TWI652894B - 發熱體、振動裝置、電子機器及移動體 - Google Patents

發熱體、振動裝置、電子機器及移動體 Download PDF

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Publication number
TWI652894B
TWI652894B TW103144620A TW103144620A TWI652894B TW I652894 B TWI652894 B TW I652894B TW 103144620 A TW103144620 A TW 103144620A TW 103144620 A TW103144620 A TW 103144620A TW I652894 B TWI652894 B TW I652894B
Authority
TW
Taiwan
Prior art keywords
electrode
heating element
pad
region
semiconductor substrate
Prior art date
Application number
TW103144620A
Other languages
English (en)
Chinese (zh)
Other versions
TW201528679A (zh
Inventor
林謙司
福澤晃弘
Original Assignee
日商精工愛普生股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商精工愛普生股份有限公司 filed Critical 日商精工愛普生股份有限公司
Publication of TW201528679A publication Critical patent/TW201528679A/zh
Application granted granted Critical
Publication of TWI652894B publication Critical patent/TWI652894B/zh

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/08—Holders with means for regulating temperature
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
    • H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
    • H03L1/028—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only of generators comprising piezoelectric resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
    • H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
    • H03L1/04—Constructional details for maintaining temperature constant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Resistance Heating (AREA)
TW103144620A 2013-12-24 2014-12-19 發熱體、振動裝置、電子機器及移動體 TWI652894B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013265769A JP6341362B2 (ja) 2013-12-24 2013-12-24 発熱体、振動デバイス、電子機器及び移動体
JP2013-265769 2013-12-24

Publications (2)

Publication Number Publication Date
TW201528679A TW201528679A (zh) 2015-07-16
TWI652894B true TWI652894B (zh) 2019-03-01

Family

ID=53401232

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103144620A TWI652894B (zh) 2013-12-24 2014-12-19 發熱體、振動裝置、電子機器及移動體

Country Status (4)

Country Link
US (1) US10103708B2 (enExample)
JP (1) JP6341362B2 (enExample)
CN (1) CN104734635B (enExample)
TW (1) TWI652894B (enExample)

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* Cited by examiner, † Cited by third party
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CN104714325B (zh) * 2015-03-18 2017-09-19 深圳市华星光电技术有限公司 液晶显示器及其制备方法
JP6740572B2 (ja) * 2015-07-16 2020-08-19 セイコーエプソン株式会社 電子デバイス、電子機器、および基地局装置
JP6665487B2 (ja) * 2015-11-02 2020-03-13 セイコーエプソン株式会社 集積回路装置、電子デバイス、電子機器、および基地局
JP2017139682A (ja) 2016-02-05 2017-08-10 セイコーエプソン株式会社 振動片、振動片の製造方法、発振器、電子機器、移動体、および基地局
JPWO2018003920A1 (ja) * 2016-06-30 2019-02-21 日立金属株式会社 平面アンテナ、同時焼成セラミック基板および準ミリ波・ミリ波無線通信モジュール
JP6866588B2 (ja) * 2016-08-08 2021-04-28 セイコーエプソン株式会社 電子デバイス、電子デバイスの製造方法、電子機器および移動体
JP6873775B2 (ja) 2017-03-27 2021-05-19 旭化成エレクトロニクス株式会社 温度制御装置および発振装置
CN107241077B (zh) * 2017-05-12 2020-12-29 电子科技大学 一种压电薄膜体声波谐振器及其制备方法
JP7694069B2 (ja) 2021-03-11 2025-06-18 セイコーエプソン株式会社 集積回路装置及び発振器
JP2022143734A (ja) * 2021-03-18 2022-10-03 セイコーエプソン株式会社 半導体集積回路
EP4611480A1 (en) * 2024-03-01 2025-09-03 Nicoventures Trading Limited Aerosol provision device

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JPS62156850A (ja) * 1985-12-28 1987-07-11 Nec Corp 半導体装置
JPH05307045A (ja) * 1991-11-18 1993-11-19 Terumo Corp 流速センサ
JPH08279649A (ja) * 1995-04-05 1996-10-22 Mitsubishi Electric Corp 半導体レーザの製造方法，及び半導体レーザ
JPH09196682A (ja) * 1996-01-19 1997-07-31 Matsushita Electric Ind Co Ltd 角速度センサと加速度センサ
JPH1141032A (ja) 1997-07-23 1999-02-12 Chuniti Denki Kogyo Kk 水晶発振子の温度制御装置
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JP3822092B2 (ja) * 2001-10-30 2006-09-13 株式会社ルネサステクノロジ 半導体装置およびその製造方法
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Also Published As

Publication number Publication date
US10103708B2 (en) 2018-10-16
CN104734635B (zh) 2019-08-23
JP2015122426A (ja) 2015-07-02
US20150180444A1 (en) 2015-06-25
CN104734635A (zh) 2015-06-24
TW201528679A (zh) 2015-07-16
JP6341362B2 (ja) 2018-06-13

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