製作所 洗浄具、洗浄具の製造方法、および、基板洗浄装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5846335A (en) * 1994-06-28 1998-12-08 Ebara Corporation Method for cleaning workpiece
JP2000311878A (ja) * 1999-04-27 2000-11-07 Dainippon Screen Mfg Co Ltd 基板洗浄装置
US6554010B1 (en) * 1999-07-26 2003-04-29 Tokyo Electron Limited Substrate cleaning tool, having permeable cleaning head
CN101121247A (zh) * 2006-08-11 2008-02-13 中芯国际集成电路制造(上海)有限公司 研磨头的清洗装置

Also Published As

Publication number Publication date
JP2016092158A (ja) 2016-05-23
US20200030855A1 (en) 2020-01-30
SG10201508996WA (en) 2016-05-30
KR102443489B1 (ko) 2022-09-15
US11642704B2 (en) 2023-05-09
TWI670141B (zh) 2019-09-01
CN105575851A (zh) 2016-05-11
TW201615340A (zh) 2016-05-01
KR20160052343A (ko) 2016-05-12
US20160126113A1 (en) 2016-05-05
CN105575851B (zh) 2021-08-27
TW201906689A (zh) 2019-02-16
MY178652A (en) 2020-10-20
TWI678260B (zh) 2019-12-01
CN113276024A (zh) 2021-08-20
JP6316730B2 (ja) 2018-04-25
US10471481B2 (en) 2019-11-12

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