TWI652894B - 發熱體、振動裝置、電子機器及移動體 - Google Patents

發熱體、振動裝置、電子機器及移動體 Download PDF

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Publication number
TWI652894B
TWI652894B TW103144620A TW103144620A TWI652894B TW I652894 B TWI652894 B TW I652894B TW 103144620 A TW103144620 A TW 103144620A TW 103144620 A TW103144620 A TW 103144620A TW I652894 B TWI652894 B TW I652894B
Authority
TW
Taiwan
Prior art keywords
electrode
heating element
pad
region
semiconductor substrate
Prior art date
Application number
TW103144620A
Other languages
English (en)
Chinese (zh)
Other versions
TW201528679A (zh
Inventor
Kenji Hayashi
林謙司
Akihiro Fukuzawa
福澤晃弘
Original Assignee
Seiko Epson Corporation
日商精工愛普生股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corporation, 日商精工愛普生股份有限公司 filed Critical Seiko Epson Corporation
Publication of TW201528679A publication Critical patent/TW201528679A/zh
Application granted granted Critical
Publication of TWI652894B publication Critical patent/TWI652894B/zh

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/08—Holders with means for regulating temperature
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
    • H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
    • H03L1/028—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only of generators comprising piezoelectric resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
    • H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
    • H03L1/04—Constructional details for maintaining temperature constant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Resistance Heating (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
TW103144620A 2013-12-24 2014-12-19 發熱體、振動裝置、電子機器及移動體 TWI652894B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013265769A JP6341362B2 (ja) 2013-12-24 2013-12-24 発熱体、振動デバイス、電子機器及び移動体
JP2013-265769 2013-12-24

Publications (2)

Publication Number Publication Date
TW201528679A TW201528679A (zh) 2015-07-16
TWI652894B true TWI652894B (zh) 2019-03-01

Family

ID=53401232

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103144620A TWI652894B (zh) 2013-12-24 2014-12-19 發熱體、振動裝置、電子機器及移動體

Country Status (4)

Country Link
US (1) US10103708B2 (enExample)
JP (1) JP6341362B2 (enExample)
CN (1) CN104734635B (enExample)
TW (1) TWI652894B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104714325B (zh) * 2015-03-18 2017-09-19 深圳市华星光电技术有限公司 液晶显示器及其制备方法
JP6740572B2 (ja) * 2015-07-16 2020-08-19 セイコーエプソン株式会社 電子デバイス、電子機器、および基地局装置
JP6665487B2 (ja) * 2015-11-02 2020-03-13 セイコーエプソン株式会社 集積回路装置、電子デバイス、電子機器、および基地局
JP2017139682A (ja) * 2016-02-05 2017-08-10 セイコーエプソン株式会社 振動片、振動片の製造方法、発振器、電子機器、移動体、および基地局
WO2018003920A1 (ja) * 2016-06-30 2018-01-04 日立金属株式会社 平面アンテナ、同時焼成セラミック基板および準ミリ波・ミリ波無線通信モジュール
JP6866588B2 (ja) * 2016-08-08 2021-04-28 セイコーエプソン株式会社 電子デバイス、電子デバイスの製造方法、電子機器および移動体
JP6873775B2 (ja) 2017-03-27 2021-05-19 旭化成エレクトロニクス株式会社 温度制御装置および発振装置
CN107241077B (zh) * 2017-05-12 2020-12-29 电子科技大学 一种压电薄膜体声波谐振器及其制备方法
JP7694069B2 (ja) 2021-03-11 2025-06-18 セイコーエプソン株式会社 集積回路装置及び発振器
JP2022143734A (ja) * 2021-03-18 2022-10-03 セイコーエプソン株式会社 半導体集積回路
EP4611480A1 (en) * 2024-03-01 2025-09-03 Nicoventures Trading Limited Aerosol provision device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060033594A1 (en) 2004-03-04 2006-02-16 Markus Lutz Temperature controlled MEMS resonator and method for controlling resonator frequency
US8076983B2 (en) 2008-09-24 2011-12-13 Nihon Dempa Kogyo Co., Ltd. Constant-temperature type crystal oscillator

