CN109564852A - 导电材料的压印平版印刷方法、用于压印平版印刷的印模及用于压印平版印刷的设备 - Google Patents

导电材料的压印平版印刷方法、用于压印平版印刷的印模及用于压印平版印刷的设备 Download PDF

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Publication number
CN109564852A
CN109564852A CN201680088160.3A CN201680088160A CN109564852A CN 109564852 A CN109564852 A CN 109564852A CN 201680088160 A CN201680088160 A CN 201680088160A CN 109564852 A CN109564852 A CN 109564852A
Authority
CN
China
Prior art keywords
stamp
layer
electrocondution slurry
imprint lithography
feature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680088160.3A
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English (en)
Chinese (zh)
Inventor
罗伯特·简·维瑟
凯文·L·卡宁厄姆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN109564852A publication Critical patent/CN109564852A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201680088160.3A 2016-08-05 2016-08-05 导电材料的压印平版印刷方法、用于压印平版印刷的印模及用于压印平版印刷的设备 Pending CN109564852A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2016/045769 WO2018026378A1 (fr) 2016-08-05 2016-08-05 Procédé d'impression lithographique de matériaux conducteurs, tampon pour l'impression lithographique et appareil pour l'impression lithographique

Publications (1)

Publication Number Publication Date
CN109564852A true CN109564852A (zh) 2019-04-02

Family

ID=61073033

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680088160.3A Pending CN109564852A (zh) 2016-08-05 2016-08-05 导电材料的压印平版印刷方法、用于压印平版印刷的印模及用于压印平版印刷的设备

Country Status (5)

Country Link
JP (1) JP2019527938A (fr)
KR (1) KR20190027389A (fr)
CN (1) CN109564852A (fr)
TW (1) TWI663038B (fr)
WO (1) WO2018026378A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112689797A (zh) * 2018-09-12 2021-04-20 应用材料公司 用于制造压印光刻的印模的方法、用于压印光刻的印模、压印辊子、和卷对卷基板处理设备

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10948818B2 (en) * 2018-03-19 2021-03-16 Applied Materials, Inc. Methods and apparatus for creating a large area imprint without a seam
CN112219164A (zh) * 2018-03-26 2021-01-12 应用材料公司 用于生产多层压印母版的方法、多层压印母版及多层压印母版的用途
US10705268B2 (en) * 2018-06-29 2020-07-07 Applied Materials, Inc. Gap fill of imprinted structure with spin coated high refractive index material for optical components

Citations (11)

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US5296043A (en) * 1990-02-16 1994-03-22 Canon Kabushiki Kaisha Multi-cells integrated solar cell module and process for producing the same
US20070298176A1 (en) * 2006-06-26 2007-12-27 Dipietro Richard Anthony Aromatic vinyl ether based reverse-tone step and flash imprint lithography
US20080152835A1 (en) * 2006-12-05 2008-06-26 Nano Terra Inc. Method for Patterning a Surface
TW200846278A (en) * 2007-05-24 2008-12-01 Contrel Technology Co Ltd Method for producing viscous micro-structure
US20090046362A1 (en) * 2007-04-10 2009-02-19 Lingjie Jay Guo Roll to roll nanoimprint lithography
KR20090061771A (ko) * 2007-12-12 2009-06-17 인하대학교 산학협력단 마이크로 구조물 제작을 나노 임프린트 리소그래피 공정기법의 몰드 구조 형성 방법
US20100098967A1 (en) * 2007-02-13 2010-04-22 Jan Schroers Method for Imprinting and Erasing Amorphous Metal Alloys
KR20100133136A (ko) * 2009-06-11 2010-12-21 고려대학교 산학협력단 나노 임프린트 리소그래피 공정을 이용한 광전자 소자 제조 방법
US20120009799A1 (en) * 2010-07-07 2012-01-12 Tsukasa Azuma Template manufacturing method, semiconductor device manufacturing method and template
WO2012167076A2 (fr) * 2011-06-01 2012-12-06 The Regents Of The University Of Michigan Structuration guidée par nano-canal pour substrats polymériques
US20150037922A1 (en) * 2011-09-23 2015-02-05 1366 Technologies, Inc. Techniques for improved imprinting of soft material on substrate using stamp including underfilling to leave a gap and pulsing stamp

