TWI661501B - 移動體裝置、曝光裝置、平板顯示器之製造方法、元件製造方法、移動方法及曝光方法 - Google Patents
移動體裝置、曝光裝置、平板顯示器之製造方法、元件製造方法、移動方法及曝光方法 Download PDFInfo
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- TWI661501B TWI661501B TW107101077A TW107101077A TWI661501B TW I661501 B TWI661501 B TW I661501B TW 107101077 A TW107101077 A TW 107101077A TW 107101077 A TW107101077 A TW 107101077A TW I661501 B TWI661501 B TW I661501B
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- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 238000012545 processing Methods 0.000 title description 14
- 239000000758 substrate Substances 0.000 claims abstract description 243
- 238000000034 method Methods 0.000 claims description 32
- 230000009471 action Effects 0.000 claims description 5
- 239000000725 suspension Substances 0.000 abstract description 56
- 230000003287 optical effect Effects 0.000 description 36
- 230000036316 preload Effects 0.000 description 28
- 239000004973 liquid crystal related substance Substances 0.000 description 25
- 238000005286 illumination Methods 0.000 description 22
- 238000005452 bending Methods 0.000 description 20
- 238000006243 chemical reaction Methods 0.000 description 15
- 125000006850 spacer group Chemical group 0.000 description 12
- 229910000831 Steel Inorganic materials 0.000 description 9
- 239000010959 steel Substances 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 230000005484 gravity Effects 0.000 description 6
- 210000004270 pstb Anatomy 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 210000004196 psta Anatomy 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 229910052691 Erbium Inorganic materials 0.000 description 3
- 210000002858 crystal cell Anatomy 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Environmental & Geological Engineering (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Toxicology (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Liquid Crystal (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US38043310P | 2010-09-07 | 2010-09-07 | |
| US61/380,433 | 2010-09-07 | ||
| US13/223,970 | 2011-09-01 | ||
| US13/223,970 US20120064460A1 (en) | 2010-09-07 | 2011-09-01 | Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201820510A TW201820510A (zh) | 2018-06-01 |
| TWI661501B true TWI661501B (zh) | 2019-06-01 |
Family
ID=45807044
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107101077A TWI661501B (zh) | 2010-09-07 | 2011-09-06 | 移動體裝置、曝光裝置、平板顯示器之製造方法、元件製造方法、移動方法及曝光方法 |
| TW108114728A TWI720466B (zh) | 2010-09-07 | 2011-09-06 | 移動體裝置、曝光裝置、以及元件製造方法 |
| TW105113427A TWI615913B (zh) | 2010-09-07 | 2011-09-06 | 移動體裝置、物體處理裝置、曝光裝置、平板顯示器之製造方法、及元件製造方法 |
| TW100132051A TWI538078B (zh) | 2010-09-07 | 2011-09-06 | 移動體裝置、物體處理裝置、曝光裝置、平板顯示器之製造方法、及微型元件製造方法 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108114728A TWI720466B (zh) | 2010-09-07 | 2011-09-06 | 移動體裝置、曝光裝置、以及元件製造方法 |
| TW105113427A TWI615913B (zh) | 2010-09-07 | 2011-09-06 | 移動體裝置、物體處理裝置、曝光裝置、平板顯示器之製造方法、及元件製造方法 |
| TW100132051A TWI538078B (zh) | 2010-09-07 | 2011-09-06 | 移動體裝置、物體處理裝置、曝光裝置、平板顯示器之製造方法、及微型元件製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20120064460A1 (OSRAM) |
| JP (4) | JP5909934B2 (OSRAM) |
| KR (3) | KR101911724B1 (OSRAM) |
| CN (2) | CN103097957B (OSRAM) |
| HK (1) | HK1222921A1 (OSRAM) |
| TW (4) | TWI661501B (OSRAM) |
| WO (1) | WO2012033212A1 (OSRAM) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2954561B2 (ja) | 1997-01-20 | 1999-09-27 | 松下電子工業株式会社 | リードフレーム、リードフレームを用いた樹脂封止半導体装置の成形金型、リードフレームを用いた樹脂封止半導体装置および樹脂封止半導体装置の製造方法 |
| US20110053092A1 (en) * | 2009-08-20 | 2011-03-03 | Nikon Corporation | Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method |
| US20110042874A1 (en) * | 2009-08-20 | 2011-02-24 | Nikon Corporation | Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method |
| US8699001B2 (en) * | 2009-08-20 | 2014-04-15 | Nikon Corporation | Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method |
| US8988655B2 (en) | 2010-09-07 | 2015-03-24 | Nikon Corporation | Exposure apparatus, movable body apparatus, flat-panel display manufacturing method, and device manufacturing method |
| US8598538B2 (en) * | 2010-09-07 | 2013-12-03 | Nikon Corporation | Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method |
| US20120064460A1 (en) * | 2010-09-07 | 2012-03-15 | Nikon Corporation | Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method |
| JP5958692B2 (ja) * | 2012-04-04 | 2016-08-02 | 株式会社ニコン | 移動体装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び移動体の駆動方法並びに露光方法 |
| JP6035670B2 (ja) * | 2012-08-07 | 2016-11-30 | 株式会社ニコン | 露光方法、フラットパネルディスプレイの製造方法、及びデバイス製造方法、並びに露光装置 |
