CN104734635B - 发热体、振动器件、电子设备以及移动体 - Google Patents

发热体、振动器件、电子设备以及移动体 Download PDF

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Publication number
CN104734635B
CN104734635B CN201410766674.2A CN201410766674A CN104734635B CN 104734635 B CN104734635 B CN 104734635B CN 201410766674 A CN201410766674 A CN 201410766674A CN 104734635 B CN104734635 B CN 104734635B
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CN
China
Prior art keywords
electrode
region
heating element
semiconductor substrate
resistance layer
Prior art date
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Active
Application number
CN201410766674.2A
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English (en)
Chinese (zh)
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CN104734635A (zh
Inventor
林谦司
福泽晃弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
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Publication date
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Publication of CN104734635A publication Critical patent/CN104734635A/zh
Application granted granted Critical
Publication of CN104734635B publication Critical patent/CN104734635B/zh
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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/08—Holders with means for regulating temperature
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
    • H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
    • H03L1/028—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only of generators comprising piezoelectric resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
    • H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
    • H03L1/04—Constructional details for maintaining temperature constant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Resistance Heating (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
CN201410766674.2A 2013-12-24 2014-12-11 发热体、振动器件、电子设备以及移动体 Active CN104734635B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013265769A JP6341362B2 (ja) 2013-12-24 2013-12-24 発熱体、振動デバイス、電子機器及び移動体
JP2013-265769 2013-12-24

Publications (2)

Publication Number Publication Date
CN104734635A CN104734635A (zh) 2015-06-24
CN104734635B true CN104734635B (zh) 2019-08-23

Family

ID=53401232

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410766674.2A Active CN104734635B (zh) 2013-12-24 2014-12-11 发热体、振动器件、电子设备以及移动体

Country Status (4)

Country Link
US (1) US10103708B2 (enExample)
JP (1) JP6341362B2 (enExample)
CN (1) CN104734635B (enExample)
TW (1) TWI652894B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104714325B (zh) * 2015-03-18 2017-09-19 深圳市华星光电技术有限公司 液晶显示器及其制备方法
JP6740572B2 (ja) * 2015-07-16 2020-08-19 セイコーエプソン株式会社 電子デバイス、電子機器、および基地局装置
JP6665487B2 (ja) * 2015-11-02 2020-03-13 セイコーエプソン株式会社 集積回路装置、電子デバイス、電子機器、および基地局
JP2017139682A (ja) * 2016-02-05 2017-08-10 セイコーエプソン株式会社 振動片、振動片の製造方法、発振器、電子機器、移動体、および基地局
WO2018003920A1 (ja) * 2016-06-30 2018-01-04 日立金属株式会社 平面アンテナ、同時焼成セラミック基板および準ミリ波・ミリ波無線通信モジュール
JP6866588B2 (ja) * 2016-08-08 2021-04-28 セイコーエプソン株式会社 電子デバイス、電子デバイスの製造方法、電子機器および移動体
JP6873775B2 (ja) 2017-03-27 2021-05-19 旭化成エレクトロニクス株式会社 温度制御装置および発振装置
CN107241077B (zh) * 2017-05-12 2020-12-29 电子科技大学 一种压电薄膜体声波谐振器及其制备方法
JP7694069B2 (ja) 2021-03-11 2025-06-18 セイコーエプソン株式会社 集積回路装置及び発振器
JP2022143734A (ja) * 2021-03-18 2022-10-03 セイコーエプソン株式会社 半導体集積回路
EP4611480A1 (en) * 2024-03-01 2025-09-03 Nicoventures Trading Limited Aerosol provision device

Citations (1)

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CN101895270A (zh) * 2009-03-09 2010-11-24 微晶公司 包括热控压电谐振器的振荡器装置

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JPS62156850A (ja) * 1985-12-28 1987-07-11 Nec Corp 半導体装置
JPH05307045A (ja) * 1991-11-18 1993-11-19 Terumo Corp 流速センサ
JPH08279649A (ja) * 1995-04-05 1996-10-22 Mitsubishi Electric Corp 半導体レーザの製造方法,及び半導体レーザ
JPH09196682A (ja) * 1996-01-19 1997-07-31 Matsushita Electric Ind Co Ltd 角速度センサと加速度センサ
JPH1141032A (ja) 1997-07-23 1999-02-12 Chuniti Denki Kogyo Kk 水晶発振子の温度制御装置
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JP4483138B2 (ja) 2001-02-09 2010-06-16 エプソントヨコム株式会社 高安定圧電発振器の構造
JP3822092B2 (ja) * 2001-10-30 2006-09-13 株式会社ルネサステクノロジ 半導体装置およびその製造方法
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JP2005310494A (ja) 2004-04-20 2005-11-04 Harison Toshiba Lighting Corp ヒータ、加熱装置、画像形成装置
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Also Published As

Publication number Publication date
CN104734635A (zh) 2015-06-24
TW201528679A (zh) 2015-07-16
JP6341362B2 (ja) 2018-06-13
JP2015122426A (ja) 2015-07-02
US10103708B2 (en) 2018-10-16
TWI652894B (zh) 2019-03-01
US20150180444A1 (en) 2015-06-25

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