TWI648669B - 形成用於電容觸控感測器之電極結構之方法 - Google Patents

形成用於電容觸控感測器之電極結構之方法 Download PDF

Info

Publication number
TWI648669B
TWI648669B TW103105942A TW103105942A TWI648669B TW I648669 B TWI648669 B TW I648669B TW 103105942 A TW103105942 A TW 103105942A TW 103105942 A TW103105942 A TW 103105942A TW I648669 B TWI648669 B TW I648669B
Authority
TW
Taiwan
Prior art keywords
layer
conductive layer
transparent conductive
glass substrate
transparent
Prior art date
Application number
TW103105942A
Other languages
English (en)
Chinese (zh)
Other versions
TW201439873A (zh
Inventor
里歐 卡米洛 皮爾托
陳旭鈞
Original Assignee
英商萬佳雷射有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 英商萬佳雷射有限公司 filed Critical 英商萬佳雷射有限公司
Publication of TW201439873A publication Critical patent/TW201439873A/zh
Application granted granted Critical
Publication of TWI648669B publication Critical patent/TWI648669B/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Position Input By Displaying (AREA)
  • Liquid Crystal (AREA)
  • Laminated Bodies (AREA)
TW103105942A 2013-02-21 2014-02-21 形成用於電容觸控感測器之電極結構之方法 TWI648669B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1303074.7A GB2511064A (en) 2013-02-21 2013-02-21 Method of forming electrode structure for capacitive touch sensor
??1303074.7 2013-02-21

Publications (2)

Publication Number Publication Date
TW201439873A TW201439873A (zh) 2014-10-16
TWI648669B true TWI648669B (zh) 2019-01-21

Family

ID=48091863

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103105942A TWI648669B (zh) 2013-02-21 2014-02-21 形成用於電容觸控感測器之電極結構之方法

Country Status (8)

Country Link
US (1) US10421157B2 (enExample)
EP (1) EP2958705B1 (enExample)
JP (1) JP6227012B2 (enExample)
KR (1) KR20150122179A (enExample)
CN (1) CN105073334B (enExample)
GB (1) GB2511064A (enExample)
TW (1) TWI648669B (enExample)
WO (1) WO2014128441A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2511064A (en) 2013-02-21 2014-08-27 M Solv Ltd Method of forming electrode structure for capacitive touch sensor
GB2514084B (en) 2013-02-21 2016-07-27 M-Solv Ltd Method of forming an electrode structure for capacitive touch sensor
GB2551502A (en) * 2016-06-17 2017-12-27 M-Solv Ltd Apparatus and methods for manufacturing a sensor and a display, and a sensor and a display
KR102663715B1 (ko) * 2016-11-15 2024-05-16 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
US11054948B2 (en) * 2018-10-05 2021-07-06 Apple Inc. Light transmissivity-controlled touch sensor panel design
CN114178710B (zh) * 2020-08-24 2024-11-26 奥特斯(中国)有限公司 部件承载件及其制造方法
US11648627B2 (en) 2021-05-25 2023-05-16 Tpk Advanced Solutions Inc. Touch display device and formation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201000966A (en) * 2008-06-25 2010-01-01 Au Optronics Corp Touch display panel, color filter of and fabricating method thereof
TW201106240A (en) * 2009-08-11 2011-02-16 M Solv Ltd Capactive touch panels
TW201142418A (en) * 2010-05-20 2011-12-01 Unidisplay Inc Touch-sensing display panel and color filter touch-sensing substrate
US20120113063A1 (en) * 2010-11-10 2012-05-10 Samsung Electro-Mechanics Co., Ltd. Touch panel and a manufacturing method the same
TW201246448A (en) * 2011-03-31 2012-11-16 Electro Scient Ind Inc Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
TW201246388A (en) * 2011-04-27 2012-11-16 Ray Star Technology Xiamen Inc Film layer etching method and laser lithographic machine

