KR20150122179A - 용량성 터치 센서용 전극 구조를 형성하는 방법 - Google Patents
용량성 터치 센서용 전극 구조를 형성하는 방법 Download PDFInfo
- Publication number
- KR20150122179A KR20150122179A KR1020157025579A KR20157025579A KR20150122179A KR 20150122179 A KR20150122179 A KR 20150122179A KR 1020157025579 A KR1020157025579 A KR 1020157025579A KR 20157025579 A KR20157025579 A KR 20157025579A KR 20150122179 A KR20150122179 A KR 20150122179A
- Authority
- KR
- South Korea
- Prior art keywords
- conductive layer
- layer
- transparent conductive
- transparent
- glass substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Liquid Crystal (AREA)
- Position Input By Displaying (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1303074.7 | 2013-02-21 | ||
| GB1303074.7A GB2511064A (en) | 2013-02-21 | 2013-02-21 | Method of forming electrode structure for capacitive touch sensor |
| PCT/GB2014/050440 WO2014128441A1 (en) | 2013-02-21 | 2014-02-14 | Method for forming an electrode structure for a capacitive touch sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20150122179A true KR20150122179A (ko) | 2015-10-30 |
Family
ID=48091863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020157025579A Withdrawn KR20150122179A (ko) | 2013-02-21 | 2014-02-14 | 용량성 터치 센서용 전극 구조를 형성하는 방법 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10421157B2 (enExample) |
| EP (1) | EP2958705B1 (enExample) |
| JP (1) | JP6227012B2 (enExample) |
| KR (1) | KR20150122179A (enExample) |
| CN (1) | CN105073334B (enExample) |
| GB (1) | GB2511064A (enExample) |
| TW (1) | TWI648669B (enExample) |
| WO (1) | WO2014128441A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2511064A (en) | 2013-02-21 | 2014-08-27 | M Solv Ltd | Method of forming electrode structure for capacitive touch sensor |
| GB2514084B (en) | 2013-02-21 | 2016-07-27 | M-Solv Ltd | Method of forming an electrode structure for capacitive touch sensor |
| GB2551502A (en) * | 2016-06-17 | 2017-12-27 | M-Solv Ltd | Apparatus and methods for manufacturing a sensor and a display, and a sensor and a display |
| KR102663715B1 (ko) * | 2016-11-15 | 2024-05-16 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
| US11054948B2 (en) * | 2018-10-05 | 2021-07-06 | Apple Inc. | Light transmissivity-controlled touch sensor panel design |
| CN114178710B (zh) * | 2020-08-24 | 2024-11-26 | 奥特斯(中国)有限公司 | 部件承载件及其制造方法 |
| US11648627B2 (en) | 2021-05-25 | 2023-05-16 | Tpk Advanced Solutions Inc. | Touch display device and formation method thereof |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3371304B2 (ja) | 1994-07-25 | 2003-01-27 | セイコーエプソン株式会社 | レーザ加工装置及びレーザ加工方法並びに液晶パネル |
| JP3483969B2 (ja) * | 1995-01-27 | 2004-01-06 | 株式会社東芝 | 液晶ディスプレイ用レーザリペア方法及びその装置並びにアクティブマトリクス型液晶ディスプレイの製造方法 |
| JP3997450B2 (ja) | 1998-03-13 | 2007-10-24 | ソニー株式会社 | 波長変換装置 |
| WO2003059568A1 (en) | 2002-01-11 | 2003-07-24 | Electro Scientific Industries, Inc. | Method for laser machining a workpiece with laser spot enlargement |
| US6706998B2 (en) | 2002-01-11 | 2004-03-16 | Electro Scientific Industries, Inc. | Simulated laser spot enlargement |
| KR100904520B1 (ko) * | 2002-10-31 | 2009-06-25 | 엘지디스플레이 주식회사 | 액정표시장치용 컬러필터 기판과 그 제조방법 |
| JP2004344928A (ja) | 2003-05-22 | 2004-12-09 | Alps Electric Co Ltd | 反射体製造装置及び反射体の製造方法 |
| US7057135B2 (en) * | 2004-03-04 | 2006-06-06 | Matsushita Electric Industrial, Co. Ltd. | Method of precise laser nanomachining with UV ultrafast laser pulses |
| US7804043B2 (en) | 2004-06-15 | 2010-09-28 | Laserfacturing Inc. | Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser |
| JP2006123004A (ja) * | 2004-09-29 | 2006-05-18 | Mitsubishi Materials Corp | レーザ加工方法及びレーザ加工装置 |
| JP4641172B2 (ja) * | 2004-10-18 | 2011-03-02 | 大日本印刷株式会社 | Ito膜のパターンニング方法 |
| JP2006119446A (ja) * | 2004-10-22 | 2006-05-11 | Toshiba Matsushita Display Technology Co Ltd | 液晶表示装置 |
| US20060261924A1 (en) * | 2005-05-20 | 2006-11-23 | Swenson Edward J | Method of forming passive electronic components on a substrate by direct write technique using shaped uniform laser beam |
| US9138913B2 (en) | 2005-09-08 | 2015-09-22 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