| WO2014024483A1 (ja) * | 2012-08-08 | 2014-02-13 | 株式会社ニコン | 物体交換方法、物体交換システム、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
| JP6172913B2 (ja) * | 2012-10-23 | 2017-08-02 | キヤノン株式会社 | ステージ装置、露光装置および物品の製造方法 |
| JP6086299B2 (ja) * | 2012-11-13 | 2017-03-01 | 株式会社ニコン | 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
| HK1216357A1 (en) | 2012-11-30 | 2016-11-04 | Nikon Corporation | Transfer system, exposure apparatus, transfer method, exposure method, device manufacturing method, and suction apparatus |
| JPWO2015147039A1 (ja) * | 2014-03-26 | 2017-04-13 | 株式会社ニコン | 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
| TWI701514B (zh) * | 2014-03-28 | 2020-08-11 | 日商尼康股份有限公司 | 移動體裝置、曝光裝置、平板顯示器之製造方法、元件製造方法、及移動體驅動方法 |
| KR102283654B1 (ko) * | 2014-11-14 | 2021-07-29 | 가부시키가이샤 니콘 | 조형 장치 및 조형 방법 |
| JP6712411B2 (ja) * | 2015-03-30 | 2020-06-24 | 株式会社ニコン | 物体搬送装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体搬送方法、及び露光方法 |
| HK1246870A1 (zh) * | 2015-03-31 | 2018-09-14 | 株式会社尼康 | 曝光装置、平板显示器的制造方法、器件制造方法及曝光方法 |
| US10802407B2 (en) * | 2015-09-30 | 2020-10-13 | Nikon Corporation | Exposure apparatus, exposure method, manufacturing method of flat-panel display, and device manufacturing method |
| US10520834B2 (en) * | 2015-09-30 | 2019-12-31 | Nikon Corporation | Movable body apparatus, exposure apparatus, manufacturing method of flat-panel display and device manufacturing method, and movement method of object |
| JP6885334B2 (ja) * | 2015-09-30 | 2021-06-16 | 株式会社ニコン | 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法、並びに露光方法 |
| CN106814551B (zh) * | 2015-11-30 | 2019-04-12 | 上海微电子装备（集团）股份有限公司 | 一种基板交接装置及交接方法 |
| JP6874314B2 (ja) * | 2016-09-30 | 2021-05-19 | 株式会社ニコン | 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
| US10928744B2 (en) | 2016-10-20 | 2021-02-23 | Molecular Imprints, Inc. | Positioning substrates in imprint lithography processes |
| CN107193142A (zh) * | 2017-07-19 | 2017-09-22 | 武汉华星光电技术有限公司 | 配向膜固化系统 |
| CN107228127B (zh) * | 2017-07-21 | 2023-06-06 | 天津航天机电设备研究所 | 一种气浮轴承 |
| KR102481264B1 (ko) * | 2018-01-04 | 2022-12-26 | 삼성전자주식회사 | 디스플레이 장치 및 디스플레이 모듈의 힌지 조립체 |
| JP7473195B2 (ja) * | 2020-09-14 | 2024-04-23 | 株式会社ブイ・テクノロジー | 集束荷電粒子ビーム装置 |
| JP2024043963A (ja) * | 2022-09-20 | 2024-04-02 | キオクシア株式会社 | パターン形成方法、半導体装置の製造方法、及びインプリント装置 |
| US12090590B1 (en) | 2023-10-10 | 2024-09-17 | Wuxi Xivi Science And Technology Co., Ltd. | Six-degree-of-freedom air-floating moving apparatus |
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- 2011-09-05 WO PCT/JP2011/070667 patent/WO2012033212A1/en not_active Ceased
- 2011-09-05 CN CN201180043098.3A patent/CN103097957B/zh active Active
- 2011-09-05 JP JP2011192332A patent/JP5909934B2/ja active Active
- 2011-09-05 KR KR1020207002447A patent/KR102216234B1/ko active Active
- 2011-09-05 CN CN201510651366.XA patent/CN105404097B/zh active Active
- 2011-09-05 KR KR1020187030215A patent/KR102072074B1/ko active Active
- 2011-09-06 TW TW107101077A patent/TWI661501B/zh active
- 2011-09-06 TW TW108114728A patent/TWI720466B/zh active
- 2011-09-06 TW TW105113427A patent/TWI615913B/zh active
- 2011-09-06 TW TW100132051A patent/TWI538078B/zh active
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2013
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2016
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2018
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Also Published As
| Publication number | Publication date |
|---|---|
| CN105404097B (zh) | 2019-06-21 |
| WO2012033212A1 (en) | 2012-03-15 |
| JP2012060118A (ja) | 2012-03-22 |
| US20120064460A1 (en) | 2012-03-15 |
| TW201220419A (en) | 2012-05-16 |
| KR102216234B1 (ko) | 2021-02-16 |
| JP6881537B2 (ja) | 2021-06-02 |
| CN103097957B (zh) | 2015-11-25 |
| JP2016157131A (ja) | 2016-09-01 |
| JP5909934B2 (ja) | 2016-04-27 |
| KR101911724B1 (ko) | 2018-10-29 |
| JP2020021085A (ja) | 2020-02-06 |
| KR20200012034A (ko) | 2020-02-04 |
| JP2018142023A (ja) | 2018-09-13 |
| TWI538078B (zh) | 2016-06-11 |
| CN103097957A (zh) | 2013-05-08 |
| HK1179356A1 (zh) | 2013-09-27 |
| TW201631687A (zh) | 2016-09-01 |
| TWI615913B (zh) | 2018-02-21 |
| KR102072074B1 (ko) | 2020-01-31 |
| CN105404097A (zh) | 2016-03-16 |
| TWI720466B (zh) | 2021-03-01 |
| HK1222921A1 (zh) | 2017-07-14 |
| JP6593662B2 (ja) | 2019-10-23 |
| KR20130114123A (ko) | 2013-10-16 |
| TW201932994A (zh) | 2019-08-16 |
| JP6347270B2 (ja) | 2018-06-27 |
| KR20180117221A (ko) | 2018-10-26 |
| TW201820510A (zh) | 2018-06-01 |
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