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3371304B2 (ja) 1994-07-25 2003-01-27 セイコーエプソン株式会社 レーザ加工装置及びレーザ加工方法並びに液晶パネル
JP3483969B2 (ja) * 1995-01-27 2004-01-06 株式会社東芝 液晶ディスプレイ用レーザリペア方法及びその装置並びにアクティブマトリクス型液晶ディスプレイの製造方法
JP3997450B2 (ja) 1998-03-13 2007-10-24 ソニー株式会社 波長変換装置
US6706998B2 (en) 2002-01-11 2004-03-16 Electro Scientific Industries, Inc. Simulated laser spot enlargement
AU2003214818A1 (en) 2002-01-11 2003-07-30 Electro Scientific Industries, Inc. Method for laser machining a workpiece with laser spot enlargement
KR100904520B1 (ko) * 2002-10-31 2009-06-25 엘지디스플레이 주식회사 액정표시장치용 컬러필터 기판과 그 제조방법
JP2004344928A (ja) 2003-05-22 2004-12-09 Alps Electric Co Ltd 反射体製造装置及び反射体の製造方法
US7057135B2 (en) * 2004-03-04 2006-06-06 Matsushita Electric Industrial, Co. Ltd. Method of precise laser nanomachining with UV ultrafast laser pulses
US7804043B2 (en) 2004-06-15 2010-09-28 Laserfacturing Inc. Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser
JP2006123004A (ja) * 2004-09-29 2006-05-18 Mitsubishi Materials Corp レーザ加工方法及びレーザ加工装置
JP4641172B2 (ja) * 2004-10-18 2011-03-02 大日本印刷株式会社 Ｉｔｏ膜のパターンニング方法
JP2006119446A (ja) * 2004-10-22 2006-05-11 Toshiba Matsushita Display Technology Co Ltd 液晶表示装置
WO2006127436A1 (en) * 2005-05-20 2006-11-30 Electro Scientific Industries, Inc. Method of forming passive electronic components on a substrate by direct write technique using shaped uniform laser beam
US9138913B2 (en) 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US7605343B2 (en) * 2006-05-24 2009-10-20 Electro Scientific Industries, Inc. Micromachining with short-pulsed, solid-state UV laser
JP4752033B2 (ja) * 2006-09-29 2011-08-17 グンゼ株式会社 タッチパネル及びタッチパネルの製造方法
JP4866778B2 (ja) 2007-04-24 2012-02-01 住友重機械工業株式会社 ビーム照射装置、及び、ビーム照射方法
JP4914309B2 (ja) * 2007-08-24 2012-04-11 グンゼ株式会社 基板製造方法及び基板を用いた静電容量式タッチパネル
KR101009672B1 (ko) * 2008-09-12 2011-01-19 엘지디스플레이 주식회사 터치 패널 내장형 액정 표시 장치
CN201380363Y (zh) 2008-12-30 2010-01-13 武汉楚天激光（集团）股份有限公司 用于激光刻膜的激光设备
GB0900036D0 (en) 2009-01-03 2009-02-11 M Solv Ltd Method and apparatus for forming grooves with complex shape in the surface of apolymer
US8518277B2 (en) 2009-02-12 2013-08-27 Tpk Touch Solutions Inc. Plastic capacitive touch screen and method of manufacturing same
JP5252309B2 (ja) * 2009-08-21 2013-07-31 凸版印刷株式会社 タッチパネル電極付カラーフィルタ基板の製造方法
CN201645056U (zh) 2009-09-28 2010-11-24 深圳市大族激光科技股份有限公司 激光加工装置
US20120074109A1 (en) 2010-09-29 2012-03-29 General Electric Company Method and system for scribing a multilayer panel
JP2012123744A (ja) 2010-12-10 2012-06-28 Shin Etsu Polymer Co Ltd 静電容量式入力装置およびその製造方法、静電容量式入力装置の入力方法
GB2487962B (en) * 2011-02-11 2016-10-12 M-Solv Ltd Method for making a two-layer capacitive touch sensor panel
JP2012174578A (ja) * 2011-02-23 2012-09-10 Gunze Ltd 透明電極フィルムおよび透明タッチパネル
US9029242B2 (en) * 2011-06-15 2015-05-12 Applied Materials, Inc. Damage isolation by shaped beam delivery in laser scribing process
US8652940B2 (en) 2012-04-10 2014-02-18 Applied Materials, Inc. Wafer dicing used hybrid multi-step laser scribing process with plasma etch
CN202736018U (zh) 2012-09-14 2013-02-13 深圳市鹏扬达数码科技有限公司 高灵敏度大尺寸电容式内嵌触摸屏
GB2511064A (en) 2013-02-21 2014-08-27 M Solv Ltd Method of forming electrode structure for capacitive touch sensor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201000966A (en) * 2008-06-25 2010-01-01 Au Optronics Corp Touch display panel, color filter of and fabricating method thereof
TW201106240A (en) * 2009-08-11 2011-02-16 M Solv Ltd Capactive touch panels
TW201142418A (en) * 2010-05-20 2011-12-01 Unidisplay Inc Touch-sensing display panel and color filter touch-sensing substrate
US20120113063A1 (en) * 2010-11-10 2012-05-10 Samsung Electro-Mechanics Co., Ltd. Touch panel and a manufacturing method the same
TW201246448A (en) * 2011-03-31 2012-11-16 Electro Scient Ind Inc Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
TW201246388A (en) * 2011-04-27 2012-11-16 Ray Star Technology Xiamen Inc Film layer etching method and laser lithographic machine