| US7605343B2 (en) * | 2006-05-24 | 2009-10-20 | Electro Scientific Industries, Inc. | Micromachining with short-pulsed, solid-state UV laser |
| JP4752033B2 (ja) * | 2006-09-29 | 2011-08-17 | グンゼ株式会社 | タッチパネル及びタッチパネルの製造方法 |
| JP4866778B2 (ja) | 2007-04-24 | 2012-02-01 | 住友重機械工業株式会社 | ビーム照射装置、及び、ビーム照射方法 |
| JP4914309B2 (ja) * | 2007-08-24 | 2012-04-11 | グンゼ株式会社 | 基板製造方法及び基板を用いた静電容量式タッチパネル |
| TWI393924B (zh) | 2008-06-25 | 2013-04-21 | Au Optronics Corp | 觸控式顯示面板、彩色濾光片及其製作方法 |
| KR101009672B1 (ko) * | 2008-09-12 | 2011-01-19 | 엘지디스플레이 주식회사 | 터치 패널 내장형 액정 표시 장치 |
| CN201380363Y (zh) | 2008-12-30 | 2010-01-13 | 武汉楚天激光(集团)股份有限公司 | 用于激光刻膜的激光设备 |
| GB0900036D0 (en) * | 2009-01-03 | 2009-02-11 | M Solv Ltd | Method and apparatus for forming grooves with complex shape in the surface of apolymer |
| WO2010093779A1 (en) | 2009-02-12 | 2010-08-19 | Optera, Inc. | Plastic capacitive touch screen and method of manufacturing same |
| GB2472613B (en) | 2009-08-11 | 2015-06-03 | M Solv Ltd | Capacitive touch panels |
| JP5252309B2 (ja) * | 2009-08-21 | 2013-07-31 | 凸版印刷株式会社 | タッチパネル電極付カラーフィルタ基板の製造方法 |
| CN201645056U (zh) | 2009-09-28 | 2010-11-24 | 深圳市大族激光科技股份有限公司 | 激光加工装置 |
| TW201142418A (en) | 2010-05-20 | 2011-12-01 | Unidisplay Inc | Touch-sensing display panel and color filter touch-sensing substrate |
| US20120074109A1 (en) | 2010-09-29 | 2012-03-29 | General Electric Company | Method and system for scribing a multilayer panel |
| KR20120050169A (ko) | 2010-11-10 | 2012-05-18 | 삼성전기주식회사 | 터치패널 및 그 제조방법 |
| JP2012123744A (ja) | 2010-12-10 | 2012-06-28 | Shin Etsu Polymer Co Ltd | 静電容量式入力装置およびその製造方法、静電容量式入力装置の入力方法 |
| GB2487962B (en) | 2011-02-11 | 2016-10-12 | M-Solv Ltd | Method for making a two-layer capacitive touch sensor panel |
| JP2012174578A (ja) * | 2011-02-23 | 2012-09-10 | Gunze Ltd | 透明電極フィルムおよび透明タッチパネル |
| US8648277B2 (en) | 2011-03-31 | 2014-02-11 | Electro Scientific Industries, Inc. | Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies |
| CN102759863B (zh) | 2011-04-27 | 2015-12-02 | 瑞世达科技(厦门)有限公司 | 激光光刻机 |
| US9029242B2 (en) * | 2011-06-15 | 2015-05-12 | Applied Materials, Inc. | Damage isolation by shaped beam delivery in laser scribing process |
| US8652940B2 (en) | 2012-04-10 | 2014-02-18 | Applied Materials, Inc. | Wafer dicing used hybrid multi-step laser scribing process with plasma etch |
| CN202736018U (zh) * | 2012-09-14 | 2013-02-13 | 深圳市鹏扬达数码科技有限公司 | 高灵敏度大尺寸电容式内嵌触摸屏 |
| GB2511064A (en) | 2013-02-21 | 2014-08-27 | M Solv Ltd | Method of forming electrode structure for capacitive touch sensor |
-
2013
- 2013-02-21 GB GB1303074.7A patent/GB2511064A/en not_active Withdrawn
-
2014
- 2014-02-14 WO PCT/GB2014/050440 patent/WO2014128441A1/en not_active Ceased
- 2014-02-14 KR KR1020157025579A patent/KR20150122179A/ko not_active Withdrawn
- 2014-02-14 JP JP2015558542A patent/JP6227012B2/ja not_active Expired - Fee Related
- 2014-02-14 CN CN201480009368.2A patent/CN105073334B/zh active Active
- 2014-02-14 US US14/769,412 patent/US10421157B2/en not_active Expired - Fee Related
- 2014-02-14 EP EP14705405.0A patent/EP2958705B1/en active Active
- 2014-02-21 TW TW103105942A patent/TWI648669B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN105073334A (zh) | 2015-11-18 |
| WO2014128441A1 (en) | 2014-08-28 |
| US20150375341A1 (en) | 2015-12-31 |
| EP2958705B1 (en) | 2019-08-28 |
| EP2958705A1 (en) | 2015-12-30 |
| GB201303074D0 (en) | 2013-04-10 |
| TW201439873A (zh) | 2014-10-16 |
| JP6227012B2 (ja) | 2017-11-08 |
| US10421157B2 (en) | 2019-09-24 |
| CN105073334B (zh) | 2018-01-16 |
| GB2511064A (en) | 2014-08-27 |
| TWI648669B (zh) | 2019-01-21 |
| JP2016518252A (ja) | 2016-06-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20150917 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20190212 Comment text: Request for Examination of Application |
|
| PC1202 | Submission of document of withdrawal before decision of registration |
Comment text: [Withdrawal of Procedure relating to Patent, etc.] Withdrawal (Abandonment) Patent event code: PC12021R01D Patent event date: 20200624 |
|
| WITB | Written withdrawal of application |