TWI661460B - 靜電夾具及半導體液晶製造設備 - Google Patents
靜電夾具及半導體液晶製造設備 Download PDFInfo
- Publication number
- TWI661460B TWI661460B TW104116255A TW104116255A TWI661460B TW I661460 B TWI661460 B TW I661460B TW 104116255 A TW104116255 A TW 104116255A TW 104116255 A TW104116255 A TW 104116255A TW I661460 B TWI661460 B TW I661460B
- Authority
- TW
- Taiwan
- Prior art keywords
- cylindrical
- component
- hole
- electrostatic
- substrate
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 35
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims abstract description 84
- 238000009413 insulation Methods 0.000 claims abstract description 34
- 239000004020 conductor Substances 0.000 claims description 66
- 239000004065 semiconductor Substances 0.000 claims description 13
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 18
- 239000012790 adhesive layer Substances 0.000 description 17
- 239000010410 layer Substances 0.000 description 13
- 235000012431 wafers Nutrition 0.000 description 10
- 238000001312 dry etching Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 240000005561 Musa balbisiana Species 0.000 description 1
- 235000018290 Musa x paradisiaca Nutrition 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920004738 ULTEM® Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-109931 | 2014-05-28 | ||
| JP2014109931A JP6308871B2 (ja) | 2014-05-28 | 2014-05-28 | 静電チャック及び半導体・液晶製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201608600A TW201608600A (zh) | 2016-03-01 |
| TWI661460B true TWI661460B (zh) | 2019-06-01 |
Family
ID=54702632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104116255A TWI661460B (zh) | 2014-05-28 | 2015-05-21 | 靜電夾具及半導體液晶製造設備 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10147628B2 (enExample) |
| JP (1) | JP6308871B2 (enExample) |
| KR (1) | KR102166737B1 (enExample) |
| TW (1) | TWI661460B (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6308871B2 (ja) * | 2014-05-28 | 2018-04-11 | 新光電気工業株式会社 | 静電チャック及び半導体・液晶製造装置 |
| US10388558B2 (en) * | 2016-12-05 | 2019-08-20 | Tokyo Electron Limited | Plasma processing apparatus |
| JP6758175B2 (ja) * | 2016-12-21 | 2020-09-23 | 日本特殊陶業株式会社 | 静電チャック |
| CN108428661B (zh) * | 2017-02-15 | 2020-11-13 | 中微半导体设备(上海)股份有限公司 | 一种用于真空处理装置的基片承载台及其制造方法 |
| JP6760127B2 (ja) * | 2017-02-24 | 2020-09-23 | 三菱電機株式会社 | 半導体装置、半導体装置の製造方法 |
| JP6965776B2 (ja) * | 2018-02-08 | 2021-11-10 | トヨタ自動車株式会社 | 静電吸着搬送装置およびその方法 |
| JP6979375B2 (ja) * | 2018-02-27 | 2021-12-15 | 日本特殊陶業株式会社 | 保持装置および保持装置の製造方法 |
| JP7403215B2 (ja) * | 2018-09-14 | 2023-12-22 | 東京エレクトロン株式会社 | 基板支持体及び基板処理装置 |
| JP2023031603A (ja) | 2021-08-25 | 2023-03-09 | 新光電気工業株式会社 | 基板固定装置 |
| JP7554171B2 (ja) | 2021-10-19 | 2024-09-19 | 日本碍子株式会社 | ウエハ載置台 |
| JP7623309B2 (ja) | 2022-01-12 | 2025-01-28 | 日本碍子株式会社 | ウエハ載置台 |
| JP7734110B2 (ja) * | 2022-03-31 | 2025-09-04 | 日本特殊陶業株式会社 | 保持装置 |
| JP7734117B2 (ja) * | 2022-06-30 | 2025-09-04 | 日本特殊陶業株式会社 | 保持装置 |
| WO2025089271A1 (ja) * | 2023-10-26 | 2025-05-01 | 東京エレクトロン株式会社 | 基板支持器及びプラズマ処理装置 |
| WO2025155847A1 (en) * | 2024-01-18 | 2025-07-24 | Watlow Electric Manufacturing Company | Electrical termination for ceramic pedestal with embedded electrical components |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080080118A1 (en) * | 2006-09-29 | 2008-04-03 | Shinko Electric Industries Co., Ltd. | Electrostatic chuck |
