KR20150122179A - 용량성 터치 센서용 전극 구조를 형성하는 방법 - Google Patents

용량성 터치 센서용 전극 구조를 형성하는 방법 Download PDF

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Publication number
KR20150122179A
KR20150122179A KR1020157025579A KR20157025579A KR20150122179A KR 20150122179 A KR20150122179 A KR 20150122179A KR 1020157025579 A KR1020157025579 A KR 1020157025579A KR 20157025579 A KR20157025579 A KR 20157025579A KR 20150122179 A KR20150122179 A KR 20150122179A
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KR
South Korea
Prior art keywords
conductive layer
layer
transparent conductive
transparent
glass substrate
Prior art date
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Withdrawn
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KR1020157025579A
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English (en)
Korean (ko)
Inventor
윅 관 찬
리오 카밀로 프리에토
Original Assignee
엠-솔브 리미티드
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Publication of KR20150122179A publication Critical patent/KR20150122179A/ko
Withdrawn legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/361Removing material for deburring or mechanical trimming
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • B23K26/402Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412Digitisers structurally integrated in a display
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Liquid Crystal (AREA)
  • Position Input By Displaying (AREA)
  • Laminated Bodies (AREA)
KR1020157025579A 2013-02-21 2014-02-14 용량성 터치 센서용 전극 구조를 형성하는 방법 Withdrawn KR20150122179A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1303074.7 2013-02-21
GB1303074.7A GB2511064A (en) 2013-02-21 2013-02-21 Method of forming electrode structure for capacitive touch sensor
PCT/GB2014/050440 WO2014128441A1 (en) 2013-02-21 2014-02-14 Method for forming an electrode structure for a capacitive touch sensor

Publications (1)

Publication Number Publication Date
KR20150122179A true KR20150122179A (ko) 2015-10-30

Family

ID=48091863

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157025579A Withdrawn KR20150122179A (ko) 2013-02-21 2014-02-14 용량성 터치 센서용 전극 구조를 형성하는 방법

Country Status (8)

Country Link
US (1) US10421157B2 (enExample)
EP (1) EP2958705B1 (enExample)
JP (1) JP6227012B2 (enExample)
KR (1) KR20150122179A (enExample)
CN (1) CN105073334B (enExample)
GB (1) GB2511064A (enExample)
TW (1) TWI648669B (enExample)
WO (1) WO2014128441A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2511064A (en) 2013-02-21 2014-08-27 M Solv Ltd Method of forming electrode structure for capacitive touch sensor
GB2514084B (en) 2013-02-21 2016-07-27 M-Solv Ltd Method of forming an electrode structure for capacitive touch sensor
GB2551502A (en) * 2016-06-17 2017-12-27 M-Solv Ltd Apparatus and methods for manufacturing a sensor and a display, and a sensor and a display
KR102663715B1 (ko) * 2016-11-15 2024-05-16 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
US11054948B2 (en) * 2018-10-05 2021-07-06 Apple Inc. Light transmissivity-controlled touch sensor panel design
CN114178710B (zh) * 2020-08-24 2024-11-26 奥特斯(中国)有限公司 部件承载件及其制造方法
US11648627B2 (en) 2021-05-25 2023-05-16 Tpk Advanced Solutions Inc. Touch display device and formation method thereof

