MY178652A - Roll-type processing member, pencil-type processing member, and substrate processing apparatus including any one of these - Google Patents

Roll-type processing member, pencil-type processing member, and substrate processing apparatus including any one of these

Info

Publication number
MY178652A
MY178652A MYPI2015002682A MYPI2015002682A MY178652A MY 178652 A MY178652 A MY 178652A MY PI2015002682 A MYPI2015002682 A MY PI2015002682A MY PI2015002682 A MYPI2015002682 A MY PI2015002682A MY 178652 A MY178652 A MY 178652A
Authority
MY
Malaysia
Prior art keywords
roll
processing member
type processing
type
pencil
Prior art date
Application number
MYPI2015002682A
Other languages
English (en)
Inventor
Ishibashi Tomoatsu
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of MY178652A publication Critical patent/MY178652A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
MYPI2015002682A 2014-10-31 2015-10-30 Roll-type processing member, pencil-type processing member, and substrate processing apparatus including any one of these MY178652A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014223754A JP6316730B2 (ja) 2014-10-31 2014-10-31 ロール部材、ペンシル部材、及びそれらの少なくともいずれか一方を含む基板処理装置

Publications (1)

Publication Number Publication Date
MY178652A true MY178652A (en) 2020-10-20

Family

ID=55853472

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015002682A MY178652A (en) 2014-10-31 2015-10-30 Roll-type processing member, pencil-type processing member, and substrate processing apparatus including any one of these

Country Status (7)

Country Link
US (2) US10471481B2 (https=)
JP (1) JP6316730B2 (https=)
KR (1) KR102443489B1 (https=)
CN (2) CN113276024B (https=)
MY (1) MY178652A (https=)
SG (1) SG10201508996WA (https=)
TW (2) TWI670141B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6956578B2 (ja) * 2017-09-19 2021-11-02 株式会社荏原製作所 ブレークイン装置及びブレークインシステム
JP7224128B2 (ja) * 2018-08-09 2023-02-17 株式会社荏原製作所 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法
JP7536039B2 (ja) * 2019-12-13 2024-08-19 株式会社荏原製作所 基板洗浄装置、研磨装置、バフ処理装置、基板洗浄方法、基板処理装置、および機械学習器
CN112420574B (zh) * 2020-11-25 2024-02-02 杭州众硅电子科技有限公司 一种可隔离防护晶圆的晶圆处理装置
JP7564693B2 (ja) * 2020-11-26 2024-10-09 株式会社Ｓｃｒｅｅｎホールディングス 下面ブラシ、ブラシユニットおよび基板洗浄装置
JP7672908B2 (ja) * 2021-07-28 2025-05-08 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
US20230178360A1 (en) * 2021-12-06 2023-06-08 Tung An Development Ltd. Device Having Cleaning Bodies
KR20250120334A (ko) * 2022-12-07 2025-08-08 티씨엔브이, 엘엘씨 원통형 브러시 및 그 제조 방법

