TWI645757B - 印刷配線基板 - Google Patents

印刷配線基板 Download PDF

Info

Publication number
TWI645757B
TWI645757B TW106102440A TW106102440A TWI645757B TW I645757 B TWI645757 B TW I645757B TW 106102440 A TW106102440 A TW 106102440A TW 106102440 A TW106102440 A TW 106102440A TW I645757 B TWI645757 B TW I645757B
Authority
TW
Taiwan
Prior art keywords
electronic component
terminal
conductor
component
pad
Prior art date
Application number
TW106102440A
Other languages
English (en)
Chinese (zh)
Other versions
TW201737772A (zh
Inventor
木村昌善
兼平智広
山中規至
Original Assignee
Ｆｄｋ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｆｄｋ股份有限公司 filed Critical Ｆｄｋ股份有限公司
Publication of TW201737772A publication Critical patent/TW201737772A/zh
Application granted granted Critical
Publication of TWI645757B publication Critical patent/TWI645757B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW106102440A 2016-03-31 2017-01-23 印刷配線基板 TWI645757B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-071036 2016-03-31
JP2016071036A JP6694311B2 (ja) 2016-03-31 2016-03-31 プリント配線基板

Publications (2)

Publication Number Publication Date
TW201737772A TW201737772A (zh) 2017-10-16
TWI645757B true TWI645757B (zh) 2018-12-21

Family

ID=59964128

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106102440A TWI645757B (zh) 2016-03-31 2017-01-23 印刷配線基板

Country Status (5)

Country Link
JP (1) JP6694311B2 (ja)
KR (1) KR102138992B1 (ja)
CN (1) CN108886875B (ja)
TW (1) TWI645757B (ja)
WO (1) WO2017168952A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10294553A (ja) * 1997-04-18 1998-11-04 Tec Corp 回路基板
JP2004022734A (ja) * 2002-06-14 2004-01-22 Matsushita Electric Ind Co Ltd 部品実装基板
TW200707671A (en) * 2005-06-03 2007-02-16 Shinko Electric Ind Co Electronic device and method of manufacturing the same
TW200803674A (en) * 2006-06-01 2008-01-01 Phoenix Prec Technology Corp Method for fabricating circuit board with electrically connected structure
TW201132895A (en) * 2010-03-25 2011-10-01 Radiant Opto Electronics Corp LED light bar and backlight module including the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05102648A (ja) * 1991-10-04 1993-04-23 Hitachi Ltd プリント基板
JPH09199841A (ja) 1996-01-19 1997-07-31 Fuji Xerox Co Ltd プリント配線板
JPH09331146A (ja) * 1996-06-12 1997-12-22 Saitama Nippon Denki Kk 汎用表面実装部品ランド
JP2007080969A (ja) * 2005-09-12 2007-03-29 Sony Corp プリント配線板及びプリント配線板の製造方法
JP5326823B2 (ja) * 2009-05-28 2013-10-30 株式会社デンソー 配線基板およびそれを用いた電子部品の実装構造
JP5895374B2 (ja) * 2011-06-24 2016-03-30 株式会社村田製作所 電子部品
CN204598464U (zh) * 2015-04-24 2015-08-26 广州视源电子科技股份有限公司 一种电路板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10294553A (ja) * 1997-04-18 1998-11-04 Tec Corp 回路基板
JP2004022734A (ja) * 2002-06-14 2004-01-22 Matsushita Electric Ind Co Ltd 部品実装基板
TW200707671A (en) * 2005-06-03 2007-02-16 Shinko Electric Ind Co Electronic device and method of manufacturing the same
TW200803674A (en) * 2006-06-01 2008-01-01 Phoenix Prec Technology Corp Method for fabricating circuit board with electrically connected structure
TW201132895A (en) * 2010-03-25 2011-10-01 Radiant Opto Electronics Corp LED light bar and backlight module including the same

Also Published As

Publication number Publication date
JP6694311B2 (ja) 2020-05-13
TW201737772A (zh) 2017-10-16
CN108886875A (zh) 2018-11-23
KR20180116392A (ko) 2018-10-24
WO2017168952A1 (ja) 2017-10-05
KR102138992B1 (ko) 2020-07-28
CN108886875B (zh) 2021-02-26
JP2017183597A (ja) 2017-10-05

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