CN105073334B - 形成用于电容式触摸传感器的电极结构的方法 - Google Patents

形成用于电容式触摸传感器的电极结构的方法 Download PDF

Info

Publication number
CN105073334B
CN105073334B CN201480009368.2A CN201480009368A CN105073334B CN 105073334 B CN105073334 B CN 105073334B CN 201480009368 A CN201480009368 A CN 201480009368A CN 105073334 B CN105073334 B CN 105073334B
Authority
CN
China
Prior art keywords
capacitive touch
touch sensors
layer
component
transparency conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480009368.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN105073334A (zh
Inventor
陈旭钧
卡米洛·普列托锐奥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yingtian Industrial Shenzhen Co ltd
Original Assignee
Vanguard Laser Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vanguard Laser Co Ltd filed Critical Vanguard Laser Co Ltd
Publication of CN105073334A publication Critical patent/CN105073334A/zh
Application granted granted Critical
Publication of CN105073334B publication Critical patent/CN105073334B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Position Input By Displaying (AREA)
  • Liquid Crystal (AREA)
  • Laminated Bodies (AREA)
CN201480009368.2A 2013-02-21 2014-02-14 形成用于电容式触摸传感器的电极结构的方法 Active CN105073334B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1303074.7A GB2511064A (en) 2013-02-21 2013-02-21 Method of forming electrode structure for capacitive touch sensor
GB1303074.7 2013-02-21
PCT/GB2014/050440 WO2014128441A1 (en) 2013-02-21 2014-02-14 Method for forming an electrode structure for a capacitive touch sensor

Publications (2)

Publication Number Publication Date
CN105073334A CN105073334A (zh) 2015-11-18
CN105073334B true CN105073334B (zh) 2018-01-16

Family

ID=48091863

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480009368.2A Active CN105073334B (zh) 2013-02-21 2014-02-14 形成用于电容式触摸传感器的电极结构的方法

Country Status (8)

Country Link
US (1) US10421157B2 (enExample)
EP (1) EP2958705B1 (enExample)
JP (1) JP6227012B2 (enExample)
KR (1) KR20150122179A (enExample)
CN (1) CN105073334B (enExample)
GB (1) GB2511064A (enExample)
TW (1) TWI648669B (enExample)
WO (1) WO2014128441A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11648627B2 (en) 2021-05-25 2023-05-16 Tpk Advanced Solutions Inc. Touch display device and formation method thereof

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2511064A (en) 2013-02-21 2014-08-27 M Solv Ltd Method of forming electrode structure for capacitive touch sensor
GB2514084B (en) 2013-02-21 2016-07-27 M-Solv Ltd Method of forming an electrode structure for capacitive touch sensor
GB2551502A (en) * 2016-06-17 2017-12-27 M-Solv Ltd Apparatus and methods for manufacturing a sensor and a display, and a sensor and a display
KR102663715B1 (ko) 2016-11-15 2024-05-16 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
US11054948B2 (en) * 2018-10-05 2021-07-06 Apple Inc. Light transmissivity-controlled touch sensor panel design
CN114178710B (zh) * 2020-08-24 2024-11-26 奥特斯(中国)有限公司 部件承载件及其制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006119446A (ja) * 2004-10-22 2006-05-11 Toshiba Matsushita Display Technology Co Ltd 液晶表示装置
CN101673013A (zh) * 2008-09-12 2010-03-17 乐金显示有限公司 包括触摸面板的液晶显示器件
WO2012107726A1 (en) * 2011-02-11 2012-08-16 M-Solv Limited Method for making a two-layer capacitive touch sensor panel
CN202736018U (zh) * 2012-09-14 2013-02-13 深圳市鹏扬达数码科技有限公司 高灵敏度大尺寸电容式内嵌触摸屏

