TW409949U - Chip joining device that can overturn the chips - Google Patents

Chip joining device that can overturn the chips

Info

Publication number
TW409949U
TW409949U TW88209086U TW88209086U TW409949U TW 409949 U TW409949 U TW 409949U TW 88209086 U TW88209086 U TW 88209086U TW 88209086 U TW88209086 U TW 88209086U TW 409949 U TW409949 U TW 409949U
Authority
TW
Taiwan
Prior art keywords
overturn
chips
joining device
chip joining
chip
Prior art date
Application number
TW88209086U
Other languages
Chinese (zh)
Inventor
Jing-Ching Lin
Sheng-Lung Wu
Duen-Jr Shr
Pin-Chau Li
Original Assignee
King Mechatronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by King Mechatronics Co Ltd filed Critical King Mechatronics Co Ltd
Priority to TW88209086U priority Critical patent/TW409949U/en
Publication of TW409949U publication Critical patent/TW409949U/en

Links

TW88209086U 1999-06-04 1999-06-04 Chip joining device that can overturn the chips TW409949U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88209086U TW409949U (en) 1999-06-04 1999-06-04 Chip joining device that can overturn the chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88209086U TW409949U (en) 1999-06-04 1999-06-04 Chip joining device that can overturn the chips

Publications (1)

Publication Number Publication Date
TW409949U true TW409949U (en) 2000-10-21

Family

ID=21649000

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88209086U TW409949U (en) 1999-06-04 1999-06-04 Chip joining device that can overturn the chips

Country Status (1)

Country Link
TW (1) TW409949U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI647765B (en) * 2017-02-27 2019-01-11 日商山葉發動機股份有限公司 Parts mounting device
CN110690152A (en) * 2019-08-28 2020-01-14 苏州均华精密机械有限公司 Large-size wafer bonding device
TWI703668B (en) * 2019-08-13 2020-09-01 均華精密工業股份有限公司 Large size wafer bonding apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI647765B (en) * 2017-02-27 2019-01-11 日商山葉發動機股份有限公司 Parts mounting device
TWI703668B (en) * 2019-08-13 2020-09-01 均華精密工業股份有限公司 Large size wafer bonding apparatus
CN110690152A (en) * 2019-08-28 2020-01-14 苏州均华精密机械有限公司 Large-size wafer bonding device

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees