JP6040255B2 - 部品供給装置 - Google Patents
部品供給装置 Download PDFInfo
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- JP6040255B2 JP6040255B2 JP2014544071A JP2014544071A JP6040255B2 JP 6040255 B2 JP6040255 B2 JP 6040255B2 JP 2014544071 A JP2014544071 A JP 2014544071A JP 2014544071 A JP2014544071 A JP 2014544071A JP 6040255 B2 JP6040255 B2 JP 6040255B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
Description
次に、部品装着システム10の各部について詳細に説明する。まず、ウエハシート補給部160について説明する。図2に示すように、ウエハシート補給部160は、ハウジング162と、マガジン170と、昇降機構168を備えている。
次に、ウエハシート搬送部60について説明する。図2に示すように、ウエハシート搬送部60は、移動テーブル62と、移動テーブル62を昇降するテーブル昇降機構110と、移動テーブル62に対してxy方向に移動可能とされた吸着ヘッド100と、移動テーブル62に載置されたウエハシートW2を撮影するカメラ104を有している。
次に、実装機20について説明する。なお、実装機20には、従来公知のものを使用することができるため、ここでは、実装機20の構成については簡単に説明する。図2に示すように、実装機20は、基板搬送部22a,22bと、装着ヘッド30と、部品カメラ28を有している。基板搬送部22a,22bは、コンベアベルトを回転させることで、コンベアベルト上に載置された基板を搬送する。装着ヘッド30は、部品W1を吸着するための複数の吸着ノズル32と、ウエハシートW2のフィデューシャルマークを読み取るためのマークカメラ34を備えている。装着ヘッド30の吸着ノズル32の配置は、吸着ヘッド100の吸着ノズル114a,114bの配置に対応している。すなわち、装着ヘッド30は、吸着ヘッド100の吸着ノズル114a,114bに保持された複数の部品W1を同時に受取ることができる。なお、装着ヘッド30は、図示しないx方向移動機構とy方向移動機構によって、xy方向に移動可能となっている。部品カメラ28は、装着ヘッド30に吸着された部品W1の読み取り等を行う。
Claims (3)
- 基板に部品を実装する装着ヘッドを有する実装機に隣接して配置され、前記実装機に前記部品を供給する部品供給装置であり、
シート上に複数の部品が配置されたウエハシートが補給されるウエハシート補給部と、
前記ウエハシート補給部に補給されたウエハシートを搬送するウエハシート搬送部と、を有しており、
前記ウエハシート搬送部は、
前記ウエハシートが載置されるテーブルと、
前記テーブルに載置された前記ウエハシート上の部品を吸着する吸着ヘッドと、を有しており、
前記吸着ヘッドは、
複数の部品供給側吸着ノズルと、
前記複数の部品供給側吸着ノズルを、前記複数の部品供給側吸着ノズルの先端が下方を向いた吸着位置と、上方を向いた受渡し位置とに切換える切換え機構と、を有しており、
前記複数の部品供給側吸着ノズルの配置は、前記実装機の前記装着ヘッドに装備される複数の実装機側吸着ノズルの配置と対応しており、
前記吸着ヘッドは、第1ハウジングと、前記第1ハウジングに対して回動可能に支持され、前記複数の部品供給側吸着ノズルが取付けられている第2ハウジングと、をさらに有しており、
前記切換え機構は、前記第2ハウジングを前記第1ハウジングに対して回動させるラック・ピニオン機構と、
前記吸着位置及び前記受渡し位置の近傍の領域における前記第2ハウジングの回転速度を、それ以外の領域における前記第2ハウジングの回転速度よりも遅くする回転速度調整機構と、を有している、部品供給装置。 - 基板に部品を実装する装着ヘッドを有する実装機に隣接して配置され、前記実装機に前記部品を供給する部品供給装置であり、
シート上に複数の部品が配置されたウエハシートが補給されるウエハシート補給部と、
前記ウエハシート補給部に補給されたウエハシートを搬送するウエハシート搬送部と、を有しており、
前記ウエハシート搬送部は、
前記ウエハシートが載置されるテーブルと、
前記テーブルに載置された前記ウエハシート上の部品を吸着する吸着ヘッドと、を有しており、
前記吸着ヘッドは、
複数の部品供給側吸着ノズルと、
前記複数の部品供給側吸着ノズルを、前記複数の部品供給側吸着ノズルの先端が下方を向いた吸着位置と、上方を向いた受渡し位置とに切換える切換え機構と、を有しており、
前記複数の部品供給側吸着ノズルの配置は、前記実装機の前記装着ヘッドに装備される複数の実装機側吸着ノズルの配置と対応しており、
前記吸着ヘッドは、前記テーブルに対して平面方向に移動可能に取付けられており、
前記ウエハシート搬送部は、前記吸着ヘッドが取付けられた前記テーブルを直接供給位置と、該直接供給位置より下方となる間接供給位置との間で上下動させるテーブル昇降機構を備えており、
前記吸着ヘッドは前記テーブルの上方に位置しており、
前記テーブル昇降機構が前記テーブルを上下動させることで、前記テーブルが前記直接供給位置に位置決めされたときのテーブルの高さと、前記テーブルが間接供給位置に位置決めされ、かつ、前記部品供給側吸着ノズルが前記受渡し位置に位置決めされたときの前記部品供給側吸着ノズルの高さとが一致する、部品供給装置。 - 前記吸着ヘッドは、
第1ハウジングと、
前記第1ハウジングに対して回動可能に支持され、前記複数の部品供給側吸着ノズルが取付けられている第2ハウジングと、をさらに有しており、
前記切換え機構は、前記第2ハウジングを前記第1ハウジングに対して回動させるラック・ピニオン機構を有している、請求項2に記載の部品供給装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/077902 WO2014068640A1 (ja) | 2012-10-29 | 2012-10-29 | 部品供給装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2014068640A1 JPWO2014068640A1 (ja) | 2016-09-08 |
JP6040255B2 true JP6040255B2 (ja) | 2016-12-07 |
Family
ID=50626620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2014544071A Active JP6040255B2 (ja) | 2012-10-29 | 2012-10-29 | 部品供給装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9788470B2 (ja) |