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3371304B2 (ja) 1994-07-25 2003-01-27 セイコーエプソン株式会社 レーザ加工装置及びレーザ加工方法並びに液晶パネル
JP3483969B2 (ja) * 1995-01-27 2004-01-06 株式会社東芝 液晶ディスプレイ用レーザリペア方法及びその装置並びにアクティブマトリクス型液晶ディスプレイの製造方法
JP3997450B2 (ja) 1998-03-13 2007-10-24 ソニー株式会社 波長変換装置
TW564196B (en) 2002-01-11 2003-12-01 Electro Scient Ind Inc Simulated laser spot enlargement
US6706998B2 (en) 2002-01-11 2004-03-16 Electro Scientific Industries, Inc. Simulated laser spot enlargement
KR100904520B1 (ko) * 2002-10-31 2009-06-25 엘지디스플레이 주식회사 액정표시장치용 컬러필터 기판과 그 제조방법
JP2004344928A (ja) 2003-05-22 2004-12-09 Alps Electric Co Ltd 反射体製造装置及び反射体の製造方法
US7057135B2 (en) * 2004-03-04 2006-06-06 Matsushita Electric Industrial, Co. Ltd. Method of precise laser nanomachining with UV ultrafast laser pulses
US7804043B2 (en) 2004-06-15 2010-09-28 Laserfacturing Inc. Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser
JP2006123004A (ja) * 2004-09-29 2006-05-18 Mitsubishi Materials Corp レーザ加工方法及びレーザ加工装置
JP4641172B2 (ja) * 2004-10-18 2011-03-02 大日本印刷株式会社 Ｉｔｏ膜のパターンニング方法
WO2006127436A1 (en) 2005-05-20 2006-11-30 Electro Scientific Industries, Inc. Method of forming passive electronic components on a substrate by direct write technique using shaped uniform laser beam
US9138913B2 (en) 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US7605343B2 (en) * 2006-05-24 2009-10-20 Electro Scientific Industries, Inc. Micromachining with short-pulsed, solid-state UV laser
JP4752033B2 (ja) * 2006-09-29 2011-08-17 グンゼ株式会社 タッチパネル及びタッチパネルの製造方法
JP4866778B2 (ja) 2007-04-24 2012-02-01 住友重機械工業株式会社 ビーム照射装置、及び、ビーム照射方法
JP4914309B2 (ja) * 2007-08-24 2012-04-11 グンゼ株式会社 基板製造方法及び基板を用いた静電容量式タッチパネル
TWI393924B (zh) 2008-06-25 2013-04-21 Au Optronics Corp 觸控式顯示面板、彩色濾光片及其製作方法
CN201380363Y (zh) 2008-12-30 2010-01-13 武汉楚天激光（集团）股份有限公司 用于激光刻膜的激光设备
GB0900036D0 (en) 2009-01-03 2009-02-11 M Solv Ltd Method and apparatus for forming grooves with complex shape in the surface of apolymer
WO2010093779A1 (en) * 2009-02-12 2010-08-19 Optera, Inc. Plastic capacitive touch screen and method of manufacturing same
GB2472613B (en) 2009-08-11 2015-06-03 M Solv Ltd Capacitive touch panels
JP5252309B2 (ja) * 2009-08-21 2013-07-31 凸版印刷株式会社 タッチパネル電極付カラーフィルタ基板の製造方法
CN201645056U (zh) 2009-09-28 2010-11-24 深圳市大族激光科技股份有限公司 激光加工装置
TW201142418A (en) 2010-05-20 2011-12-01 Unidisplay Inc Touch-sensing display panel and color filter touch-sensing substrate
US20120074109A1 (en) 2010-09-29 2012-03-29 General Electric Company Method and system for scribing a multilayer panel
KR20120050169A (ko) 2010-11-10 2012-05-18 삼성전기주식회사 터치패널 및 그 제조방법
JP2012123744A (ja) 2010-12-10 2012-06-28 Shin Etsu Polymer Co Ltd 静電容量式入力装置およびその製造方法、静電容量式入力装置の入力方法
JP2012174578A (ja) * 2011-02-23 2012-09-10 Gunze Ltd 透明電極フィルムおよび透明タッチパネル
US8648277B2 (en) 2011-03-31 2014-02-11 Electro Scientific Industries, Inc. Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
CN102759863B (zh) 2011-04-27 2015-12-02 瑞世达科技(厦门)有限公司 激光光刻机
US9029242B2 (en) * 2011-06-15 2015-05-12 Applied Materials, Inc. Damage isolation by shaped beam delivery in laser scribing process
US8652940B2 (en) 2012-04-10 2014-02-18 Applied Materials, Inc. Wafer dicing used hybrid multi-step laser scribing process with plasma etch
GB2511064A (en) 2013-02-21 2014-08-27 M Solv Ltd Method of forming electrode structure for capacitive touch sensor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006119446A (ja) * 2004-10-22 2006-05-11 Toshiba Matsushita Display Technology Co Ltd 液晶表示装置
CN101673013A (zh) * 2008-09-12 2010-03-17 乐金显示有限公司 包括触摸面板的液晶显示器件
WO2012107726A1 (en) * 2011-02-11 2012-08-16 M-Solv Limited Method for making a two-layer capacitive touch sensor panel
CN202736018U (zh) * 2012-09-14 2013-02-13 深圳市鹏扬达数码科技有限公司 高灵敏度大尺寸电容式内嵌触摸屏

