TWI663038B - 導電材料之壓印微影方法及壓印微影之印模與壓印微影之設備 - Google Patents

導電材料之壓印微影方法及壓印微影之印模與壓印微影之設備 Download PDF

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Publication number
TWI663038B
TWI663038B TW106126054A TW106126054A TWI663038B TW I663038 B TWI663038 B TW I663038B TW 106126054 A TW106126054 A TW 106126054A TW 106126054 A TW106126054 A TW 106126054A TW I663038 B TWI663038 B TW I663038B
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TW
Taiwan
Prior art keywords
stamp
conductive paste
layer
patterned layer
lithography
Prior art date
Application number
TW106126054A
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English (en)
Chinese (zh)
Other versions
TW201815545A (zh
Inventor
羅伯珍 立瑟
凱文 坎寧安
Original Assignee
美商應用材料股份有限公司
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Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW201815545A publication Critical patent/TW201815545A/zh
Application granted granted Critical
Publication of TWI663038B publication Critical patent/TWI663038B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW106126054A 2016-08-05 2017-08-02 導電材料之壓印微影方法及壓印微影之印模與壓印微影之設備 TWI663038B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
??PCT/US2016/045769 2016-08-05
PCT/US2016/045769 WO2018026378A1 (fr) 2016-08-05 2016-08-05 Procédé d'impression lithographique de matériaux conducteurs, tampon pour l'impression lithographique et appareil pour l'impression lithographique

Publications (2)

Publication Number Publication Date
TW201815545A TW201815545A (zh) 2018-05-01
TWI663038B true TWI663038B (zh) 2019-06-21

Family

ID=61073033

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106126054A TWI663038B (zh) 2016-08-05 2017-08-02 導電材料之壓印微影方法及壓印微影之印模與壓印微影之設備

Country Status (5)

Country Link
JP (1) JP2019527938A (fr)
KR (1) KR20190027389A (fr)
CN (1) CN109564852A (fr)
TW (1) TWI663038B (fr)
WO (1) WO2018026378A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10948818B2 (en) * 2018-03-19 2021-03-16 Applied Materials, Inc. Methods and apparatus for creating a large area imprint without a seam
CN112219164A (zh) * 2018-03-26 2021-01-12 应用材料公司 用于生产多层压印母版的方法、多层压印母版及多层压印母版的用途
US10705268B2 (en) * 2018-06-29 2020-07-07 Applied Materials, Inc. Gap fill of imprinted structure with spin coated high refractive index material for optical components
US20210341834A1 (en) * 2018-09-12 2021-11-04 Jens DEGENHARDT Method of manufacturing a stamp for imprint lithography, stamp for imprint lithography, imprint roller and roll-to-roll substrate processing apparatus

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TW200846278A (en) * 2007-05-24 2008-12-01 Contrel Technology Co Ltd Method for producing viscous micro-structure
US20090046362A1 (en) * 2007-04-10 2009-02-19 Lingjie Jay Guo Roll to roll nanoimprint lithography

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JPH08118467A (ja) * 1994-10-21 1996-05-14 Matsushita Electric Ind Co Ltd スクリーン印刷用グリーンシート
WO2007094213A1 (fr) * 2006-02-14 2007-08-23 Pioneer Corporation dispositif d'impression et procédé d'impressioN
US20070298176A1 (en) * 2006-06-26 2007-12-27 Dipietro Richard Anthony Aromatic vinyl ether based reverse-tone step and flash imprint lithography
TW201418875A (zh) * 2006-12-05 2014-05-16 Nano Terra Inc 用於圖案化表面的方法
US8641839B2 (en) * 2007-02-13 2014-02-04 Yale University Method for imprinting and erasing amorphous metal alloys
KR20090061771A (ko) * 2007-12-12 2009-06-17 인하대학교 산학협력단 마이크로 구조물 제작을 나노 임프린트 리소그래피 공정기법의 몰드 구조 형성 방법
JP5388539B2 (ja) * 2008-10-28 2014-01-15 旭化成イーマテリアルズ株式会社 パターン形成方法
JP5518538B2 (ja) * 2009-03-26 2014-06-11 富士フイルム株式会社 レジスト組成物、レジスト層、インプリント方法、パターン形成体、磁気記録媒体の製造方法、及び磁気記録媒体
JP2010263000A (ja) * 2009-04-30 2010-11-18 Murata Mfg Co Ltd 電子部品製造方法
JP2010262959A (ja) * 2009-04-30 2010-11-18 Murata Mfg Co Ltd 配線パターンの形成方法
KR101076520B1 (ko) * 2009-06-11 2011-10-24 고려대학교 산학협력단 나노 임프린트 리소그래피 공정을 이용한 광전자 소자 제조 방법
JP2010287765A (ja) * 2009-06-12 2010-12-24 Murata Mfg Co Ltd インプリント方法、配線パターンの形成方法、および積層電子部品
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JP5824399B2 (ja) * 2012-03-30 2015-11-25 富士フイルム株式会社 ナノインプリント用樹脂モールドおよびその製造方法
JP6307269B2 (ja) * 2013-04-09 2018-04-04 旭化成株式会社 微細パターン形成用積層体、モールドの製造方法

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US20090046362A1 (en) * 2007-04-10 2009-02-19 Lingjie Jay Guo Roll to roll nanoimprint lithography
TW200846278A (en) * 2007-05-24 2008-12-01 Contrel Technology Co Ltd Method for producing viscous micro-structure

Also Published As

Publication number Publication date
CN109564852A (zh) 2019-04-02
WO2018026378A1 (fr) 2018-02-08
KR20190027389A (ko) 2019-03-14
JP2019527938A (ja) 2019-10-03
TW201815545A (zh) 2018-05-01

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