EP (1) | EP2914079B1 (ja) |
JP (1) | JP6040255B2 (ja) |
CN (1) | CN104770075B (ja) |
WO (1) | WO2014068640A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6040255B2 (ja) * | 2012-10-29 | 2016-12-07 | 富士機械製造株式会社 | 部品供給装置 |
KR20160048301A (ko) * | 2014-10-23 | 2016-05-04 | 삼성전자주식회사 | 본딩 장치 및 그를 포함하는 기판 제조 설비 |
US9902415B2 (en) * | 2016-02-15 | 2018-02-27 | Lam Research Corporation | Universal service cart for semiconductor system maintenance |
WO2018060765A1 (en) * | 2016-09-29 | 2018-04-05 | Assembleon B.V. | Component placement device and method of driving the same |
CN113347870B (zh) * | 2021-06-02 | 2022-04-22 | 安徽德浦照明科技有限公司 | Led贴片机取料机构 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04245653A (ja) * | 1991-01-31 | 1992-09-02 | Matsushita Electron Corp | チップマウント装置 |
JP3132353B2 (ja) * | 1995-08-24 | 2001-02-05 | 松下電器産業株式会社 | チップの搭載装置および搭載方法 |
JP4480840B2 (ja) * | 2000-03-23 | 2010-06-16 | パナソニック株式会社 | 部品実装装置、及び部品実装方法 |
JP3584975B2 (ja) * | 2000-03-28 | 2004-11-04 | 東洋ガラス機械株式会社 | プリフォーム清掃方法及び装置 |
JP3884900B2 (ja) * | 2000-05-15 | 2007-02-21 | Tdk株式会社 | 移動反転方法及び機構 |
JP2002118153A (ja) | 2000-10-11 | 2002-04-19 | Toshiba Corp | 電子部品の製造方法及び実装装置 |
JP3661658B2 (ja) | 2002-03-19 | 2005-06-15 | 松下電器産業株式会社 | 電子部品搭載装置および電子部品搭載方法 |
JP4093854B2 (ja) * | 2002-04-05 | 2008-06-04 | 松下電器産業株式会社 | 電子部品実装装置 |
DE10222620A1 (de) * | 2002-05-17 | 2003-12-04 | Georg Rudolf Sillner | Verfahren zum Verarbeiten von elektrischen Bauteilen, insbesondere zum Verarbeiten von Halbleiterchips sowie elektrischen Bauelementen, sowie Vorrichtung zum Durchführen des Verfahrens |
JP4516354B2 (ja) * | 2004-05-17 | 2010-08-04 | パナソニック株式会社 | 部品供給方法 |
JP4901683B2 (ja) * | 2007-10-09 | 2012-03-21 | Juki株式会社 | 部品供給装置 |
JP2009194306A (ja) * | 2008-02-18 | 2009-08-27 | Juki Corp | 部品供給装置 |
US8296937B2 (en) * | 2008-08-19 | 2012-10-30 | Silverbrook Research Pty Ltd | Wafer positioning system |
DE102008051947B3 (de) * | 2008-10-16 | 2010-04-29 | Siemens Electronics Assembly Systems Gmbh & Co. Kg | Zuführeinrichtung zum Zuführen von Bauteilen zu einem Bestückautomaten |
JP6040255B2 (ja) * | 2012-10-29 | 2016-12-07 | 富士機械製造株式会社 | 部品供給装置 |
EP2914077B1 (en) * | 2012-10-29 | 2021-04-07 | FUJI Corporation | Component supply apparatus |
-
2012
- 2012-10-29 JP JP2014544071A patent/JP6040255B2/ja active Active
- 2012-10-29 CN CN201280076708.4A patent/CN104770075B/zh active Active
- 2012-10-29 US US14/438,452 patent/US9788470B2/en active Active
- 2012-10-29 WO PCT/JP2012/077902 patent/WO2014068640A1/ja active Application Filing
- 2012-10-29 EP EP12887836.0A patent/EP2914079B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN104770075A (zh) | 2015-07-08 |
EP2914079A4 (en) | 2015-10-28 |
EP2914079A1 (en) | 2015-09-02 |
JPWO2014068640A1 (ja) | 2016-09-08 |
EP2914079B1 (en) | 2022-01-26 |
CN104770075B (zh) | 2017-12-26 |
WO2014068640A1 (ja) | 2014-05-08 |
US20150264846A1 (en) | 2015-09-17 |
US9788470B2 (en) | 2017-10-10 |
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