TWI658509B - 用於ｔｓｖ／ｍｅｍｓ／功率元件蝕刻的化學物質 - Google Patents

用於ｔｓｖ／ｍｅｍｓ／功率元件蝕刻的化學物質 Download PDF

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Publication number
TWI658509B
TWI658509B TW104119063A TW104119063A TWI658509B TW I658509 B TWI658509 B TW I658509B TW 104119063 A TW104119063 A TW 104119063A TW 104119063 A TW104119063 A TW 104119063A TW I658509 B TWI658509 B TW I658509B
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Taiwan
Prior art keywords
etching
fluid
silicon
hydrogen
polymer deposition
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TW104119063A
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English (en)
Chinese (zh)
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TW201606867A (zh
Inventor
Peng Shen
沈鵬
Christian Dussarrat
克里斯均 杜薩拉特
Curtis Anderson
柯堤斯 安德森
Rahul Gupta
拉胡爾 古普塔
Vincent M. Omarjee
維森Ｍ 歐馬吉
Nathan Stafford
納森 斯塔福德
Original Assignee
L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude
法商液態空氣喬治斯克勞帝方法研究開發股份有限公司
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Application filed by L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude, 法商液態空氣喬治斯克勞帝方法研究開發股份有限公司 filed Critical L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude
Publication of TW201606867A publication Critical patent/TW201606867A/zh
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    • H10P50/244—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Drying Of Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • ing And Chemical Polishing (AREA)
TW104119063A 2014-06-18 2015-06-12 用於ｔｓｖ／ｍｅｍｓ／功率元件蝕刻的化學物質 TWI658509B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462013959P 2014-06-18 2014-06-18
US62/013,959 2014-06-18

Publications (2)

Publication Number Publication Date
TW201606867A TW201606867A (zh) 2016-02-16
TWI658509B true TWI658509B (zh) 2019-05-01

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TW104119063A TWI658509B (zh) 2014-06-18 2015-06-12 用於ｔｓｖ／ｍｅｍｓ／功率元件蝕刻的化學物質
TW109114840A TWI733431B (zh) 2014-06-18 2015-06-12 用於tsv/mems/功率元件蝕刻的化學物質
TW108109359A TWI695423B (zh) 2014-06-18 2015-06-12 用於tsv/mems/功率元件蝕刻的化學物質

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TW109114840A TWI733431B (zh) 2014-06-18 2015-06-12 用於tsv/mems/功率元件蝕刻的化學物質
TW108109359A TWI695423B (zh) 2014-06-18 2015-06-12 用於tsv/mems/功率元件蝕刻的化學物質

Country Status (8)

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US (3) US9892932B2 (show.php)
EP (1) EP3158579A4 (show.php)
JP (1) JP6485972B2 (show.php)
KR (3) KR102539241B1 (show.php)
CN (2) CN106663624B (show.php)
SG (1) SG11201610342YA (show.php)
TW (3) TWI658509B (show.php)
WO (1) WO2015194178A1 (show.php)

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KR102244862B1 (ko) * 2020-08-04 2021-04-27 (주)원익머트리얼즈 식각 가스 혼합물과 이를 이용한 패턴 형성 방법
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JP7775835B2 (ja) * 2020-10-15 2025-11-26 株式会社レゾナック エッチングガス及びその製造方法、並びに、エッチング方法、半導体素子の製造方法
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KR20240003432A (ko) 2021-05-07 2024-01-09 도쿄엘렉트론가부시키가이샤 에칭 방법 및 에칭 장치
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Also Published As

Publication number Publication date
KR20230079491A (ko) 2023-06-07
CN106663624A (zh) 2017-05-10
TWI733431B (zh) 2021-07-11
US9892932B2 (en) 2018-02-13
KR20220124825A (ko) 2022-09-14
CN106663624B (zh) 2020-08-14
KR102444697B1 (ko) 2022-09-16
JP2017518645A (ja) 2017-07-06
TWI695423B (zh) 2020-06-01
CN111816559B (zh) 2024-06-11
KR102679289B1 (ko) 2024-06-27
EP3158579A4 (en) 2018-02-21
JP6485972B2 (ja) 2019-03-20
WO2015194178A1 (en) 2015-12-23
US10103031B2 (en) 2018-10-16
US20180366336A1 (en) 2018-12-20
US20180076046A1 (en) 2018-03-15
US10720335B2 (en) 2020-07-21
SG11201610342YA (en) 2017-01-27
KR20170020434A (ko) 2017-02-22
TW202030312A (zh) 2020-08-16
EP3158579A1 (en) 2017-04-26
KR102539241B1 (ko) 2023-06-01
TW201606867A (zh) 2016-02-16
CN111816559A (zh) 2020-10-23
US20170103901A1 (en) 2017-04-13
TW201929071A (zh) 2019-07-16

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