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11648627B2 (en) 2021-05-25 2023-05-16 Tpk Advanced Solutions Inc. Touch display device and formation method thereof

Also Published As

Publication number Publication date
KR20150122179A (ko) 2015-10-30
US20150375341A1 (en) 2015-12-31
TW201439873A (zh) 2014-10-16
EP2958705B1 (en) 2019-08-28
US10421157B2 (en) 2019-09-24
GB2511064A (en) 2014-08-27
JP6227012B2 (ja) 2017-11-08
JP2016518252A (ja) 2016-06-23
GB201303074D0 (en) 2013-04-10
TWI648669B (zh) 2019-01-21
WO2014128441A1 (en) 2014-08-28
EP2958705A1 (en) 2015-12-30
CN105073334A (zh) 2015-11-18

Similar Documents

Publication Publication Date Title
CN105073334B (zh) 形成用于电容式触摸传感器的电极结构的方法
CN106373969B (zh) 显示基板和显示装置
US9292141B2 (en) Double sided touch sensor on transparent substrate
TWI614649B (zh) 觸控顯示裝置
CN109037296B (zh) 一种显示装置及电子设备
TWI564769B (zh) 觸控顯示裝置及其製造方法
CN102713737A (zh) 液晶显示装置及其制造方法
WO2017000705A1 (en) Display substrate, display apparatus having the same, and fabricating method thereof
CN104914602A (zh) 显示装置和阵列基板
WO2017071415A1 (zh) 触控结构、触控屏及显示装置
US9760225B2 (en) Circuit device and manufacturing method thereof
US20180107314A1 (en) Touch control substrate and manufacturing method thereof, touch control display panel, and display apparatus
CN105073332B (zh) 形成用于电容式触摸传感器的电极结构的方法
JP2012220670A (ja) タッチパネル電極付きカラーフィルタとその製造方法
JP2016518252A5 (enExample)
KR101761361B1 (ko) 터치 디스플레이 장치, 백 라이트 유닛
TWI506341B (zh) 觸摸顯示屏
WO2015188539A1 (zh) 光栅基板及其制作方法、显示装置
TW201629589A (zh) 帶有電極之彩色濾光片基板、含有該基板之顯示裝置、以及該基板之製造方法
CN106200204B (zh) 裸眼三维显示面板及其制造方法、裸眼三维显示装置
TWM496804U (zh) 觸控顯示裝置
KR102110968B1 (ko) 터치 패널 및 그 제조 방법
KR20180079599A (ko) 표시장치용 어레이기판 및 그 제조방법
GB2506347A (en) Forming an electrode structure for a capacitive touch sensor by laser ablation

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20230518

Address after: Floors 101-401, Building 4 and 301-401, Building 5, Fumin Industrial Zone 2, Pinghu Community, Pinghu Street, Longgang District, Shenzhen City, Guangdong Province

Patentee after: YINGTIAN INDUSTRIAL (SHENZHEN) Co.,Ltd.

Address before: oxford

Patentee before: M-SOLV LTD.

TR01 Transfer of patent right