JP6227012B2 - 静電容量式タッチセンサーの電極構造体を形成する方法 - Google Patents
静電容量式タッチセンサーの電極構造体を形成する方法 Download PDFInfo
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- JP6227012B2 JP6227012B2 JP2015558542A JP2015558542A JP6227012B2 JP 6227012 B2 JP6227012 B2 JP 6227012B2 JP 2015558542 A JP2015558542 A JP 2015558542A JP 2015558542 A JP2015558542 A JP 2015558542A JP 6227012 B2 JP6227012 B2 JP 6227012B2
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Position Input By Displaying (AREA)
- Liquid Crystal (AREA)
- Laminated Bodies (AREA)
Description
i)波長は257nm〜266nmの範囲内、
ii)パルス長は50fs〜50nsの範囲内、
であるように選択され、それにより、前記ガラス基板の前記第2の面上の前記カラーフィルター層、前記透明の非導電層又は前記第2の透明導電層へ実質的に損傷を与えることなく前記第1の透明導電層内に溝を形成して前記第1の透明導電層の、各溝の互いに対向する側の領域を電気的に分離する方法が提供される。
i)波長は257nm〜266nmの範囲内、
ii)パルス長は50fs〜50nsの範囲内、
であるような波長及びパルス長を提供するように構成される。
10nsの公称出力パルス長(nominal output pulse length)を有し、266nmにて動作するレーザー
15psの公称出力パルス長を有し、266nmにて動作するレーザー
10nsの公称出力パルス長を有し、263nmにて動作するレーザー
150fsの公称出力パルス長を有し、262nmにて動作するレーザー
10psの公称出力パルス長を有し、257.5nmにて動作するレーザー
のうちの1つから選択することができる。
1)第2の(背後の)面が透明の有機層及び第2のTC層でオーバーコーティングされているRGB/BMカラーフィルター層であるガラス基板の第1の面上の第1のTC層内にパターンを形成すること。
2)パターンが二層静電容量式タッチセンサー用のRx電極を形成する。
3)第1のTC層がパターニングされて、狭い溝の直描レーザーアブレーションによってセンサー電極構造体が形成される。
4)レーザースクライブ工程によってTC材料が溝から完全に除去されるが、ガラス基板の背後面上のRGB層、BM層、有機層及び/又は第2のTC層への損傷は生じない(又は、最少である)。
5)レーザーはDUV領域で動作し、50ns未満の持続時間、好ましくは50ps未満の持続時間を有するパルスを放射するパルスタイプのものである。
Claims (8)
- 透明の非導電層と第2の透明導電層でオーバーコーティングされたカラーフィルター層が第2の面上に設けられているガラス基板の第1の面上にある第1の透明導電層内に静電容量式タッチセンサーの電極構造体を形成する方法であって、
前記第1の透明導電層が前記ガラス基板の前記第1の面上に設けられ、かつ、前記透明の非導電層と前記第2の透明導電層でオーバーコーティングされた前記カラーフィルター層は前記ガラス基板の前記第2の面上に供される状態で、パルス固体レーザー(pulsed solid state laser)を用いて直描レーザースクライブ工程(direct write laser scribing process)を前記第1の透明導電層に施すことによって当該電極構造体を形成する工程であって、
レーザー波長及びパルス長は、
i)波長は257nm〜266nmの範囲内、
ii)パルス長は50fs〜50nsの範囲内、
であるように選択され、それにより、前記ガラス基板の前記第2の面上の前記カラーフィルター層、前記透明の非導電層又は前記第2の透明導電層へ実質的に損傷を与えることなく、前記第1の透明導電層内に溝が形成されて、各溝の対向する側にある前記第1の透明導電層の領域が電気的に分離される、方法。 - 前記パルス長は50ps以下である、請求項1に記載の方法。
- 前記レーザー波長は257.5nm又は266nmのうちの1つから選択される、請求項1又は2に記載の方法。
- 前記電極構造体は送信電極構造体及び受信電極構造体の双方を含む、請求項1〜3のうちのいずれか一項に記載の方法。
- 前記透明の非導電層が前記カラーフィルター層を覆う平坦化層を形成し、前記第2の透明導電層は前記平坦化層を覆うように供される、請求項1〜4のうちのいずれか一項に記載の方法。
- 前記タッチセンサーを用いて、該センサーの上方に透明カバーと、該センサーの下方にディスプレイモジュールとを有する組立体の一部分を形成する、請求項1〜5のうちのいずれか一項に記載の方法。
- 前記レーザービームは前記第1の透明導電層の第1のサブ領域にわたってスキャンし、次に前記第1の透明導電層の別のサブ領域にステップし、そのサブ領域にわたってスキャンするように構成され、この工程は必要な前記領域がスキャンされるまで繰り返される、請求項1〜6のうちのいずれか一項に記載の方法。
- 形成される前記センサーは複数の前記サブ領域を含む、請求項7に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1303074.7 | 2013-02-21 | ||
GB1303074.7A GB2511064A (en) | 2013-02-21 | 2013-02-21 | Method of forming electrode structure for capacitive touch sensor |
PCT/GB2014/050440 WO2014128441A1 (en) | 2013-02-21 | 2014-02-14 | Method for forming an electrode structure for a capacitive touch sensor |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016518252A JP2016518252A (ja) | 2016-06-23 |
