GB2511064A - Method of forming electrode structure for capacitive touch sensor - Google Patents

Method of forming electrode structure for capacitive touch sensor Download PDF

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Publication number
GB2511064A
GB2511064A GB1303074.7A GB201303074A GB2511064A GB 2511064 A GB2511064 A GB 2511064A GB 201303074 A GB201303074 A GB 201303074A GB 2511064 A GB2511064 A GB 2511064A
Authority
GB
United Kingdom
Prior art keywords
conductive layer
layer
transparent
transparent conductive
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB1303074.7A
Other languages
English (en)
Other versions
GB201303074D0 (en
Inventor
Camilo Prieto Rio
Yuk Kwan Chan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
M Solv Ltd
Original Assignee
M Solv Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M Solv Ltd filed Critical M Solv Ltd
Priority to GB1303074.7A priority Critical patent/GB2511064A/en
Publication of GB201303074D0 publication Critical patent/GB201303074D0/en
Priority to PCT/GB2014/050440 priority patent/WO2014128441A1/en
Priority to EP14705405.0A priority patent/EP2958705B1/en
Priority to KR1020157025579A priority patent/KR20150122179A/ko
Priority to JP2015558542A priority patent/JP6227012B2/ja
Priority to US14/769,412 priority patent/US10421157B2/en
Priority to CN201480009368.2A priority patent/CN105073334B/zh
Priority to TW103105942A priority patent/TWI648669B/zh
Publication of GB2511064A publication Critical patent/GB2511064A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Liquid Crystal (AREA)
  • Position Input By Displaying (AREA)
  • Laminated Bodies (AREA)
GB1303074.7A 2013-02-21 2013-02-21 Method of forming electrode structure for capacitive touch sensor Withdrawn GB2511064A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
GB1303074.7A GB2511064A (en) 2013-02-21 2013-02-21 Method of forming electrode structure for capacitive touch sensor
PCT/GB2014/050440 WO2014128441A1 (en) 2013-02-21 2014-02-14 Method for forming an electrode structure for a capacitive touch sensor
EP14705405.0A EP2958705B1 (en) 2013-02-21 2014-02-14 Method for forming an electrode structure for a capacitive touch sensor
KR1020157025579A KR20150122179A (ko) 2013-02-21 2014-02-14 용량성 터치 센서용 전극 구조를 형성하는 방법
JP2015558542A JP6227012B2 (ja) 2013-02-21 2014-02-14 静電容量式タッチセンサーの電極構造体を形成する方法
US14/769,412 US10421157B2 (en) 2013-02-21 2014-02-14 Method for forming an electrode structure for a capacitive touch sensor
CN201480009368.2A CN105073334B (zh) 2013-02-21 2014-02-14 形成用于电容式触摸传感器的电极结构的方法
TW103105942A TWI648669B (zh) 2013-02-21 2014-02-21 形成用於電容觸控感測器之電極結構之方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1303074.7A GB2511064A (en) 2013-02-21 2013-02-21 Method of forming electrode structure for capacitive touch sensor

Publications (2)

Publication Number Publication Date
GB201303074D0 GB201303074D0 (en) 2013-04-10
GB2511064A true GB2511064A (en) 2014-08-27

Family

ID=48091863

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1303074.7A Withdrawn GB2511064A (en) 2013-02-21 2013-02-21 Method of forming electrode structure for capacitive touch sensor

Country Status (8)

Country Link
US (1) US10421157B2 (enExample)
EP (1) EP2958705B1 (enExample)
JP (1) JP6227012B2 (enExample)
KR (1) KR20150122179A (enExample)
CN (1) CN105073334B (enExample)
GB (1) GB2511064A (enExample)
TW (1) TWI648669B (enExample)
WO (1) WO2014128441A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10203817B2 (en) 2013-02-21 2019-02-12 M-Solv Ltd. Method for forming an electrode structure for a capacitive touch sensor
US10421157B2 (en) 2013-02-21 2019-09-24 M-Solv Ltd. Method for forming an electrode structure for a capacitive touch sensor

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GB2551502A (en) * 2016-06-17 2017-12-27 M-Solv Ltd Apparatus and methods for manufacturing a sensor and a display, and a sensor and a display
KR102663715B1 (ko) * 2016-11-15 2024-05-16 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
US11054948B2 (en) * 2018-10-05 2021-07-06 Apple Inc. Light transmissivity-controlled touch sensor panel design
CN114178710B (zh) * 2020-08-24 2024-11-26 奥特斯(中国)有限公司 部件承载件及其制造方法
US11648627B2 (en) 2021-05-25 2023-05-16 Tpk Advanced Solutions Inc. Touch display device and formation method thereof

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JP2009050868A (ja) * 2007-08-24 2009-03-12 Gunze Ltd 基板製造方法及び基板を用いた静電容量式タッチパネル
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10203817B2 (en) 2013-02-21 2019-02-12 M-Solv Ltd. Method for forming an electrode structure for a capacitive touch sensor
US10421157B2 (en) 2013-02-21 2019-09-24 M-Solv Ltd. Method for forming an electrode structure for a capacitive touch sensor

Also Published As

Publication number Publication date
CN105073334A (zh) 2015-11-18
WO2014128441A1 (en) 2014-08-28
US20150375341A1 (en) 2015-12-31
EP2958705B1 (en) 2019-08-28
EP2958705A1 (en) 2015-12-30
GB201303074D0 (en) 2013-04-10
TW201439873A (zh) 2014-10-16
JP6227012B2 (ja) 2017-11-08
US10421157B2 (en) 2019-09-24
KR20150122179A (ko) 2015-10-30
CN105073334B (zh) 2018-01-16
TWI648669B (zh) 2019-01-21
JP2016518252A (ja) 2016-06-23

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