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3371304B2 (ja) 1994-07-25 2003-01-27 セイコーエプソン株式会社 レーザ加工装置及びレーザ加工方法並びに液晶パネル
JP3483969B2 (ja) * 1995-01-27 2004-01-06 株式会社東芝 液晶ディスプレイ用レーザリペア方法及びその装置並びにアクティブマトリクス型液晶ディスプレイの製造方法
JP3997450B2 (ja) 1998-03-13 2007-10-24 ソニー株式会社 波長変換装置
WO2003059568A1 (en) 2002-01-11 2003-07-24 Electro Scientific Industries, Inc. Method for laser machining a workpiece with laser spot enlargement
US6706998B2 (en) 2002-01-11 2004-03-16 Electro Scientific Industries, Inc. Simulated laser spot enlargement
KR100904520B1 (ko) * 2002-10-31 2009-06-25 엘지디스플레이 주식회사 액정표시장치용 컬러필터 기판과 그 제조방법
JP2004344928A (ja) 2003-05-22 2004-12-09 Alps Electric Co Ltd 反射体製造装置及び反射体の製造方法
US7057135B2 (en) * 2004-03-04 2006-06-06 Matsushita Electric Industrial, Co. Ltd. Method of precise laser nanomachining with UV ultrafast laser pulses
US7804043B2 (en) 2004-06-15 2010-09-28 Laserfacturing Inc. Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser
JP2006123004A (ja) * 2004-09-29 2006-05-18 Mitsubishi Materials Corp レーザ加工方法及びレーザ加工装置
JP4641172B2 (ja) * 2004-10-18 2011-03-02 大日本印刷株式会社 Ito膜のパターンニング方法
JP2006119446A (ja) * 2004-10-22 2006-05-11 Toshiba Matsushita Display Technology Co Ltd 液晶表示装置
US20060261924A1 (en) * 2005-05-20 2006-11-23 Swenson Edward J Method of forming passive electronic components on a substrate by direct write technique using shaped uniform laser beam
US9138913B2 (en) 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US7605343B2 (en) * 2006-05-24 2009-10-20 Electro Scientific Industries, Inc. Micromachining with short-pulsed, solid-state UV laser
JP4752033B2 (ja) * 2006-09-29 2011-08-17 グンゼ株式会社 タッチパネル及びタッチパネルの製造方法
JP4866778B2 (ja) 2007-04-24 2012-02-01 住友重機械工業株式会社 ビーム照射装置、及び、ビーム照射方法
JP4914309B2 (ja) * 2007-08-24 2012-04-11 グンゼ株式会社 基板製造方法及び基板を用いた静電容量式タッチパネル
TWI393924B (zh) 2008-06-25 2013-04-21 Au Optronics Corp 觸控式顯示面板、彩色濾光片及其製作方法
KR101009672B1 (ko) * 2008-09-12 2011-01-19 엘지디스플레이 주식회사 터치 패널 내장형 액정 표시 장치
CN201380363Y (zh) 2008-12-30 2010-01-13 武汉楚天激光(集团)股份有限公司 用于激光刻膜的激光设备
GB0900036D0 (en) * 2009-01-03 2009-02-11 M Solv Ltd Method and apparatus for forming grooves with complex shape in the surface of apolymer
WO2010093779A1 (en) 2009-02-12 2010-08-19 Optera, Inc. Plastic capacitive touch screen and method of manufacturing same
GB2472613B (en) 2009-08-11 2015-06-03 M Solv Ltd Capacitive touch panels
JP5252309B2 (ja) * 2009-08-21 2013-07-31 凸版印刷株式会社 タッチパネル電極付カラーフィルタ基板の製造方法
CN201645056U (zh) 2009-09-28 2010-11-24 深圳市大族激光科技股份有限公司 激光加工装置
TW201142418A (en) 2010-05-20 2011-12-01 Unidisplay Inc Touch-sensing display panel and color filter touch-sensing substrate
US20120074109A1 (en) 2010-09-29 2012-03-29 General Electric Company Method and system for scribing a multilayer panel
KR20120050169A (ko) 2010-11-10 2012-05-18 삼성전기주식회사 터치패널 및 그 제조방법
JP2012123744A (ja) 2010-12-10 2012-06-28 Shin Etsu Polymer Co Ltd 静電容量式入力装置およびその製造方法、静電容量式入力装置の入力方法
GB2487962B (en) 2011-02-11 2016-10-12 M-Solv Ltd Method for making a two-layer capacitive touch sensor panel
JP2012174578A (ja) * 2011-02-23 2012-09-10 Gunze Ltd 透明電極フィルムおよび透明タッチパネル
US8648277B2 (en) 2011-03-31 2014-02-11 Electro Scientific Industries, Inc. Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
CN102759863B (zh) 2011-04-27 2015-12-02 瑞世达科技(厦门)有限公司 激光光刻机
US9029242B2 (en) * 2011-06-15 2015-05-12 Applied Materials, Inc. Damage isolation by shaped beam delivery in laser scribing process
US8652940B2 (en) 2012-04-10 2014-02-18 Applied Materials, Inc. Wafer dicing used hybrid multi-step laser scribing process with plasma etch
CN202736018U (zh) * 2012-09-14 2013-02-13 深圳市鹏扬达数码科技有限公司 高灵敏度大尺寸电容式内嵌触摸屏
GB2511064A (en) 2013-02-21 2014-08-27 M Solv Ltd Method of forming electrode structure for capacitive touch sensor

Also Published As

Publication number Publication date
CN105073334A (zh) 2015-11-18
WO2014128441A1 (en) 2014-08-28
US20150375341A1 (en) 2015-12-31
EP2958705B1 (en) 2019-08-28
EP2958705A1 (en) 2015-12-30
GB201303074D0 (en) 2013-04-10
TW201439873A (zh) 2014-10-16
JP6227012B2 (ja) 2017-11-08
US10421157B2 (en) 2019-09-24
CN105073334B (zh) 2018-01-16
GB2511064A (en) 2014-08-27
TWI648669B (zh) 2019-01-21
JP2016518252A (ja) 2016-06-23

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Patent event date: 20150917

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Patent event code: PC12021R01D

Patent event date: 20200624

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