JP2016518252A5 JP2016518252A5 (ja) | 2017-01-19 |
JP6227012B2 true JP6227012B2 (ja) | 2017-11-08 |
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ID=48091863
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2015558542A Expired - Fee Related JP6227012B2 (ja) | 2013-02-21 | 2014-02-14 | 静電容量式タッチセンサーの電極構造体を形成する方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US10421157B2 (ja) |
EP (1) | EP2958705B1 (ja) |
JP (1) | JP6227012B2 (ja) |
KR (1) | KR20150122179A (ja) |
CN (1) | CN105073334B (ja) |
GB (1) | GB2511064A (ja) |
TW (1) | TWI648669B (ja) |
WO (1) | WO2014128441A1 (ja) |
Families Citing this family (7)
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GB2511064A (en) | 2013-02-21 | 2014-08-27 | M Solv Ltd | Method of forming electrode structure for capacitive touch sensor |
GB2514084B (en) | 2013-02-21 | 2016-07-27 | M-Solv Ltd | Method of forming an electrode structure for capacitive touch sensor |
GB2551502A (en) * | 2016-06-17 | 2017-12-27 | M-Solv Ltd | Apparatus and methods for manufacturing a sensor and a display, and a sensor and a display |
KR102663715B1 (ko) * | 2016-11-15 | 2024-05-16 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
US11054948B2 (en) * | 2018-10-05 | 2021-07-06 | Apple Inc. | Light transmissivity-controlled touch sensor panel design |
CN114178710A (zh) * | 2020-08-24 | 2022-03-15 | 奥特斯(中国)有限公司 | 部件承载件及其制造方法 |
US11648627B2 (en) | 2021-05-25 | 2023-05-16 | Tpk Advanced Solutions Inc. | Touch display device and formation method thereof |
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GB2511064A (en) | 2013-02-21 | 2014-08-27 | M Solv Ltd | Method of forming electrode structure for capacitive touch sensor |
-
2013
- 2013-02-21 GB GB1303074.7A patent/GB2511064A/en not_active Withdrawn
-
2014
- 2014-02-14 KR KR1020157025579A patent/KR20150122179A/ko not_active Application Discontinuation
- 2014-02-14 US US14/769,412 patent/US10421157B2/en not_active Expired - Fee Related
- 2014-02-14 CN CN201480009368.2A patent/CN105073334B/zh active Active
- 2014-02-14 JP JP2015558542A patent/JP6227012B2/ja not_active Expired - Fee Related
- 2014-02-14 EP EP14705405.0A patent/EP2958705B1/en active Active
- 2014-02-14 WO PCT/GB2014/050440 patent/WO2014128441A1/en active Application Filing
- 2014-02-21 TW TW103105942A patent/TWI648669B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2014128441A1 (en) | 2014-08-28 |
JP2016518252A (ja) | 2016-06-23 |
CN105073334B (zh) | 2018-01-16 |
US20150375341A1 (en) | 2015-12-31 |
EP2958705A1 (en) | 2015-12-30 |
TWI648669B (zh) | 2019-01-21 |
CN105073334A (zh) | 2015-11-18 |
GB201303074D0 (en) | 2013-04-10 |
EP2958705B1 (en) | 2019-08-28 |
TW201439873A (zh) | 2014-10-16 |
US10421157B2 (en) | 2019-09-24 |
GB2511064A (en) | 2014-08-27 |
KR20150122179A (ko) | 2015-10-30 |
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