JP5691001B2 - 反転ヘッド - Google Patents
反転ヘッド Download PDFInfo
- Publication number
- JP5691001B2 JP5691001B2 JP2011244232A JP2011244232A JP5691001B2 JP 5691001 B2 JP5691001 B2 JP 5691001B2 JP 2011244232 A JP2011244232 A JP 2011244232A JP 2011244232 A JP2011244232 A JP 2011244232A JP 5691001 B2 JP5691001 B2 JP 5691001B2
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- component
- base
- head
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
2 基板
3 電極部(部品装着対象部位)
4 部品
20 反転ヘッド
20a ノズル
23 装着ヘッド
34 ノズルホルダ
51 ノズルベース
53 ノズル係止部材
54 固定部材
72 ノズルベース内真空路(真空路)
86 回転駆動部
CX 水平軸
Claims (1)
- 装着ヘッドによって基板に部品を装着する部品実装装置に備えられ、部品供給位置に供給された部品をノズルにより上方から吸着して上下反転させ、その上下反転させた部品を基板上の部品装着対象部位の上方に移動させて装着ヘッドに受け渡す反転ヘッドであって、
両端が支持されて水平方向に延び、水平軸回りの回転が自在であるとともに側面に前記ノズルを保持したノズルホルダと、
前記ノズルホルダを水平軸回りに回転させて前記ノズルの向きを上下に切り替える回転駆動部とを備え、
前記ノズルホルダは、
両端が支持されて水平方向に延び、内部に真空路が形成されたノズルベースと、
前記ノズルを前記ノズルベースの前記側面に係止して前記ノズルと前記ノズルベース内の前記真空路とを連通させるノズル係止部材と、
前記ノズルベースの両端部の外方から前記ノズルベースの両端部にスライド装着されて前記ノズル係止部材を前記ノズルベースに固定する一対の固定部材とを備えたことを特徴とする反転ヘッド。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011244232A JP5691001B2 (ja) | 2011-11-08 | 2011-11-08 | 反転ヘッド |
KR1020137016782A KR20140086922A (ko) | 2011-11-08 | 2012-09-11 | 반전 헤드 |
US13/995,252 US9357653B2 (en) | 2011-11-08 | 2012-09-11 | Inverting head |
CN201280004461.5A CN103299726B (zh) | 2011-11-08 | 2012-09-11 | 翻转头 |
PCT/JP2012/005771 WO2013069184A1 (ja) | 2011-11-08 | 2012-09-11 | 反転ヘッド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011244232A JP5691001B2 (ja) | 2011-11-08 | 2011-11-08 | 反転ヘッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013102017A JP2013102017A (ja) | 2013-05-23 |
JP5691001B2 true JP5691001B2 (ja) | 2015-04-01 |
Family
ID=48288975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011244232A Active JP5691001B2 (ja) | 2011-11-08 | 2011-11-08 | 反転ヘッド |
Country Status (5)
Country | Link |
---|---|
US (1) | US9357653B2 (ja) |
JP (1) | JP5691001B2 (ja) |
KR (1) | KR20140086922A (ja) |
CN (1) | CN103299726B (ja) |
WO (1) | WO2013069184A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6283818B2 (ja) * | 2014-04-14 | 2018-02-28 | パナソニックIpマネジメント株式会社 | 電子部品搭載装置 |
JP6364612B2 (ja) * | 2014-04-14 | 2018-08-01 | パナソニックIpマネジメント株式会社 | 電子部品搭載装置 |
JP6806877B2 (ja) * | 2017-02-27 | 2021-01-06 | ヤマハ発動機株式会社 | 部品実装装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4458412A (en) * | 1981-05-06 | 1984-07-10 | Universal Instruments Corporation | Leadless chip placement machine for printed circuit boards |
JP2773307B2 (ja) * | 1989-10-17 | 1998-07-09 | 松下電器産業株式会社 | 電子部品の実装方法 |
JP3469652B2 (ja) * | 1994-09-26 | 2003-11-25 | 富士機械製造株式会社 | 電子部品装着装置 |
JP3132353B2 (ja) * | 1995-08-24 | 2001-02-05 | 松下電器産業株式会社 | チップの搭載装置および搭載方法 |
TW331550B (en) * | 1996-08-14 | 1998-05-11 | Tokyo Electron Co Ltd | The cassette receiving room |
JP2000068327A (ja) | 1998-08-20 | 2000-03-03 | Matsushita Electric Ind Co Ltd | 部品の実装方法と装置 |
JP4480840B2 (ja) * | 2000-03-23 | 2010-06-16 | パナソニック株式会社 | 部品実装装置、及び部品実装方法 |
US20020192059A1 (en) * | 2001-06-15 | 2002-12-19 | Foster James E. | Methods and apparatus for transferring electrical components |
JP3374856B2 (ja) * | 2002-04-30 | 2003-02-10 | 松下電器産業株式会社 | 電子部品のボンディング装置 |
KR101065907B1 (ko) * | 2002-12-02 | 2011-09-19 | 파나소닉 주식회사 | 부품 공급 헤드 장치, 부품 공급 장치, 부품 실장 장치, 및실장 헤드부의 이동 방법 |
JP4334892B2 (ja) * | 2003-03-20 | 2009-09-30 | パナソニック株式会社 | 部品実装方法 |
JP4093156B2 (ja) * | 2003-09-11 | 2008-06-04 | セイコーエプソン株式会社 | 半導体装置製造用治具、半導体装置製造方法および半導体装置 |
JP4369301B2 (ja) * | 2004-05-31 | 2009-11-18 | ヤマハ発動機株式会社 | 部品供給装置およびそれを備えた実装機 |
JP4595740B2 (ja) * | 2005-08-16 | 2010-12-08 | パナソニック株式会社 | チップ反転装置およびチップ反転方法ならびにチップ搭載装置 |
JP5083221B2 (ja) * | 2009-01-05 | 2012-11-28 | パナソニック株式会社 | パレット自動交換装置 |
JP4658235B2 (ja) * | 2009-01-08 | 2011-03-23 | パナソニック株式会社 | 部品実装装置及びその方法 |
-
2011
- 2011-11-08 JP JP2011244232A patent/JP5691001B2/ja active Active
-
2012
- 2012-09-11 WO PCT/JP2012/005771 patent/WO2013069184A1/ja active Application Filing
- 2012-09-11 KR KR1020137016782A patent/KR20140086922A/ko not_active Application Discontinuation
- 2012-09-11 US US13/995,252 patent/US9357653B2/en active Active
- 2012-09-11 CN CN201280004461.5A patent/CN103299726B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN103299726B (zh) | 2016-06-08 |
WO2013069184A1 (ja) | 2013-05-16 |
JP2013102017A (ja) | 2013-05-23 |
US20130269179A1 (en) | 2013-10-17 |
KR20140086922A (ko) | 2014-07-08 |
CN103299726A (zh) | 2013-09-11 |
US9357653B2 (en) | 2016-05-31 |
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