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2480023A (en) * 1948-05-28 1949-08-23 Knickerbocker Rubber Company Massage brush
US3583555A (en) * 1969-01-31 1971-06-08 George E Karsnak Cleaning apparatus for conveyor belts or the like
US4217737A (en) * 1979-04-16 1980-08-19 Merit Abrasive Products, Inc. Abrasive flap drum
EP1080797A3 (en) * 1994-06-28 2005-10-05 Ebara Corporation Method and apparatus for cleaning workpiece
JP3114156B2 (ja) * 1994-06-28 2000-12-04 株式会社荏原製作所 洗浄方法および装置
JPH08141521A (ja) 1994-11-24 1996-06-04 Sumitomo Metal Ind Ltd 洗浄装置
US5779526A (en) * 1996-02-27 1998-07-14 Gill; Gerald L. Pad conditioner
EP0837493B8 (en) * 1996-10-21 2007-11-07 Ebara Corporation Cleaning apparatus
EP0937509A4 (en) 1996-11-08 2005-01-19 Aion Co Ltd SPONGE ROLLER TO CLEAN
US6502273B1 (en) * 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
TW358764B (en) * 1997-07-07 1999-05-21 Super Silicon Crystal Res Inst A method of double-side lapping a wafer and an apparatus therefor
US6202658B1 (en) * 1998-11-11 2001-03-20 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
JP4091187B2 (ja) * 1998-12-08 2008-05-28 株式会社荏原製作所 洗浄具、基板洗浄装置及び基板洗浄方法
JP2000270929A (ja) * 1999-03-26 2000-10-03 Shibaura Mechatronics Corp 洗浄用ブラシ
JP2000311878A (ja) * 1999-04-27 2000-11-07 Dainippon Screen Mfg Co Ltd 基板洗浄装置
KR100613919B1 (ko) * 1999-07-26 2006-08-18 동경 엘렉트론 주식회사 기판세정구, 기판세정장치 및 기판세정방법
US6406358B1 (en) * 1999-08-05 2002-06-18 Micron Technology, Inc. Method and apparatus for cleaning a surface of a microelectronic substrate
US6467120B1 (en) * 1999-09-08 2002-10-22 International Business Machines Corporation Wafer cleaning brush profile modification
US6367613B1 (en) * 2000-04-28 2002-04-09 Preston D. Montgomery Belt cleaning sprocket
US6904637B2 (en) * 2001-10-03 2005-06-14 Applied Materials, Inc. Scrubber with sonic nozzle
JP2004273530A (ja) * 2003-03-05 2004-09-30 Nec Kyushu Ltd 洗浄装置およびその方法
TWI286096B (en) * 2003-08-08 2007-09-01 Entegris Inc Methods and materials for making a monolithic porous pad onto a rotatable base
JP2007000860A (ja) * 2005-05-26 2007-01-11 Nitto Denko Corp 清浄用シート及びそれを用いた清浄方法
CN1872546A (zh) * 2005-05-26 2006-12-06 日东电工株式会社 清洁片及使用该清洁片的清洁方法
CN100449704C (zh) * 2006-08-11 2009-01-07 中芯国际集成电路制造(上海)有限公司 研磨头的清洗装置
KR101155623B1 (ko) * 2010-01-08 2012-06-13 세메스 주식회사 기판 세정 유닛 및 이를 갖는 기판 세정 장치
US20140230170A1 (en) * 2011-09-26 2014-08-21 Entegris, Inc. Post-cmp cleaning apparatus and method
US9202723B2 (en) * 2011-11-29 2015-12-01 Illinois Tool Works, Inc. Brush with cantilevered nodules
US20130255721A1 (en) * 2012-04-03 2013-10-03 Illinois Tool Works Inc. Concave nodule sponge brush
JP6352158B2 (ja) * 2014-11-20 2018-07-04 株式会社荏原製作所 洗浄具、洗浄具の製造方法、および、基板洗浄装置

Also Published As

Publication number Publication date
JP2016092158A (ja) 2016-05-23
US20200030855A1 (en) 2020-01-30
SG10201508996WA (en) 2016-05-30
KR102443489B1 (ko) 2022-09-15
US11642704B2 (en) 2023-05-09
TWI670141B (zh) 2019-09-01
CN105575851A (zh) 2016-05-11
TW201615340A (zh) 2016-05-01
KR20160052343A (ko) 2016-05-12
US20160126113A1 (en) 2016-05-05
CN105575851B (zh) 2021-08-27
TW201906689A (zh) 2019-02-16
TWI678260B (zh) 2019-12-01
CN113276024B (zh) 2023-08-29
CN113276024A (zh) 2021-08-20
JP6316730B2 (ja) 2018-04-25
US10471481B2 (en) 2019-11-12

Similar Documents

Publication Publication Date Title
MY178652A (en) Roll-type processing member, pencil-type processing member, and substrate processing apparatus including any one of these
TW201614382A (en) Metrology method, target and substrate
SG10202011613YA (en) Substrate processing apparatus
EP3117453A4 (en) In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning
WO2016156495A3 (en) Article for use with apparatus for heating smokable material
SG11201901050SA (en) Method and device for aligning substrates
IL247889B (en) Dispatching multiple threads in a computer
TR201820827T4 (tr) Çamaşır İşleme Aparatı
EP3135935A4 (en) Bearing device, conveyance device, inspection device and machine tool
JP2015135545A5 (https=)
JP2017030946A5 (https=)
ZA201801217B (en) Running applications on a computing device
EP3112178A4 (en) On-machine development type lithographic printing plate precursor processing method and printing method
SG10201705501WA (en) Substrate processing apparatus
KR102330098B9 (ko) 기판 처리 장치
SG11202002299UA (en) Substrate processing device
KR102039240B9 (ko) 기판 처리 장치
IN2015MU00084A (https=)
EP4070367A4 (en) SUBSTRATE PROCESSING APPARATUS
EP3396057A4 (en) Clothing processing device
IL271422A (en) Parallel processing of information in multi-core systems
GB2539037B (en) Apparatus having processing pipeline with first and second execution circuitry, and method
EP3135936A4 (en) Bearing device, conveyance device, inspection device and machine tool
TW201612714A (en) Touch panel having relatively narrow trace area and manufacturing method thereof
MY172077A (en) Manufacturing line for semiconductor device and method of manufacturing semiconductor device