JP6227012B2 - 静電容量式タッチセンサーの電極構造体を形成する方法 - Google Patents

静電容量式タッチセンサーの電極構造体を形成する方法 Download PDF

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JP6227012B2
JP6227012B2 JP2015558542A JP2015558542A JP6227012B2 JP 6227012 B2 JP6227012 B2 JP 6227012B2 JP 2015558542 A JP2015558542 A JP 2015558542A JP 2015558542 A JP2015558542 A JP 2015558542A JP 6227012 B2 JP6227012 B2 JP 6227012B2
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conductive layer
transparent conductive
transparent
laser
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JP2016518252A5 (enExample
JP2016518252A (ja
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ユック クワァン チャン
ユック クワァン チャン
リオ カミーノ プリート
リオ カミーノ プリート
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エム−ソルヴ・リミテッド
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Liquid Crystal (AREA)
  • Position Input By Displaying (AREA)
  • Laminated Bodies (AREA)
JP2015558542A 2013-02-21 2014-02-14 静電容量式タッチセンサーの電極構造体を形成する方法 Expired - Fee Related JP6227012B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1303074.7 2013-02-21
GB1303074.7A GB2511064A (en) 2013-02-21 2013-02-21 Method of forming electrode structure for capacitive touch sensor
PCT/GB2014/050440 WO2014128441A1 (en) 2013-02-21 2014-02-14 Method for forming an electrode structure for a capacitive touch sensor

Publications (3)

Publication Number Publication Date
JP2016518252A JP2016518252A (ja) 2016-06-23
JP2016518252A5 JP2016518252A5 (enExample) 2017-01-19
JP6227012B2 true JP6227012B2 (ja) 2017-11-08

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JP2015558542A Expired - Fee Related JP6227012B2 (ja) 2013-02-21 2014-02-14 静電容量式タッチセンサーの電極構造体を形成する方法

Country Status (8)

Country Link
US (1) US10421157B2 (enExample)
EP (1) EP2958705B1 (enExample)
JP (1) JP6227012B2 (enExample)
KR (1) KR20150122179A (enExample)
CN (1) CN105073334B (enExample)
GB (1) GB2511064A (enExample)
TW (1) TWI648669B (enExample)
WO (1) WO2014128441A1 (enExample)

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US11054948B2 (en) * 2018-10-05 2021-07-06 Apple Inc. Light transmissivity-controlled touch sensor panel design
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US11648627B2 (en) 2021-05-25 2023-05-16 Tpk Advanced Solutions Inc. Touch display device and formation method thereof

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Also Published As

Publication number Publication date
CN105073334A (zh) 2015-11-18
WO2014128441A1 (en) 2014-08-28
US20150375341A1 (en) 2015-12-31
EP2958705B1 (en) 2019-08-28
EP2958705A1 (en) 2015-12-30
GB201303074D0 (en) 2013-04-10
TW201439873A (zh) 2014-10-16
US10421157B2 (en) 2019-09-24
KR20150122179A (ko) 2015-10-30
CN105073334B (zh) 2018-01-16
GB2511064A (en) 2014-08-27
TWI648669B (zh) 2019-01-21
JP2016518252A (ja) 2016-06-23

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