| JP2008098513A (ja) * | 2006-10-13 | 2008-04-24 | Ngk Spark Plug Co Ltd | 静電チャック装置 |
| US20130286531A1 (en) * | 2012-04-26 | 2013-10-31 | Shinko Electric Industries Co., Ltd. | Electrostatic chuck |
| TW201430991A (zh) * | 2012-11-22 | 2014-08-01 | Creative Tech Corp | 靜電夾盤及供電系統 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0672685B2 (ja) * | 1987-06-19 | 1994-09-14 | 松下電器産業株式会社 | 燃焼装置 |
| JPH0774234A (ja) * | 1993-06-28 | 1995-03-17 | Tokyo Electron Ltd | 静電チャックの電極構造、この組み立て方法、この組み立て治具及び処理装置 |
| US6544379B2 (en) * | 1993-09-16 | 2003-04-08 | Hitachi, Ltd. | Method of holding substrate and substrate holding system |
| US6268994B1 (en) * | 1999-07-09 | 2001-07-31 | Dorsey Gage, Inc. | Electrostatic chuck and method of manufacture |
| JP2003060016A (ja) * | 2001-07-31 | 2003-02-28 | Applied Materials Inc | 電流導入端子及び半導体製造装置 |
| JP3993408B2 (ja) * | 2001-10-05 | 2007-10-17 | 株式会社巴川製紙所 | 静電チャック装置、その組立方法および静電チャック装置用部材 |
| JP4219734B2 (ja) * | 2003-05-19 | 2009-02-04 | 東京エレクトロン株式会社 | 基板保持機構およびプラズマ処理装置 |
| US8038796B2 (en) * | 2004-12-30 | 2011-10-18 | Lam Research Corporation | Apparatus for spatial and temporal control of temperature on a substrate |
| US8092638B2 (en) * | 2005-10-11 | 2012-01-10 | Applied Materials Inc. | Capacitively coupled plasma reactor having a cooled/heated wafer support with uniform temperature distribution |
| JP4767788B2 (ja) | 2006-08-12 | 2011-09-07 | 日本特殊陶業株式会社 | 静電チャック装置 |
| DE102008052100B4 (de) * | 2008-10-08 | 2015-10-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Flexibel verformbares Halteelement für Substrate |
| JP5936361B2 (ja) * | 2012-01-12 | 2016-06-22 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| JP5917946B2 (ja) * | 2012-02-24 | 2016-05-18 | 東京エレクトロン株式会社 | 基板載置台及びプラズマエッチング装置 |
| JP6292977B2 (ja) * | 2014-05-22 | 2018-03-14 | 新光電気工業株式会社 | 静電チャック及び半導体・液晶製造装置 |
| JP6308871B2 (ja) * | 2014-05-28 | 2018-04-11 | 新光電気工業株式会社 | 静電チャック及び半導体・液晶製造装置 |
-
2014
- 2014-05-28 JP JP2014109931A patent/JP6308871B2/ja active Active
-
2015
- 2015-05-15 KR KR1020150067880A patent/KR102166737B1/ko active Active
- 2015-05-21 TW TW104116255A patent/TWI661460B/zh active
- 2015-05-21 US US14/718,640 patent/US10147628B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080080118A1 (en) * | 2006-09-29 | 2008-04-03 | Shinko Electric Industries Co., Ltd. | Electrostatic chuck |
| JP2008098513A (ja) * | 2006-10-13 | 2008-04-24 | Ngk Spark Plug Co Ltd | 静電チャック装置 |
| US20130286531A1 (en) * | 2012-04-26 | 2013-10-31 | Shinko Electric Industries Co., Ltd. | Electrostatic chuck |
| JP2013229464A (ja) * | 2012-04-26 | 2013-11-07 | Shinko Electric Ind Co Ltd | 静電チャック |
| TW201430991A (zh) * | 2012-11-22 | 2014-08-01 | Creative Tech Corp | 靜電夾盤及供電系統 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015225952A (ja) | 2015-12-14 |
| US10147628B2 (en) | 2018-12-04 |
| KR102166737B1 (ko) | 2020-10-16 |
| KR20150136998A (ko) | 2015-12-08 |
| TW201608600A (zh) | 2016-03-01 |
| US20150348814A1 (en) | 2015-12-03 |
| JP6308871B2 (ja) | 2018-04-11 |
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