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1153497A (en) * 1966-07-25 1969-05-29 Associated Semiconductor Mft Improvements in and relating to Semiconductor Devices
JPS62156850A (ja) * 1985-12-28 1987-07-11 Nec Corp 半導体装置
JPH05307045A (ja) * 1991-11-18 1993-11-19 Terumo Corp 流速センサ
JPH08279649A (ja) * 1995-04-05 1996-10-22 Mitsubishi Electric Corp 半導体レーザの製造方法，及び半導体レーザ
JPH09196682A (ja) * 1996-01-19 1997-07-31 Matsushita Electric Ind Co Ltd 角速度センサと加速度センサ
JPH1141032A (ja) 1997-07-23 1999-02-12 Chuniti Denki Kogyo Kk 水晶発振子の温度制御装置
JP3248882B2 (ja) 1998-12-28 2002-01-21 東洋通信機株式会社 高安定圧電発振器の構造
JP3793555B2 (ja) 1999-05-31 2006-07-05 京セラ株式会社 円盤状ヒータ
JP4483138B2 (ja) 2001-02-09 2010-06-16 エプソントヨコム株式会社 高安定圧電発振器の構造
JP3822092B2 (ja) * 2001-10-30 2006-09-13 株式会社ルネサステクノロジ 半導体装置およびその製造方法
JP2005310494A (ja) 2004-04-20 2005-11-04 Harison Toshiba Lighting Corp ヒータ、加熱装置、画像形成装置
JP4354347B2 (ja) 2004-06-29 2009-10-28 日本電波工業株式会社 水晶発振器
JP2006153511A (ja) * 2004-11-25 2006-06-15 Matsushita Electric Works Ltd 湿度センサ
JP4804813B2 (ja) 2005-06-24 2011-11-02 日本電波工業株式会社 圧電発振器
TW200744314A (en) 2006-05-18 2007-12-01 Taitien Electronics Co Ltd Oscillator device capable of keeping constant temperature
JP5072396B2 (ja) * 2006-06-12 2012-11-14 株式会社リコー 抵抗素子調整方法、抵抗素子調整方法によって抵抗値及び温度依存特性が調整された抵抗素子、その抵抗素子を用いた電流発生装置
JP4641294B2 (ja) * 2006-08-29 2011-03-02 日本電波工業株式会社 恒温槽型水晶発振器
JP5331610B2 (ja) * 2008-12-03 2013-10-30 ルネサスエレクトロニクス株式会社 半導体集積回路装置
EP2228903B1 (en) * 2009-03-09 2011-11-16 Micro Crystal AG Oscillator device comprising a thermally-controlled piezoelectric resonator
US10033154B2 (en) * 2010-03-03 2018-07-24 Furukawa Electronic Co., Ltd. Semiconductor optical element, semiconductor laser element, and method for manufacturing semiconductor optical element and semiconductor laser element, and method for manufacturing semiconductor laser module and semiconductor element

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060033594A1 (en) 2004-03-04 2006-02-16 Markus Lutz Temperature controlled MEMS resonator and method for controlling resonator frequency
US7427905B2 (en) 2004-03-04 2008-09-23 Robert Bosch Gmbh Temperature controlled MEMS resonator and method for controlling resonator frequency
US8076983B2 (en) 2008-09-24 2011-12-13 Nihon Dempa Kogyo Co., Ltd. Constant-temperature type crystal oscillator

Also Published As

Publication number Publication date
CN104734635A (zh) 2015-06-24
TW201528679A (zh) 2015-07-16
JP6341362B2 (ja) 2018-06-13
JP2015122426A (ja) 2015-07-02
US10103708B2 (en) 2018-10-16
CN104734635B (zh) 2019-08-23
US20150180444A1 (en) 2015-06-25

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