TWI645422B - 測試插座以及導電顆粒 - Google Patents

測試插座以及導電顆粒 Download PDF

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Publication number
TWI645422B
TWI645422B TW106115629A TW106115629A TWI645422B TW I645422 B TWI645422 B TW I645422B TW 106115629 A TW106115629 A TW 106115629A TW 106115629 A TW106115629 A TW 106115629A TW I645422 B TWI645422 B TW I645422B
Authority
TW
Taiwan
Prior art keywords
conductive
test socket
test
conductive particles
portions
Prior art date
Application number
TW106115629A
Other languages
English (en)
Chinese (zh)
Other versions
TW201743341A (zh
Inventor
鄭永倍
Original Assignee
Isc股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Isc股份有限公司 filed Critical Isc股份有限公司
Publication of TW201743341A publication Critical patent/TW201743341A/zh
Application granted granted Critical
Publication of TWI645422B publication Critical patent/TWI645422B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Measuring Leads Or Probes (AREA)
TW106115629A 2016-05-11 2017-05-11 測試插座以及導電顆粒 TWI645422B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160057823A KR101739537B1 (ko) 2016-05-11 2016-05-11 검사용 소켓 및 도전성 입자
??10-2016-0057823 2016-05-11

Publications (2)

Publication Number Publication Date
TW201743341A TW201743341A (zh) 2017-12-16
TWI645422B true TWI645422B (zh) 2018-12-21

Family

ID=59050977

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106115629A TWI645422B (zh) 2016-05-11 2017-05-11 測試插座以及導電顆粒

Country Status (4)

Country Link
KR (1) KR101739537B1 (fr)
CN (1) CN108780115B (fr)
TW (1) TWI645422B (fr)
WO (1) WO2017196094A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101901982B1 (ko) 2017-07-19 2018-09-27 주식회사 아이에스시 검사용 소켓 및 도전성 입자
KR102113732B1 (ko) * 2019-03-21 2020-05-21 주식회사 아이에스시 도전성 분말 및 이를 포함하는 검사용 커넥터
WO2021107484A1 (fr) 2019-11-26 2021-06-03 주식회사 스노우 Particules conductrices et prise de test les comprenant
KR102195339B1 (ko) * 2019-11-26 2020-12-24 김규선 도전성 입자
KR102204910B1 (ko) * 2019-11-26 2021-01-19 김규선 검사용 소켓
KR102211358B1 (ko) * 2020-03-19 2021-02-03 (주)티에스이 테스트 소켓 및 이를 포함하는 테스트 장치와, 테스트 소켓의 제조방법
KR102179457B1 (ko) * 2020-03-25 2020-11-16 (주)티에스이 테스트 소켓 및 이를 포함하는 테스트 장치와, 테스트 소켓의 제조방법
KR102393083B1 (ko) * 2020-08-21 2022-05-03 주식회사 스노우 도전성 입자 및 이를 포함하는 검사용 소켓

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200940994A (en) * 2008-03-31 2009-10-01 Leeno Ind Inc Socket for testing semiconductor chip
KR101019721B1 (ko) * 2008-11-11 2011-03-07 주식회사 아이에스시테크놀러지 기둥형 입자를 가지는 테스트 소켓
JP2011112552A (ja) * 2009-11-27 2011-06-09 Renesas Electronics Corp 半導体パッケージのソケット装置、及び半導体パッケージのテスト装置
KR20110061998A (ko) * 2009-12-02 2011-06-10 주식회사 오킨스전자 반도체칩 패키지 테스트용 콘택트
KR101246301B1 (ko) * 2012-01-18 2013-03-22 이재학 미세선형체가 마련된 테스트용 소켓
KR101266124B1 (ko) * 2012-04-03 2013-05-27 주식회사 아이에스시 고밀도 도전부를 가지는 테스트용 소켓 및 그 제조방법
KR101586340B1 (ko) * 2014-12-26 2016-01-18 주식회사 아이에스시 전기적 검사 소켓 및 전기적 검사 소켓용 도전성 입자의 제조방법
KR101606284B1 (ko) * 2014-10-29 2016-03-25 주식회사 아이에스시 관통 홀이 형성된 다공성 절연시트를 갖는 전기적 접속체 및 테스트 소켓
US20160109480A1 (en) * 2014-10-21 2016-04-21 Jong-Won Han Test socket for testing semiconductor chip package and method of manufacturing the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI239684B (en) * 2003-04-16 2005-09-11 Jsr Corp Anisotropic conductive connector and electric inspection device for circuit device
US7446544B2 (en) * 2004-03-31 2008-11-04 Jsr Corporation Probe apparatus, wafer inspecting apparatus provided with the probe apparatus and wafer inspecting method
JP2011150837A (ja) 2010-01-20 2011-08-04 Jsr Corp 回路接続部材、導電性粒子および導電性粒子の製造方法
KR101339166B1 (ko) * 2012-06-18 2013-12-09 주식회사 아이에스시 관통공이 형성된 도전성 입자를 가지는 검사용 소켓 및 그 제조방법
KR101471116B1 (ko) 2014-02-13 2014-12-12 주식회사 아이에스시 고밀도 도전부를 가지는 테스트용 소켓
KR101492242B1 (ko) * 2014-07-17 2015-02-13 주식회사 아이에스시 검사용 접촉장치 및 전기적 검사소켓
CN105527472B (zh) * 2014-10-17 2018-10-02 株式会社Isc 测试座
KR101525520B1 (ko) * 2015-02-03 2015-06-03 (주)티에스이 결합 형상의 도전성 입자를 가지는 검사용 소켓

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200940994A (en) * 2008-03-31 2009-10-01 Leeno Ind Inc Socket for testing semiconductor chip
KR101019721B1 (ko) * 2008-11-11 2011-03-07 주식회사 아이에스시테크놀러지 기둥형 입자를 가지는 테스트 소켓
JP2011112552A (ja) * 2009-11-27 2011-06-09 Renesas Electronics Corp 半導体パッケージのソケット装置、及び半導体パッケージのテスト装置
KR20110061998A (ko) * 2009-12-02 2011-06-10 주식회사 오킨스전자 반도체칩 패키지 테스트용 콘택트
KR101246301B1 (ko) * 2012-01-18 2013-03-22 이재학 미세선형체가 마련된 테스트용 소켓
KR101266124B1 (ko) * 2012-04-03 2013-05-27 주식회사 아이에스시 고밀도 도전부를 가지는 테스트용 소켓 및 그 제조방법
US20160109480A1 (en) * 2014-10-21 2016-04-21 Jong-Won Han Test socket for testing semiconductor chip package and method of manufacturing the same
KR101606284B1 (ko) * 2014-10-29 2016-03-25 주식회사 아이에스시 관통 홀이 형성된 다공성 절연시트를 갖는 전기적 접속체 및 테스트 소켓
KR101586340B1 (ko) * 2014-12-26 2016-01-18 주식회사 아이에스시 전기적 검사 소켓 및 전기적 검사 소켓용 도전성 입자의 제조방법

Also Published As

Publication number Publication date
CN108780115A (zh) 2018-11-09
WO2017196094A1 (fr) 2017-11-16
KR101739537B1 (ko) 2017-05-25
TW201743341A (zh) 2017-12-16
CN108780115B (zh) 2020-12-15

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