KR102166737B1 - 정전 척 및 반도체·액정 제조 장치 - Google Patents

정전 척 및 반도체·액정 제조 장치 Download PDF

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Publication number
KR102166737B1
KR102166737B1 KR1020150067880A KR20150067880A KR102166737B1 KR 102166737 B1 KR102166737 B1 KR 102166737B1 KR 1020150067880 A KR1020150067880 A KR 1020150067880A KR 20150067880 A KR20150067880 A KR 20150067880A KR 102166737 B1 KR102166737 B1 KR 102166737B1
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KR
South Korea
Prior art keywords
mounting table
cylindrical
electrostatic chuck
base plate
hole
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KR1020150067880A
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English (en)
Korean (ko)
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KR20150136998A (ko
Inventor
노리오 시라이와
지로 가와이
Original Assignee
신꼬오덴기 고교 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020150067880A 2014-05-28 2015-05-15 정전 척 및 반도체·액정 제조 장치 Active KR102166737B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-109931 2014-05-28
JP2014109931A JP6308871B2 (ja) 2014-05-28 2014-05-28 静電チャック及び半導体・液晶製造装置

Publications (2)

Publication Number Publication Date
KR20150136998A KR20150136998A (ko) 2015-12-08
KR102166737B1 true KR102166737B1 (ko) 2020-10-16

Family

ID=54702632

Family Applications (1)

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KR1020150067880A Active KR102166737B1 (ko) 2014-05-28 2015-05-15 정전 척 및 반도체·액정 제조 장치

Country Status (4)

Country Link
US (1) US10147628B2 (enExample)
JP (1) JP6308871B2 (enExample)
KR (1) KR102166737B1 (enExample)
TW (1) TWI661460B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6308871B2 (ja) * 2014-05-28 2018-04-11 新光電気工業株式会社 静電チャック及び半導体・液晶製造装置
US10388558B2 (en) * 2016-12-05 2019-08-20 Tokyo Electron Limited Plasma processing apparatus
JP6758175B2 (ja) * 2016-12-21 2020-09-23 日本特殊陶業株式会社 静電チャック
CN108428661B (zh) * 2017-02-15 2020-11-13 中微半导体设备(上海)股份有限公司 一种用于真空处理装置的基片承载台及其制造方法
JP6760127B2 (ja) * 2017-02-24 2020-09-23 三菱電機株式会社 半導体装置、半導体装置の製造方法
JP6965776B2 (ja) * 2018-02-08 2021-11-10 トヨタ自動車株式会社 静電吸着搬送装置およびその方法
JP6979375B2 (ja) * 2018-02-27 2021-12-15 日本特殊陶業株式会社 保持装置および保持装置の製造方法
JP7403215B2 (ja) 2018-09-14 2023-12-22 東京エレクトロン株式会社 基板支持体及び基板処理装置
JP2023031603A (ja) * 2021-08-25 2023-03-09 新光電気工業株式会社 基板固定装置
JP7554171B2 (ja) * 2021-10-19 2024-09-19 日本碍子株式会社 ウエハ載置台
JP7623309B2 (ja) * 2022-01-12 2025-01-28 日本碍子株式会社 ウエハ載置台
JP7734110B2 (ja) * 2022-03-31 2025-09-04 日本特殊陶業株式会社 保持装置
JP7734117B2 (ja) * 2022-06-30 2025-09-04 日本特殊陶業株式会社 保持装置
WO2025089271A1 (ja) * 2023-10-26 2025-05-01 東京エレクトロン株式会社 基板支持器及びプラズマ処理装置
WO2025155847A1 (en) * 2024-01-18 2025-07-24 Watlow Electric Manufacturing Company Electrical termination for ceramic pedestal with embedded electrical components

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008098513A (ja) * 2006-10-13 2008-04-24 Ngk Spark Plug Co Ltd 静電チャック装置
JP2013229464A (ja) * 2012-04-26 2013-11-07 Shinko Electric Ind Co Ltd 静電チャック

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0672685B2 (ja) * 1987-06-19 1994-09-14 松下電器産業株式会社 燃焼装置
JPH0774234A (ja) * 1993-06-28 1995-03-17 Tokyo Electron Ltd 静電チャックの電極構造、この組み立て方法、この組み立て治具及び処理装置
US6544379B2 (en) * 1993-09-16 2003-04-08 Hitachi, Ltd. Method of holding substrate and substrate holding system
US6268994B1 (en) * 1999-07-09 2001-07-31 Dorsey Gage, Inc. Electrostatic chuck and method of manufacture
JP2003060016A (ja) * 2001-07-31 2003-02-28 Applied Materials Inc 電流導入端子及び半導体製造装置
JP3993408B2 (ja) * 2001-10-05 2007-10-17 株式会社巴川製紙所 静電チャック装置、その組立方法および静電チャック装置用部材
JP4219734B2 (ja) * 2003-05-19 2009-02-04 東京エレクトロン株式会社 基板保持機構およびプラズマ処理装置
US8038796B2 (en) * 2004-12-30 2011-10-18 Lam Research Corporation Apparatus for spatial and temporal control of temperature on a substrate
US8092638B2 (en) * 2005-10-11 2012-01-10 Applied Materials Inc. Capacitively coupled plasma reactor having a cooled/heated wafer support with uniform temperature distribution
JP4767788B2 (ja) 2006-08-12 2011-09-07 日本特殊陶業株式会社 静電チャック装置
JP5032818B2 (ja) * 2006-09-29 2012-09-26 新光電気工業株式会社 静電チャック
DE102008052100B4 (de) * 2008-10-08 2015-10-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Flexibel verformbares Halteelement für Substrate
JP5936361B2 (ja) * 2012-01-12 2016-06-22 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP5917946B2 (ja) * 2012-02-24 2016-05-18 東京エレクトロン株式会社 基板載置台及びプラズマエッチング装置
JP6425184B2 (ja) * 2012-11-22 2018-11-21 株式会社クリエイティブテクノロジー 給電システム
JP6292977B2 (ja) * 2014-05-22 2018-03-14 新光電気工業株式会社 静電チャック及び半導体・液晶製造装置
JP6308871B2 (ja) * 2014-05-28 2018-04-11 新光電気工業株式会社 静電チャック及び半導体・液晶製造装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008098513A (ja) * 2006-10-13 2008-04-24 Ngk Spark Plug Co Ltd 静電チャック装置
JP2013229464A (ja) * 2012-04-26 2013-11-07 Shinko Electric Ind Co Ltd 静電チャック

Also Published As

Publication number Publication date
JP6308871B2 (ja) 2018-04-11
JP2015225952A (ja) 2015-12-14
KR20150136998A (ko) 2015-12-08
US10147628B2 (en) 2018-12-04
TW201608600A (zh) 2016-03-01
US20150348814A1 (en) 2015-12-03
TWI661460B (zh) 2019-06-01

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