TWI647765B - 零件安裝裝置 - Google Patents

零件安裝裝置 Download PDF

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Publication number
TWI647765B
TWI647765B TW106126915A TW106126915A TWI647765B TW I647765 B TWI647765 B TW I647765B TW 106126915 A TW106126915 A TW 106126915A TW 106126915 A TW106126915 A TW 106126915A TW I647765 B TWI647765 B TW I647765B
Authority
TW
Taiwan
Prior art keywords
component
arm
unit
parts
lock
Prior art date
Application number
TW106126915A
Other languages
English (en)
Chinese (zh)
Other versions
TW201832296A (zh
Inventor
寺田和広
Original Assignee
日商山葉發動機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商山葉發動機股份有限公司 filed Critical 日商山葉發動機股份有限公司
Publication of TW201832296A publication Critical patent/TW201832296A/zh
Application granted granted Critical
Publication of TWI647765B publication Critical patent/TWI647765B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
TW106126915A 2017-02-27 2017-08-09 零件安裝裝置 TWI647765B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
??PCT/JP2017/007383 2017-02-27
PCT/JP2017/007383 WO2018154760A1 (ja) 2017-02-27 2017-02-27 部品実装装置

Publications (2)

Publication Number Publication Date
TW201832296A TW201832296A (zh) 2018-09-01
TWI647765B true TWI647765B (zh) 2019-01-11

Family

ID=63253609

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106126915A TWI647765B (zh) 2017-02-27 2017-08-09 零件安裝裝置

Country Status (3)

Country Link
JP (1) JP6806877B2 (ja)
TW (1) TWI647765B (ja)
WO (1) WO2018154760A1 (ja)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW409949U (en) * 1999-06-04 2000-10-21 King Mechatronics Co Ltd Chip joining device that can overturn the chips
US6260898B1 (en) * 1999-08-06 2001-07-17 Sanyo Electric Co., Ltd. Mounting head for electronic component-mounting apparatus
US20040244915A1 (en) * 2003-06-03 2004-12-09 Asm Automation Assembly Ltd Semiconductor apparatus with multiple delivery devices for components
JP2010108961A (ja) * 2008-10-28 2010-05-13 Panasonic Corp 電子部品実装装置
JP2012104636A (ja) * 2010-11-10 2012-05-31 Panasonic Corp 部品実装装置および部品実装方法
US20130068824A1 (en) * 2011-09-16 2013-03-21 Hitachi High-Tech Instruments Co., Ltd. Die Bonder and Bonding Method
US20140341691A1 (en) * 2013-05-14 2014-11-20 Kui Kam Lam Bonding apparatus having a plurality of rotary transfer arms for transferring electronic devices for bonding
US8991681B2 (en) * 2011-09-15 2015-03-31 Hitachi High-Tech Instuments Co., Ltd. Die bonder and bonding method
TW201637727A (zh) * 2015-04-20 2016-11-01 Yamaha Motor Co Ltd 黏性流體供給裝置及零件安裝裝置
TW201637726A (zh) * 2015-04-20 2016-11-01 Yamaha Motor Co Ltd 黏性流體供給裝置及零件安裝裝置
US20170034968A1 (en) * 2015-07-31 2017-02-02 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting method and electronic component mounting apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4832262B2 (ja) * 2006-11-16 2011-12-07 株式会社日立ハイテクインスツルメンツ 部品実装装置
JP5691001B2 (ja) * 2011-11-08 2015-04-01 パナソニックＩｐマネジメント株式会社 反転ヘッド
JP5930728B2 (ja) * 2012-01-19 2016-06-08 富士機械製造株式会社 部品実装装置

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW409949U (en) * 1999-06-04 2000-10-21 King Mechatronics Co Ltd Chip joining device that can overturn the chips
US6260898B1 (en) * 1999-08-06 2001-07-17 Sanyo Electric Co., Ltd. Mounting head for electronic component-mounting apparatus
US20040244915A1 (en) * 2003-06-03 2004-12-09 Asm Automation Assembly Ltd Semiconductor apparatus with multiple delivery devices for components
JP2010108961A (ja) * 2008-10-28 2010-05-13 Panasonic Corp 電子部品実装装置
JP2012104636A (ja) * 2010-11-10 2012-05-31 Panasonic Corp 部品実装装置および部品実装方法
US8991681B2 (en) * 2011-09-15 2015-03-31 Hitachi High-Tech Instuments Co., Ltd. Die bonder and bonding method
US20130068824A1 (en) * 2011-09-16 2013-03-21 Hitachi High-Tech Instruments Co., Ltd. Die Bonder and Bonding Method
US20140341691A1 (en) * 2013-05-14 2014-11-20 Kui Kam Lam Bonding apparatus having a plurality of rotary transfer arms for transferring electronic devices for bonding
TW201637727A (zh) * 2015-04-20 2016-11-01 Yamaha Motor Co Ltd 黏性流體供給裝置及零件安裝裝置
TW201637726A (zh) * 2015-04-20 2016-11-01 Yamaha Motor Co Ltd 黏性流體供給裝置及零件安裝裝置
US20170034968A1 (en) * 2015-07-31 2017-02-02 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting method and electronic component mounting apparatus

Also Published As

Publication number Publication date
WO2018154760A1 (ja) 2018-08-30
JPWO2018154760A1 (ja) 2019-11-14
TW201832296A (zh) 2018-09-01
JP6806877B2 (ja) 2021-01-06

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