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JPH08118467A (ja) * 1994-10-21 1996-05-14 Matsushita Electric Ind Co Ltd スクリーン印刷用グリーンシート
WO2007094213A1 (fr) * 2006-02-14 2007-08-23 Pioneer Corporation dispositif d'impression et procédé d'impressioN
JP5388539B2 (ja) * 2008-10-28 2014-01-15 旭化成イーマテリアルズ株式会社 パターン形成方法
JP5518538B2 (ja) * 2009-03-26 2014-06-11 富士フイルム株式会社 レジスト組成物、レジスト層、インプリント方法、パターン形成体、磁気記録媒体の製造方法、及び磁気記録媒体
JP2010263000A (ja) * 2009-04-30 2010-11-18 Murata Mfg Co Ltd 電子部品製造方法
JP2010262959A (ja) * 2009-04-30 2010-11-18 Murata Mfg Co Ltd 配線パターンの形成方法
JP2010287765A (ja) * 2009-06-12 2010-12-24 Murata Mfg Co Ltd インプリント方法、配線パターンの形成方法、および積層電子部品
JP5540628B2 (ja) * 2009-09-28 2014-07-02 大日本印刷株式会社 ナノインプリントパターン形成方法
JP5599355B2 (ja) * 2011-03-31 2014-10-01 富士フイルム株式会社 モールドの製造方法
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US5296043A (en) * 1990-02-16 1994-03-22 Canon Kabushiki Kaisha Multi-cells integrated solar cell module and process for producing the same
US20070298176A1 (en) * 2006-06-26 2007-12-27 Dipietro Richard Anthony Aromatic vinyl ether based reverse-tone step and flash imprint lithography
US20080152835A1 (en) * 2006-12-05 2008-06-26 Nano Terra Inc. Method for Patterning a Surface
US20100098967A1 (en) * 2007-02-13 2010-04-22 Jan Schroers Method for Imprinting and Erasing Amorphous Metal Alloys
US20090046362A1 (en) * 2007-04-10 2009-02-19 Lingjie Jay Guo Roll to roll nanoimprint lithography
TW200846278A (en) * 2007-05-24 2008-12-01 Contrel Technology Co Ltd Method for producing viscous micro-structure
KR20090061771A (ko) * 2007-12-12 2009-06-17 인하대학교 산학협력단 마이크로 구조물 제작을 나노 임프린트 리소그래피 공정기법의 몰드 구조 형성 방법
KR20100133136A (ko) * 2009-06-11 2010-12-21 고려대학교 산학협력단 나노 임프린트 리소그래피 공정을 이용한 광전자 소자 제조 방법
US20120009799A1 (en) * 2010-07-07 2012-01-12 Tsukasa Azuma Template manufacturing method, semiconductor device manufacturing method and template
WO2012167076A2 (fr) * 2011-06-01 2012-12-06 The Regents Of The University Of Michigan Structuration guidée par nano-canal pour substrats polymériques
US20150037922A1 (en) * 2011-09-23 2015-02-05 1366 Technologies, Inc. Techniques for improved imprinting of soft material on substrate using stamp including underfilling to leave a gap and pulsing stamp

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Title
KANG, MG 等: "Organic Solar Cells Using Nanoimprinted Transparent Metal Electrodes", 《ADVANCED MATERIALS》 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112689797A (zh) * 2018-09-12 2021-04-20 应用材料公司 用于制造压印光刻的印模的方法、用于压印光刻的印模、压印辊子、和卷对卷基板处理设备

Also Published As

Publication number Publication date
TWI663038B (zh) 2019-06-21
WO2018026378A1 (fr) 2018-02-08
KR20190027389A (ko) 2019-03-14
JP2019527938A (ja) 2019-10-03
TW201815545A (zh) 2018-05-01

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Application publication date: 20190402