Also Published As

Publication number Publication date
JP2016518252A (ja) 2016-06-23
CN105073334A (zh) 2015-11-18
JP6227012B2 (ja) 2017-11-08
GB2511064A (en) 2014-08-27
US10421157B2 (en) 2019-09-24
CN105073334B (zh) 2018-01-16
KR20150122179A (ko) 2015-10-30
GB201303074D0 (en) 2013-04-10
TW201439873A (zh) 2014-10-16
EP2958705B1 (en) 2019-08-28
US20150375341A1 (en) 2015-12-31
EP2958705A1 (en) 2015-12-30
WO2014128441A1 (en) 2014-08-28

Similar Documents

Publication Publication Date Title
TWI648669B (zh) 形成用於電容觸控感測器之電極結構之方法
US9784904B2 (en) Display substrate, display apparatus having the same, and fabricating method thereof
KR101704536B1 (ko) 슬림형 터치 패널 및 이를 포함하는 휴대 단말기
RU2510063C1 (ru) Жидкокристаллическое устройство отображения и способ его изготовления
JP4260219B2 (ja) 表示パネルの製造方法、表示パネルの製造装置、及び表示パネル
JP6326238B2 (ja) 表示装置
CN109037296B (zh) 一种显示装置及电子设备
US9292141B2 (en) Double sided touch sensor on transparent substrate
TWI599819B (zh) 光控制裝置、包含該光控制裝置的透明顯示裝置、及製造該光控制裝置的方法
WO2017000502A1 (en) Display device and method of manufacturing thereof
US20130241871A1 (en) Touch panel and manufacturing method thereof
TWI656933B (zh) 形成用於電容觸控感測器之電極結構之方法及執行該方法之設備
CN103676227A (zh) 显示装置以及罩部件
US20180095322A1 (en) Color Filter Substrate, Array Substrate, Display Panel and Display Device
WO2015188539A1 (zh) 光栅基板及其制作方法、显示装置
CN105278188A (zh) 液晶显示器及其制造方法
TW201629589A (zh) 帶有電極之彩色濾光片基板、含有該基板之顯示裝置、以及該基板之製造方法
JP4967689B2 (ja) 露光方法、露光装置、及び半透過型液晶表示装置用カラーフィルタの製造方法
GB2506347A (en) Forming an electrode structure for a capacitive touch sensor by laser ablation
TW201501139A (zh) 透明導電性膜之製造方法、透明導電性膜及輸入裝置
KR20070050685A (ko) 컬러 필터 기판의 제조 방법 및 이를 포함하는 액정 표시장치의 제조 방법

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees