TWI645422B - Test socket and conductive particle - Google Patents

Test socket and conductive particle Download PDF

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TWI645422B
TWI645422B TW106115629A TW106115629A TWI645422B TW I645422 B TWI645422 B TW I645422B TW 106115629 A TW106115629 A TW 106115629A TW 106115629 A TW106115629 A TW 106115629A TW I645422 B TWI645422 B TW I645422B
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conductive
test socket
test
conductive particles
portions
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TW106115629A
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Chinese (zh)
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TW201743341A (en
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鄭永倍
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Isc股份有限公司
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416Connectors, terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber

Abstract

本發明是有關於一種測試插座。測試插座包括:多個導 電部,排列於與測試目標裝置的端子對應的位置且在測試插座的表面方向上彼此間隔開,導電部中的每一者包括多個導電顆粒,多個導電顆粒包含於彈性絕緣材料中且在測試插座的厚度方向上對齊;以及絕緣支撐體,排列於彼此間隔開的導電部之間,以支撐導電部並使導電部在表面方向上彼此絕緣,導電顆粒包括:本體,具有柱形狀;以及至少兩個突出部,自本體的上端部突出,其中在彼此相鄰的突出部之間設置有朝本體凹陷的凹陷部,且突出部的相互面對的內表面之間的角度是大於90°的鈍角。 The invention relates to a test socket. The test socket includes: The electrical parts are arranged at positions corresponding to the terminals of the test target device and spaced apart from each other in the surface direction of the test socket. Each of the conductive parts includes a plurality of conductive particles, and the plurality of conductive particles are contained in an elastic insulating material Align in the thickness direction of the test socket; and an insulating support arranged between the conductive portions spaced apart from each other to support the conductive portions and insulate the conductive portions from each other in the surface direction, and the conductive particles include: a body having a pillar shape; And at least two protruding portions protruding from the upper end portion of the body, wherein recessed portions recessed toward the body are provided between adjacent protruding portions, and an angle between mutually facing inner surfaces of the protruding portions is greater than 90 ° obtuse angle.

Description

測試插座以及導電顆粒 Test socket and conductive particles

本發明是有關於一種測試插座以及導電顆粒,且更具體而言是有關於一種被配置成即便當測試插座頻繁接觸測試目標裝置時仍長時間維持導電性的測試插座及導電顆粒。The present invention relates to a test socket and conductive particles, and more particularly, to a test socket and conductive particles configured to maintain conductivity for a long time even when the test socket frequently contacts a test target device.

一般而言,在測試製程期間使用測試插座以檢查所製造裝置是否具有缺陷或錯誤。舉例而言,當執行電性測試以檢查所製造裝置(測試目標裝置)是否具有缺陷或錯誤時,不使所述測試目標裝置與測試設備直接地接觸彼此而是藉由測試插座間接地連接至彼此。此乃因測試設備相對昂貴且在因頻繁接觸測試目標裝置而被磨損或損壞,進而需要被新測試設備取代時造成困難及高的成本。因此,可將測試插座可拆卸地附接至測試設備的上側,且接著可藉由使測試目標裝置接觸測試插座而非使測試目標裝置接觸測試設備來將欲測試的所述測試目標裝置電性連接至所述測試設備。此後,可經由測試插座將自測試設備產生的電性訊號傳輸至測試目標裝置。In general, test sockets are used during the testing process to check whether the manufactured device has defects or errors. For example, when performing an electrical test to check whether a manufactured device (a test target device) has defects or errors, the test target device and the test equipment are not directly contacted with each other but are indirectly connected to the test socket through a test socket. each other. This is because the test equipment is relatively expensive and is worn and damaged due to frequent contact with the test target device, which causes difficulties and high costs when it needs to be replaced by new test equipment. Therefore, the test socket can be detachably attached to the upper side of the test device, and then the test target device to be tested can be electrically tested by contacting the test target device with the test socket instead of the test target device with the test device. Connect to the test equipment. Thereafter, the electrical signals generated from the test equipment can be transmitted to the test target device through the test socket.

此種測試插座被稱作「各向異性導電連接件(anisotropic conductive connector)」,且相關技術的各向異性導電連接件被示出於圖1及圖2中。圖1是說明相關技術的各向異性導電連接件10的平面圖,且圖2是說明圖1中所示各向異性導電連接件10的剖視圖。Such a test socket is called an anisotropic conductive connector, and the related art anisotropic conductive connector is shown in FIG. 1 and FIG. 2. FIG. 1 is a plan view illustrating an anisotropic conductive connection member 10 of the related art, and FIG. 2 is a cross-sectional view illustrating the anisotropic conductive connection member 10 shown in FIG. 1.

各向異性導電連接件10包括:彈性各向異性導電膜(elastic anisotropic conductive film)15,在彈性各向異性導電膜15的厚度方向上具有導電性;以及框架板(frame plate)20,包含金屬材料且支撐彈性各向異性導電膜15。The anisotropic conductive connecting member 10 includes: an elastic anisotropic conductive film 15 having conductivity in a thickness direction of the elastic anisotropic conductive film 15; and a frame plate 20 including a metal Material and supports the elastic anisotropic conductive film 15.

如圖3中所示,在框架板20的長度方向及寬度方向上並排地形成有多個穿透孔(penetration hole)21,所述多個穿透孔21具有矩形橫截面形狀且可在框架板20的厚度方向上延伸。在所示實例中,在框架板20的周邊區中形成有用於對齊及放置各向異性導電連接件10的多個位置孔(position hole)。As shown in FIG. 3, a plurality of penetration holes 21 are formed side by side in the length direction and the width direction of the frame plate 20, and the plurality of penetration holes 21 have a rectangular cross-sectional shape and can be formed in the frame. The plate 20 extends in the thickness direction. In the illustrated example, a plurality of position holes for aligning and placing the anisotropic conductive connector 10 are formed in a peripheral region of the frame plate 20.

在彈性各向異性導電膜15的表面方向上,在與電極圖案對應的圖案中間隔地排列有用於與所述電極進行連接的多個導電連接部16。詳言之,在彈性各向異性導電膜15的長度方向及寬度方向上並排地排列有多個導電連接部群組,所述多個導電連接部群組中的每一者包括根據圖案的格柵點(grid point)來排列的多個導電連接部16。此外,在本實例中,可在自身的厚度方向上延伸的多個導電非連接部(conductive non-connection portion)18,在未排列有導電連接部群組的位置彼此間隔開地排列成環繞所述導電連接部群組,導電非連接部18以與排列導電連接部16相同的節距在表面方向上進行排列。導電連接部16與導電非連接部18藉由排列於導電連接部16與導電非連接部18之間的絕緣部17而彼此絕緣。導電連接部16及導電非連接部18中的每一者包括磁性導電顆粒,所述磁性導電顆粒在絕緣彈性聚合物的厚度方向上緊密地排列於所述絕緣彈性聚合物中,且絕緣部17包含所述絕緣彈性聚合物。在所示實例中,導電連接部16中的每一者包括分別自絕緣部17的兩側突出的突出部位16A及16B。另外,彈性各向異性導電膜15被整體地固定至框架板20,且被框架板20以使得導電連接部群組分別位於框架板20的穿透孔21中的方式支撐,且導電非連接部18放置於框架板20上。In the surface direction of the elastic anisotropic conductive film 15, a plurality of conductive connection portions 16 for connecting to the electrodes are arranged at intervals in a pattern corresponding to the electrode pattern. In detail, a plurality of conductive connection group groups are arranged side by side in a length direction and a width direction of the elastic anisotropic conductive film 15, and each of the plurality of conductive connection group groups includes a grid according to a pattern. A plurality of conductive connection portions 16 arranged at a grid point. In addition, in this example, a plurality of conductive non-connection portions 18 that can extend in its own thickness direction are arranged spaced apart from each other at a position where the group of conductive connection portions are not arranged to surround each other. In the group of conductive connection portions, the conductive non-connection portions 18 are arranged in the surface direction at the same pitch as that of the conductive connection portions 16. The conductive connection portion 16 and the conductive non-connection portion 18 are insulated from each other by an insulating portion 17 arranged between the conductive connection portion 16 and the conductive non-connection portion 18. Each of the conductive connection portion 16 and the conductive non-connection portion 18 includes magnetic conductive particles that are closely arranged in the insulating elastic polymer in the thickness direction of the insulating elastic polymer, and the insulating portion 17 Contains the insulating elastic polymer. In the illustrated example, each of the conductive connection portions 16 includes protruding portions 16A and 16B that respectively protrude from both sides of the insulating portion 17. In addition, the elastic anisotropic conductive film 15 is integrally fixed to the frame plate 20 and is supported by the frame plate 20 so that the conductive connection portion groups are respectively located in the through holes 21 of the frame plate 20, and the conductive non-connection portions 18 is placed on the frame plate 20.

可如下製造相關技術的此種各向異性導電連接件。Such an anisotropic conductive connection member of the related art can be manufactured as follows.

首先,製造如圖3中所示的框架板20。接下來,藉由將磁性導電顆粒P分散至可被固化成絕緣彈性聚合物的液體聚合物成形材料中來製備可流動成形材料。另外,如圖3中所示,製備用於形成彈性各向異性導電膜的模具50。接下來,使用間隔件(圖中未示出)將框架板20對齊及設置於模具50的下部模具56的上表面上方,且使用間隔件(圖中未示出)將模具50的上部模具51對齊及設置於框架板20上方。接著,將所製備成形材料填充於由上部模具51、下部模具56、所述間隔壁、及框架板20而形成的成形空間中,以形成成形材料層15A。First, a frame plate 20 as shown in FIG. 3 is manufactured. Next, a flowable molding material is prepared by dispersing the magnetic conductive particles P into a liquid polymer molding material that can be cured into an insulating elastic polymer. In addition, as shown in FIG. 3, a mold 50 for forming an elastically anisotropic conductive film is prepared. Next, the spacer plate (not shown) is used to align and place the frame plate 20 above the upper surface of the lower mold 56 of the mold 50, and the spacer 50 (not shown) is used to align the upper mold 51 of the mold 50 Aligned and disposed above the frame plate 20. Next, the prepared molding material is filled in a molding space formed by the upper mold 51, the lower mold 56, the partition wall, and the frame plate 20 to form a molding material layer 15A.

接下來,在上部模具51的鐵磁性基板52的上表面及下部模具56的鐵磁性基板57的下表面上放置電磁體(electromanget)或永久磁體(permanent magnet),以使得可在成形材料層15A的厚度方向上施加具有非均勻強度分佈的平行磁場。亦即,在成形材料層15A的厚度方向上施加平行磁場,所述平行磁場在上部模具51的磁性構件54A與下部模具56的和磁性構件54A對應的磁性構件59A之間具有相對高的磁性強度。接著,如圖4中所示,將分散於成形材料層15A中的導電顆粒P,聚集於上部模具51的磁性構件54A與下部模具56的磁性構件59A之間的區域中,且使導電顆粒P在成形材料層15A的厚度方向上對齊。Next, an electromanget or a permanent magnet is placed on the upper surface of the ferromagnetic substrate 52 of the upper mold 51 and the lower surface of the ferromagnetic substrate 57 of the lower mold 56 so that the molding material layer 15A A parallel magnetic field with a non-uniform intensity distribution is applied in the thickness direction of. That is, a parallel magnetic field is applied in the thickness direction of the forming material layer 15A, and the parallel magnetic field has a relatively high magnetic strength between the magnetic member 54A of the upper mold 51 and the magnetic member 59A corresponding to the magnetic member 54A of the lower mold 56. . Next, as shown in FIG. 4, the conductive particles P dispersed in the forming material layer 15A are gathered in a region between the magnetic member 54A of the upper mold 51 and the magnetic member 59A of the lower mold 56, and the conductive particles P are made. It is aligned in the thickness direction of the forming material layer 15A.

在此種狀態中,將成形材料層15A固化,藉此形成固定至框架板20的彈性各向異性導電膜15。彈性各向異性導電膜15包括:導電連接部16及導電非連接部18,包括緊密地排列於上部模具51的磁性構件54A與下部模具56的磁性構件59A之間的導電顆粒P;以及絕緣部17,不具有導電顆粒P或具有非常少的導電顆粒P,且絕緣部17排列於導電連接部16與導電非連接部18之間。藉由此方式,製造出各向異性導電連接件10。In this state, the molding material layer 15A is cured, thereby forming the elastic anisotropic conductive film 15 fixed to the frame plate 20. The elastic anisotropic conductive film 15 includes a conductive connection portion 16 and a conductive non-connection portion 18 including conductive particles P closely arranged between the magnetic member 54A of the upper mold 51 and the magnetic member 59A of the lower mold 56; and an insulating portion. 17. The conductive particles P are not provided or have very few conductive particles P, and the insulating portion 17 is arranged between the conductive connection portion 16 and the conductive non-connection portion 18. In this way, an anisotropic conductive connection 10 is manufactured.

此種各向異性導電連接件包括其中導電顆粒排列於彈性絕緣材料中的導電部,且所述導電部頻繁接觸測試目標裝置的端子。如上所述,當測試目標裝置的端子頻繁接觸導電部時,分佈於彈性絕緣材料中的導電顆粒可輕易地與彈性絕緣材料分離。具體而言,由於導電顆粒具有球體形狀,因此導電顆粒可更輕易地與彈性絕緣材料分離。如上所述,若將導電顆粒分離,則各向異性導電連接件的導電性可能降低,且因此可能對測試可靠性造成負面影響。Such an anisotropic conductive connection includes a conductive portion in which conductive particles are arranged in an elastic insulating material, and the conductive portion frequently contacts a terminal of a test target device. As described above, when the terminals of the test target device frequently contact the conductive portion, the conductive particles distributed in the elastic insulating material can be easily separated from the elastic insulating material. Specifically, since the conductive particles have a spherical shape, the conductive particles can be more easily separated from the elastic insulating material. As described above, if the conductive particles are separated, the conductivity of the anisotropic conductive connection member may be reduced, and thus the test reliability may be negatively affected.

在由本申請案的申請人提出申請的標題為「具有導電柱顆粒的測試插座(Test Socket with Conductive Pillar Particles)」的韓國專利第1019721號中揭露了一種用於解決與先前技術的球體導電顆粒相關的問題的技術。如圖5中所示,此種測試插座30包括:導電部31,分別包括多個導電柱顆粒311,所述多個導電柱顆粒311包含於彈性絕緣材料中;以及絕緣支撐體32,支撐導電部31。由於導電柱顆粒311分佈於測試插座30的導電部31中,因此鄰近的導電柱顆粒311之間的接觸面積可為相對大的,且因此測試插座30的電阻可減小,藉此提供穩定的電性連接。另外,由於相較於先前技術的球體導電顆粒而言導電柱顆粒311與彈性絕緣材料具有相對大的接觸面積,因此導電柱顆粒311與彈性絕緣材料之間的黏合是強的,且因此即便當重複執行測試時,導電柱顆粒311仍可能無法輕易地與彈性絕緣材料分離。In Korean Patent No. 1019721, entitled "Test Socket with Conductive Pillar Particles", filed by the applicant of the present application, a solution for solving the problems related to the conductive particles of the prior art is disclosed. Problematic technology. As shown in FIG. 5, such a test socket 30 includes: a conductive portion 31 including a plurality of conductive pillar particles 311 respectively, the plurality of conductive pillar particles 311 being contained in an elastic insulating material; and an insulating support body 32 that supports conductive部 31。 31. Since the conductive pillar particles 311 are distributed in the conductive portion 31 of the test socket 30, the contact area between adjacent conductive pillar particles 311 can be relatively large, and therefore the resistance of the test socket 30 can be reduced, thereby providing a stable Electrical connection. In addition, since the conductive pillar particles 311 and the elastic insulating material have a relatively large contact area compared to the spherical conductive particles of the prior art, the adhesion between the conductive pillar particles 311 and the elastic insulating material is strong, and therefore even when When the test is repeatedly performed, the conductive pillar particles 311 may still not be easily separated from the elastic insulating material.

儘管導電柱顆粒311提供相較於球體導電顆粒而言提高的導電性,然而若緊密地排列於導電部31中的導電柱顆粒311不如圖6(a)中所示垂直地對齊,則導電柱顆粒311可能如圖6(b)中所示因壓縮力而被壓縮成非對齊狀態。在此情形中,導電柱顆粒311之間的接觸點可能無法得到維持,且導電柱顆粒311甚至當壓縮力被釋放時仍可能無法返回至其原始位置。Although the conductive pillar particles 311 provide improved conductivity compared to the spherical conductive particles, if the conductive pillar particles 311 closely arranged in the conductive portion 31 are not vertically aligned as shown in FIG. 6 (a), the conductive pillars The particles 311 may be compressed into a non-aligned state due to a compressive force as shown in FIG. 6 (b). In this case, the contact point between the conductive pillar particles 311 may not be maintained, and the conductive pillar particles 311 may not be able to return to their original positions even when the compressive force is released.

提供本發明是為瞭解決上述問題。更具體而言,本發明的目標是提供一種被配置成防止導電顆粒與導電部在頻繁接觸期間分離,以在導電部被壓縮及擴張的同時保證導電顆粒之間的牢固電性連接的測試插座,以及提供一種導電顆粒。The present invention is provided to solve the above problems. More specifically, it is an object of the present invention to provide a test socket configured to prevent the conductive particles from being separated from the conductive portion during frequent contact, so as to ensure a strong electrical connection between the conductive particles while the conductive portion is compressed and expanded. And provide a conductive particle.

為達成上述目標,本發明的實施例提供一種測試插座,所述測試插座被配置成放置於測試目標裝置與測試設備之間,以將所述測試目標裝置的端子電性連接至所述測試設備的接墊,所述測試插座包括:多個導電部,排列於與所述測試目標裝置的所述端子對應的位置且在所述測試插座的表面方向上彼此間隔開,所述導電部中的每一者包括多個導電顆粒,所述多個導電顆粒包含於彈性絕緣材料中且在所述測試插座的厚度方向上對齊;以及絕緣支撐體,排列於彼此間隔開的所述導電部之間,以支撐所述導電部並使所述導電部在所述表面方向上彼此絕緣,其中所述導電顆粒中的每一者包括:本體,具有柱形狀;以及至少兩個突出部,自所述本體的上端部突出,其中在彼此相鄰的所述突出部之間設置有朝所述本體凹陷的凹陷部,且所述突出部的相互面對的內表面之間的角度是大於90°的鈍角。To achieve the above objective, an embodiment of the present invention provides a test socket configured to be placed between a test target device and a test device to electrically connect a terminal of the test target device to the test device. The test socket includes a plurality of conductive parts arranged at positions corresponding to the terminals of the test target device and spaced apart from each other in a surface direction of the test socket. Each includes a plurality of conductive particles contained in an elastic insulating material and aligned in a thickness direction of the test socket; and an insulating support arranged between the conductive portions spaced apart from each other. To support the conductive portions and insulate the conductive portions from each other in the surface direction, wherein each of the conductive particles includes: a body having a pillar shape; and at least two protruding portions from the An upper end portion of the body is protruded, and a recessed portion recessed toward the body is provided between the protruding portions adjacent to each other, and the inner sides of the protruding portions facing each other The angle between the surface of an obtuse angle greater than 90 °.

所述本體的形狀及大小可使得當利用磁場將所述導電顆粒在所述彈性絕緣材料中對齊時,所述導電顆粒可站立於所述厚度方向上。The shape and size of the body can make the conductive particles stand in the thickness direction when the conductive particles are aligned in the elastic insulating material using a magnetic field.

所述本體中的每一者可具有大於1的h/w比率,其中h是指自所述本體的所述上端部至下端部量測的垂直長度,且w是指與所述垂直長度垂直的所述本體的水平長度。Each of the bodies may have an h / w ratio greater than 1, where h refers to a vertical length measured from the upper end portion to the lower end portion of the body, and w refers to a direction perpendicular to the vertical length The horizontal length of the body.

所述本體中的每一者可具有大於1的w/d比率,其中d是指所述本體的厚度。Each of the bodies may have a w / d ratio greater than 1, where d refers to the thickness of the body.

所述突出部的所述相互面對的內表面可被傾斜成將相鄰的導電顆粒的突出部引導至所述凹陷部中。The mutually facing inner surfaces of the protrusions may be inclined to guide protrusions of adjacent conductive particles into the depressions.

在所述本體的所述上端部與下端部之間可設置有側向表面,且所述側向表面可自所述本體的所述上端部及所述下端部朝所述本體的中心部朝內凹陷。A lateral surface may be provided between the upper end portion and the lower end portion of the body, and the lateral surface may face from the upper end portion and the lower end portion of the body toward a center portion of the body. Inside depression.

在所述本體的側向表面上可設置有多個凹凸部。A plurality of uneven portions may be provided on a lateral surface of the body.

至少兩個突出部可自所述本體的下端部突出。At least two protrusions may protrude from a lower end portion of the body.

所述本體的所述上端部與所述下端部上的所述突出部可相對於所述本體對稱。The upper end portion of the body and the protruding portion on the lower end portion may be symmetrical with respect to the body.

為達成上述目標,本發明的實施例提供一種用於在測試插座中使用的導電顆粒,所述測試插座被配置成放置於測試目標裝置與測試設備之間,以將所述測試目標裝置的端子電性連接至所述測試設備的接墊,其中所述導電顆粒包括在所述測試插座的厚度方向上在所述測試插座的導電部中對齊的多個導電顆粒,所述導電顆粒排列於彈性絕緣材料中,且當所述測試目標裝置的所述端子按壓所述導電部時,排列於所述導電部中的所述導電顆粒彼此接觸而使所述導電部變得有導電性,其中所述導電顆粒中的每一者包括:本體,具有柱形狀;以及至少兩個突出部,自所述本體的上端部突出,其中在彼此相鄰的所述突出部之間設置有朝所述本體凹陷的凹陷部,且所述突出部的相互面對的內表面之間的角度是大於90°的鈍角。 In order to achieve the above object, an embodiment of the present invention provides a conductive particle for use in a test socket configured to be placed between a test target device and a test device to connect a terminal of the test target device. The pad electrically connected to the test device, wherein the conductive particles include a plurality of conductive particles aligned in a conductive portion of the test socket in a thickness direction of the test socket, and the conductive particles are arranged in elasticity. In the insulating material, and when the terminal of the test target device presses the conductive portion, the conductive particles arranged in the conductive portion contact each other to make the conductive portion conductive, wherein Each of the conductive particles includes: a body having a pillar shape; and at least two protrusions protruding from an upper end portion of the body, wherein a protrusion toward the body is provided between the protrusions adjacent to each other. A recessed recessed portion, and an angle between mutually facing inner surfaces of the protruding portions is an obtuse angle greater than 90 °.

所述突出部的所述相互面對的內表面可被傾斜成將相鄰的導電顆粒的突出部引導至所述凹陷部中。 The mutually facing inner surfaces of the protrusions may be inclined to guide protrusions of adjacent conductive particles into the depressions.

所述本體可在一個方向上伸長,以使得當藉由磁場將所述導電顆粒在所述彈性絕緣材料中對齊時,所述導電顆粒可站立於所述測試插座的所述厚度方向上。 The body can be elongated in one direction so that when the conductive particles are aligned in the elastic insulating material by a magnetic field, the conductive particles can stand in the thickness direction of the test socket.

至少兩個突出部可自所述本體的下端部突出。 At least two protrusions may protrude from a lower end portion of the body.

根據本發明,所述測試插座的導電顆粒的相互面對的內表面之間的角度是鈍角(即,大於90°),且因此經耦合的導電顆粒之間可維持一點接觸(one-point contact),藉此提高接觸穩定性。 According to the present invention, the angle between the mutually facing inner surfaces of the conductive particles of the test socket is an obtuse angle (ie, greater than 90 °), and thus one-point contact can be maintained between the coupled conductive particles. ) To improve contact stability.

在下文中,將參照附圖根據本發明的實施例來詳細闡述測試插座。Hereinafter, a test socket according to an embodiment of the present invention will be explained in detail with reference to the accompanying drawings.

根據本發明的較佳實施例,測試插座100呈具有預定厚度的片材形式,且被配置成在測試插座100的表面方向上阻擋電流並在測試插座100的厚度方向上傳導電流,以在垂直方向上將測試目標裝置130的端子131電性連接至測試設備140的接墊141。測試插座100可用於對測試目標裝置130執行電性測試。According to a preferred embodiment of the present invention, the test socket 100 is in the form of a sheet having a predetermined thickness, and is configured to block current in a surface direction of the test socket 100 and conduct current in a thickness direction of the test socket 100 to be perpendicular to The terminal 131 of the test target device 130 is electrically connected to the pad 141 of the test device 140 in a direction. The test socket 100 can be used to perform an electrical test on the test target device 130.

測試插座100包括導電部110及絕緣支撐體120。導電部110在厚度方向上延伸,且當導電部110在厚度方向上被按壓時,導電部110可被壓縮且可在厚度方向傳導電流。導電部110在表面方向上彼此間隔開且絕緣支撐體120排列於導電部110之間,使得電流可不在導電部110之間流動。現將詳細闡述導電部110及絕緣支撐體120。The test socket 100 includes a conductive portion 110 and an insulating support 120. The conductive portion 110 extends in the thickness direction, and when the conductive portion 110 is pressed in the thickness direction, the conductive portion 110 can be compressed and can conduct current in the thickness direction. The conductive portions 110 are spaced apart from each other in the surface direction and the insulating support 120 is arranged between the conductive portions 110 so that a current may not flow between the conductive portions 110. The conductive portion 110 and the insulating support 120 will now be described in detail.

導電部110的上端部可接觸測試目標裝置130的端子131,且導電部110的下端部可接觸測試設備140的接墊141。在彈性絕緣材料中、導電部110中的每一者的上端部與下端部之間垂直地對齊有多個導電顆粒111。當導電部110被測試目標裝置130按壓時,導電顆粒111可彼此接觸並傳導電流。亦即,當導電部110不被測試目標裝置130按壓時,導電顆粒111稍微彼此間隔開或彼此接觸,且當導電部110被測試目標裝置130按壓及壓縮時,導電顆粒111可牢固地彼此接觸,且因此可傳導電流。An upper end portion of the conductive portion 110 may contact a terminal 131 of the test target device 130, and a lower end portion of the conductive portion 110 may contact a pad 141 of the test device 140. In the elastic insulating material, a plurality of conductive particles 111 are vertically aligned between an upper end portion and a lower end portion of each of the conductive portions 110. When the conductive part 110 is pressed by the test target device 130, the conductive particles 111 may contact each other and conduct current. That is, when the conductive portion 110 is not pressed by the test target device 130, the conductive particles 111 are slightly spaced apart from or in contact with each other, and when the conductive portion 110 is pressed and compressed by the test target device 130, the conductive particles 111 can be firmly in contact with each other , And therefore can conduct current.

具體而言,導電部110是藉由在彈性絕緣材料中緊密地垂直排列導電顆粒111而形成,且導電部110位於與測試目標裝置130的端子131近似對應的位置。Specifically, the conductive portion 110 is formed by closely and vertically arranging conductive particles 111 in an elastic insulating material, and the conductive portion 110 is located at a position approximately corresponding to the terminal 131 of the test target device 130.

較佳地,所述彈性絕緣材料可包含具有交聯結構(crosslinked structure)的絕緣聚合物物質。可使用各種可固化聚合物成形材料來獲得此種交聯聚合物物質。所述交聯聚合物物質的具體實例包括:共軛二烯橡膠(conjugated diene rubber),例如聚丁二烯橡膠(polybutadiene rubber)、天然橡膠、聚異戊二烯橡膠(polyisoprene rubber)、苯乙烯-丁二烯共聚物橡膠(styrene-butadiene copolymer rubber)、或丙烯腈-丁二烯共聚物橡膠(acrylonitrile-butadiene copolymer rubber);共軛二烯橡膠的氫化產物;嵌段共聚物橡膠(block copolymer rubber),例如苯乙烯-丁二烯-二烯嵌段共聚物橡膠(styrene-butadiene-diene block copolymer rubber)或苯乙烯-異戊二烯嵌段共聚物橡膠(styrene-isoprene block copolymer rubber);嵌段共聚物橡膠的氫化產物;氯丁二烯橡膠(chloroprene rubber);胺基甲酸酯橡膠(urethane rubber);聚酯橡膠(polyester rubber);表氯醇橡膠(epichlorohydrin rubber);矽酮橡膠(silicone rubber);乙烯-丙烯共聚物橡膠(ethylene-propylene copolymer rubber);以及乙烯-丙烯-二烯共聚物橡膠(ethylene-propylene-diene copolymer rubber)。由於矽酮橡膠具有較佳的可成形性(formability)及電性特性,因此可使用矽酮橡膠。Preferably, the elastic insulating material may include an insulating polymer substance having a crosslinked structure. A variety of curable polymer forming materials can be used to obtain such crosslinked polymer materials. Specific examples of the cross-linked polymer substance include: conjugated diene rubber, such as polybutadiene rubber, natural rubber, polyisoprene rubber, styrene -Butadiene copolymer rubber (styrene-butadiene copolymer rubber), or acrylonitrile-butadiene copolymer rubber (acrylonitrile-butadiene copolymer rubber); hydrogenation products of conjugated diene rubber; block copolymer rubber (block copolymer rubber), such as styrene-butadiene-diene block copolymer rubber (styrene-butadiene-diene block copolymer rubber) or styrene-isoprene block copolymer rubber (styrene-isoprene block copolymer rubber); Hydrogenation products of block copolymer rubber; chloroprene rubber; urethane rubber; polyester rubber; epichlorohydrin rubber; silicone rubber (Silicone rubber); ethylene-propylene copolymer rubber (ethylene-propylene copolymer rubber); and ethylene -Propylene-diene copolymer rubber. Since silicone rubber has better formability and electrical properties, silicone rubber can be used.

較佳地,所述矽酮橡膠可藉由交聯(crosslinking)或縮合(condensation)而自液體矽酮橡膠獲得。液體矽酮橡膠可較佳地當以10-1 秒的剪切速率(shear rate)量測時具有不高於105 泊(poise)的黏度。液體矽酮橡膠可為縮合固化矽酮橡膠(condensation curing silicone rubber)、加成固化矽酮橡膠(addition curing silicone rubber)、及具有乙烯基或羥基的矽酮橡膠中的一種。液體矽酮橡膠的具體實例可包括二甲基矽酮生橡膠(dimethyl silicone raw rubber)、甲基乙烯基矽酮生橡膠(methyl vinyl silicone raw rubber)、及甲基苯基乙烯基矽酮生橡膠(methyl phenyl vinyl silicon raw rubber)。Preferably, the silicone rubber can be obtained from a liquid silicone rubber by crosslinking or condensation. Liquid silicone rubber may preferably be one when a shear rate of 10 -1 sec (shear rate) having a viscosity of not higher than 105 poises (Poise) when measured. The liquid silicone rubber may be one of condensation curing silicone rubber, addition curing silicone rubber, and silicone rubber having vinyl or hydroxyl groups. Specific examples of the liquid silicone rubber may include dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, and methylphenyl vinyl silicone raw rubber (Methyl phenyl vinyl silicon raw rubber).

導電顆粒111中的每一者包括整體具有柱形狀的本體112及自本體112的上端部與下端部突出的突出部113。Each of the conductive particles 111 includes a body 112 having a column shape as a whole, and a protruding portion 113 protruding from an upper end portion and a lower end portion of the body 112.

本體112具有近似柱形狀,具體而言具有細的四稜柱形狀。儘管在以上實例中將本體112闡述為具有四稜柱形狀,然而本體112並非僅限於此。舉例而言,本體112可具有多稜柱形狀。The body 112 has an approximately columnar shape, and specifically has a thin rectangular prism shape. Although the body 112 is described as having a quadrangular prism shape in the above example, the body 112 is not limited thereto. For example, the body 112 may have a polygonal prism shape.

本體112的形狀及大小被確定成使得可藉由利用磁場將導電顆粒111在彈性絕緣材料中對齊而使導電顆粒111站立於厚度方向上。亦即,當製造測試插座100時,會以其中分佈有導電顆粒111的液體矽酮橡膠來填充模具150,且在一個方向上施加磁場以將導電顆粒111線性地排列於與導電部110對應的位置。對於此製程,將本體112的尺寸確定成使得導電顆粒111可站立於一個方向上是重要的。為此,本體112可具有在一個方向上延伸的長柱形狀。The shape and size of the body 112 are determined so that the conductive particles 111 can stand in the thickness direction by aligning the conductive particles 111 in the elastic insulating material by using a magnetic field. That is, when the test socket 100 is manufactured, the mold 150 is filled with the liquid silicone rubber in which the conductive particles 111 are distributed, and a magnetic field is applied in one direction to linearly arrange the conductive particles 111 to correspond to the conductive portion 110. position. For this process, it is important to size the body 112 so that the conductive particles 111 can stand in one direction. To this end, the body 112 may have a long column shape extending in one direction.

具體而言,本體112中的每一者可具有大於1的h/w比率,其中h是指自本體112的上端部至下端部的垂直長度,且w是指與所述垂直長度垂直的本體112的水平長度。當h/w比率大於1時,本體112的垂直長度大於本體112的水平長度,且因此本體112可輕易地站立於與厚度方向平行的方向上。因此,當導電顆粒111在厚度方向上對齊時,自相鄰本體112延伸的突出部113可輕易地耦合至彼此。然而,若h/w比率小於1,則導電顆粒111可能不同地定向,且因此,突出部113可能無法輕易地耦合至彼此。Specifically, each of the bodies 112 may have an h / w ratio greater than 1, where h refers to a vertical length from an upper end portion to a lower end portion of the body 112, and w refers to a body perpendicular to the vertical length. The horizontal length of 112. When the h / w ratio is greater than 1, the vertical length of the body 112 is greater than the horizontal length of the body 112, and therefore the body 112 can easily stand in a direction parallel to the thickness direction. Therefore, when the conductive particles 111 are aligned in the thickness direction, the protrusions 113 extending from the adjacent bodies 112 can be easily coupled to each other. However, if the h / w ratio is less than 1, the conductive particles 111 may be oriented differently, and therefore, the protrusions 113 may not be easily coupled to each other.

另外,本體112可具有大於1的w/d比率,其中d是指本體112的厚度。亦即,本體112可具有矩形水平橫截面而非正方形水平橫截面。當本體112具有大於1的w/d比率時,導電顆粒111可在特定方向上定向。亦即,導電顆粒111可不旋轉至隨機的角度但可在相對於本體112的中心軸線而言的特定方向上定向(與本體112的垂直長度平行地穿過本體112的中心),且因此上部導電顆粒與下部導電顆粒111的突出部113可輕易地耦合至彼此。然而,若w/d比率小於1,則導電顆粒111可旋轉至不同的角度,且因此,導電顆粒111的突出部113可能無法輕易地耦合至彼此。w/d比率可較佳地大於1,更佳地為2或大於2,且甚至更佳地為5或大於5。In addition, the body 112 may have a w / d ratio greater than 1, where d refers to the thickness of the body 112. That is, the body 112 may have a rectangular horizontal cross-section instead of a square horizontal cross-section. When the body 112 has a w / d ratio greater than 1, the conductive particles 111 may be oriented in a specific direction. That is, the conductive particles 111 may not rotate to a random angle but may be oriented in a specific direction with respect to the central axis of the body 112 (passing through the center of the body 112 in parallel with the vertical length of the body 112), and thus the upper portion is conductive The particles and the protruding portions 113 of the lower conductive particles 111 can be easily coupled to each other. However, if the w / d ratio is less than 1, the conductive particles 111 may be rotated to different angles, and therefore, the protruding portions 113 of the conductive particles 111 may not be easily coupled to each other. The w / d ratio may be preferably greater than 1, more preferably 2 or greater, and even more preferably 5 or greater.

若如上所述確定本體112的大小,則導電顆粒111的突出部113可當導電顆粒111彼此對齊時輕易地耦合至彼此。If the size of the body 112 is determined as described above, the protruding portions 113 of the conductive particles 111 can be easily coupled to each other when the conductive particles 111 are aligned with each other.

另外,本體112中的每一者的上端部與下端部之間形成有用於連接上端部表面與下端部表面的側向表面1121,且側向表面1121自本體112的上端部及下端部朝本體112的中心部朝內凹陷。亦即,彈性絕緣材料可甚至填充於側向表面1121的凹的中心部中,且因此可使導電顆粒111與導電部110的分離最小化。In addition, a lateral surface 1121 for connecting the upper end surface and the lower end surface is formed between the upper end portion and the lower end portion of each of the bodies 112, and the lateral surface 1121 faces the body from the upper end portion and the lower end portion of the body 112. The center of 112 is recessed inward. That is, the elastic insulating material may be even filled in the concave central portion of the lateral surface 1121, and thus the separation of the conductive particles 111 from the conductive portion 110 may be minimized.

至少兩個突出部113可自本體112中的每一者的上端部突出。另外,自本體112的下端部突出的突出部113可具有與自本體112的上端部突出的突出部113的形狀或形式對應的形狀或形式。相鄰的突出部113之間形成有朝本體112凹陷的凹陷部1132。較佳地,在相鄰的突出部113之間形成的凹陷部1132的內表面1131之間的角度q可為鈍角(即,大於90°)。內表面1131之間的角度q可具有大於90°的任意值。較佳地,角度q可介於95°至170°範圍內,且更佳地介於100°至160°範圍內。At least two protrusions 113 may protrude from an upper end portion of each of the bodies 112. In addition, the protruding portion 113 protruding from the lower end portion of the body 112 may have a shape or form corresponding to the shape or form of the protruding portion 113 protruding from the upper end portion of the body 112. A recessed portion 1132 recessed toward the main body 112 is formed between adjacent protruding portions 113. Preferably, the angle q between the inner surfaces 1131 of the recessed portions 1132 formed between the adjacent protruding portions 113 may be an obtuse angle (ie, greater than 90 °). The angle q between the inner surfaces 1131 may have any value greater than 90 °. Preferably, the angle q may be in a range of 95 ° to 170 °, and more preferably in a range of 100 ° to 160 °.

如上所述,由於內表面1131之間的角度q大於90°,因此當製造測試插座100時,模具150中所含有的導電顆粒111可藉由磁力而緊密地聚集。詳言之,如圖10中所示,在藉由磁力而對齊之前,導電顆粒111彼此相距一定距離地包含於液體彈性材料中,且如圖11中所示當導電顆粒111藉由磁場而緊密地聚集時,導電顆粒111的突出部113可因內表面1131之間的大的角度q而彼此接觸。接著,隨著磁場的持續施加,導電顆粒111可牢固地耦合至彼此。藉由此方式,可如圖12中所示製造出測試插座100。As described above, since the angle q between the inner surfaces 1131 is greater than 90 °, when the test socket 100 is manufactured, the conductive particles 111 contained in the mold 150 can be closely gathered by magnetic force. In detail, as shown in FIG. 10, before being aligned by magnetic force, the conductive particles 111 are contained in the liquid elastic material at a certain distance from each other, and as shown in FIG. 11, when the conductive particles 111 are compacted by a magnetic field When the grounds are gathered, the protruding portions 113 of the conductive particles 111 may contact each other due to the large angle q between the inner surfaces 1131. Then, as the magnetic field is continuously applied, the conductive particles 111 may be firmly coupled to each other. In this manner, the test socket 100 can be manufactured as shown in FIG. 12.

在其中導電顆粒111如上所述耦合至彼此的狀態中,若將液體彈性材料固化,則測試插座100的製造完成。此後,當測試目標裝置130的端子131按壓導電部110的上側時,在導電顆粒111中相對靠上的導電顆粒111如圖13中所示旋轉至某些角度的同時導電顆粒111之間的耦合得到維持。In a state where the conductive particles 111 are coupled to each other as described above, if the liquid elastic material is cured, the manufacture of the test socket 100 is completed. Thereafter, when the terminal 131 of the test target device 130 presses the upper side of the conductive portion 110, the conductive particles 111 which are relatively higher among the conductive particles 111 are rotated to some angle as shown in FIG. 13 while the coupling between the conductive particles 111 is performed Be maintained.

除導電顆粒111的形狀以外,現亦將闡述可用於形成導電顆粒111的材料。In addition to the shape of the conductive particles 111, materials that can be used to form the conductive particles 111 will now also be described.

導電顆粒111可由磁性材料形成,以輕易地在垂直方向上沿磁力線排列導電顆粒111。舉例而言,導電顆粒111可為以下顆粒:磁性金屬的顆粒,所述磁性金屬例如為鎳、鐵、或鈷;所述磁性金屬的合金的顆粒;含有此種磁性金屬的顆粒;或者包括此種顆粒作為核心顆粒且被鍍覆以例如金、銀、鈀、或銠等難以氧化的導電金屬的顆粒。The conductive particles 111 may be formed of a magnetic material to easily arrange the conductive particles 111 along magnetic lines of force in a vertical direction. For example, the conductive particles 111 may be the following particles: particles of a magnetic metal, such as nickel, iron, or cobalt; particles of an alloy of the magnetic metal; particles containing such a magnetic metal; or including this Seed particles serve as core particles and are plated with particles of a conductive metal that is difficult to oxidize, such as gold, silver, palladium, or rhodium.

然而,導電顆粒111並不總是需要包括磁性核心顆粒。舉例而言,導電顆粒111可包括:由例如非磁性金屬、玻璃、或碳等無機材料形成的核心顆粒;由例如聚苯乙烯或與二乙烯基苯交聯的聚苯乙烯等聚合物形成的核心顆粒;或者藉由將彈性纖維長絲或玻璃纖維長絲打碎成具有等於或小於某一值的長度的顆粒而形成的核心顆粒,其中所述核心顆粒可被鍍覆以例如鈷或鎳鈷合金等導電磁性物質,或者可被塗佈以導電磁性物質及難以氧化的導電金屬。However, the conductive particles 111 do not always need to include magnetic core particles. For example, the conductive particles 111 may include: core particles formed of an inorganic material such as non-magnetic metal, glass, or carbon; and formed of a polymer such as polystyrene or polystyrene crosslinked with divinylbenzene Core particles; or core particles formed by breaking elastic fiber filaments or glass fiber filaments into particles having a length equal to or less than a certain value, wherein the core particles may be plated with, for example, cobalt or nickel Conductive magnetic materials such as cobalt alloys, or conductive magnetic materials and conductive metals that are difficult to oxidize.

絕緣支撐體120使導電部110彼此絕緣且支撐導電部110。較佳地,絕緣支撐體120可由與用於形成導電部110的彈性絕緣材料相同的矽酮橡膠形成。然而,絕緣支撐體120並非僅限於此。亦即,絕緣支撐體120可由不同於用於形成彈性絕緣材料的絕緣材料形成。The insulating support 120 insulates the conductive portions 110 from each other and supports the conductive portions 110. Preferably, the insulating support 120 may be formed of the same silicone rubber as the elastic insulating material used to form the conductive portion 110. However, the insulating support 120 is not limited to this. That is, the insulating support 120 may be formed of an insulating material different from that used to form an elastic insulating material.

可如下使用根據本發明的較佳實施例的測試插座100來測試測試目標裝置130。The test target device 130 may be tested using the test socket 100 according to the preferred embodiment of the present invention as follows.

首先,如圖7中所示,將測試插座100放置於測試設備140上方。詳言之,將測試插座100放置成使得導電部110的下端部接觸測試設備140的接墊141。此後,如圖8中所示,將測試目標裝置130向下移動以使測試目標裝置130的端子131接觸導電部110。此時,若進一步將測試目標裝置130降低,則測試目標裝置130開始按壓導電部110,且導電部110的導電顆粒111的端部彼此接觸且因此而電性連接至彼此。此時,若測試設備140產生預定電性訊號,則經由測試插座100將所述電性訊號傳輸至測試目標裝置130。First, as shown in FIG. 7, the test socket 100 is placed above the test device 140. In detail, the test socket 100 is placed so that the lower end portion of the conductive portion 110 contacts the pad 141 of the test device 140. Thereafter, as shown in FIG. 8, the test target device 130 is moved downward so that the terminal 131 of the test target device 130 contacts the conductive portion 110. At this time, if the test target device 130 is further lowered, the test target device 130 starts to press the conductive portion 110, and the ends of the conductive particles 111 of the conductive portion 110 are in contact with each other and are therefore electrically connected to each other. At this time, if the test equipment 140 generates a predetermined electrical signal, the electrical signal is transmitted to the test target device 130 through the test socket 100.

詳言之,當測試目標裝置130的端子131按壓導電部110時,如圖13中所示導電部110在導電部110的厚度方向上被按縮。在此過程中,藉由突出部113耦合至彼此的導電顆粒111在相對於彼此旋轉的同時保持處於耦合狀態,且因此可經由導電顆粒111可靠地傳輸電性訊號。In detail, when the terminal 131 of the test target device 130 presses the conductive portion 110, the conductive portion 110 is contracted in the thickness direction of the conductive portion 110 as shown in FIG. 13. In this process, the conductive particles 111 coupled to each other through the protrusions 113 remain in a coupled state while rotating relative to each other, and thus the electrical signals can be reliably transmitted through the conductive particles 111.

另外,當測試目標裝置130的端子131遠離導電部110移動時,導電部110如圖12中所示返回至其原始耦合狀態。因此,即便當另一測試目標裝置的端子按壓導電部110時,導電部110仍可維持電性連接。In addition, when the terminal 131 of the test target device 130 moves away from the conductive portion 110, the conductive portion 110 returns to its original coupling state as shown in FIG. 12. Therefore, even when the terminal of another test target device presses the conductive portion 110, the conductive portion 110 can maintain the electrical connection.

根據本發明的較佳實施例,測試插座100具有以下效果。According to a preferred embodiment of the present invention, the test socket 100 has the following effects.

首先,由於測試插座100的導電顆粒111的相互面對的內表面1131之間的角度是鈍角(即,大於90°),因此經耦合的導電顆粒111之間可維持一點接觸,藉此提高接觸穩定性。First, since the angle between the mutually facing inner surfaces 1131 of the conductive particles 111 of the test socket 100 is an obtuse angle (ie, greater than 90 °), a little contact can be maintained between the coupled conductive particles 111, thereby increasing the contact. stability.

另外,由於本體112具有h/w比率大於1的柱形狀,因此在製造測試插座100時可輕易地使本體112垂直地對齊。In addition, since the body 112 has a pillar shape with an h / w ratio greater than 1, the body 112 can be easily vertically aligned when the test socket 100 is manufactured.

另外,由於突出部113設置於垂直地對齊的導電顆粒111的上端部及下端部上,因此導電顆粒111可在導電部110中輕易地耦合至彼此。此耦合結構使得即便當導電部110被測試目標裝置130壓縮時,導電顆粒111之間仍可維持接觸,且因此,導電顆粒111的導電性可得到維持。In addition, since the protruding portions 113 are provided on the upper and lower end portions of the vertically aligned conductive particles 111, the conductive particles 111 can be easily coupled to each other in the conductive portion 110. This coupling structure makes it possible to maintain contact between the conductive particles 111 even when the conductive portion 110 is compressed by the test target device 130, and therefore, the conductivity of the conductive particles 111 can be maintained.

另外,由於本體112在其中心區處是凹的,因此本體112與彈性絕緣材料之間的接觸面積增大,且因此本體112可不輕易地與導電部110分離。In addition, since the main body 112 is concave at a central region thereof, a contact area between the main body 112 and the elastic insulating material increases, and thus the main body 112 may not be easily separated from the conductive portion 110.

另外,由於導電顆粒111的本體112的厚度(d)小於本體112的寬度(w),因此導電顆粒111可輕易地在垂直方向上對齊,且因此導電顆粒111可輕易地耦合至彼此。 In addition, since the thickness (d) of the body 112 of the conductive particles 111 is smaller than the width (w) of the body 112, the conductive particles 111 can be easily aligned in the vertical direction, and thus the conductive particles 111 can be easily coupled to each other.

另外,由於突出部113插入在突出部113之間形成的凹陷部1132中,因此當使用測試插座100時,相鄰導電顆粒111之間的接觸可在一個點處得到維持,且因此接觸穩定性可得到提高。 In addition, since the protruding portion 113 is inserted into the recessed portion 1132 formed between the protruding portions 113, when the test socket 100 is used, the contact between adjacent conductive particles 111 can be maintained at one point, and thus the contact stability Can be improved.

可如下所述修改根據本發明較佳實施例的測試插座100。 The test socket 100 according to the preferred embodiment of the present invention may be modified as described below.

參照圖14,導電顆粒111'的凹的中心區的側向表面上可設置有凹凸部1122。若如上所述側向表面上設置有多個凹凸部,則可在凹凸部之間填充彈性絕緣材料,且因此可可靠地防止導電顆粒的分離。 Referring to FIG. 14, a concave and convex portion 1122 may be provided on a lateral surface of a concave center region of the conductive particles 111 ′. If a plurality of uneven portions are provided on the lateral surface as described above, the elastic insulating material can be filled between the uneven portions, and thus the separation of the conductive particles can be reliably prevented.

在以上所述實施例中,側向表面1121是線性傾斜的。然而,如圖15中所示,導電顆粒111"的側向表面上可設置有在垂直方向上具有恆定寬度的凹凸部1123。 In the embodiments described above, the lateral surface 1121 is linearly inclined. However, as shown in FIG. 15, the lateral surface of the conductive particle 111 ″ may be provided with a concave-convex portion 1123 having a constant width in a vertical direction.

在以上所述實施例中,相鄰突出部113的相互面對的內表面1131之間的角度是鈍角(即,大於90°)。然而,所述角度可等於或大於90°。 In the embodiment described above, the angle between the mutually facing inner surfaces 1131 of the adjacent protrusions 113 is an obtuse angle (ie, greater than 90 °). However, the angle may be equal to or greater than 90 °.

儘管以上已示出及闡述了本發明的較佳實施例,然而本發明並非僅限於本發明的實施例或經修改實例,且可在不背離本發明的範圍的條件下作出各種其他潤飾及變動。 Although the preferred embodiments of the present invention have been shown and described above, the present invention is not limited to the embodiments or modified examples of the present invention, and various other retouching and changes can be made without departing from the scope of the present invention. .

10‧‧‧各向異性導電連接件 10‧‧‧Anisotropic conductive connection

15‧‧‧彈性各向異性導電膜 15‧‧‧ Elastic Anisotropic Conductive Film

15A‧‧‧成形材料層 15A‧‧‧Forming material layer

16‧‧‧導電連接部 16‧‧‧ conductive connection

16A、16B‧‧‧突出部位 16A, 16B ‧‧‧ protruding parts

17‧‧‧絕緣部 17‧‧‧Insulation Department

18‧‧‧導電非連接部 18‧‧‧ conductive non-connection

20‧‧‧框架板 20‧‧‧Frame board

21‧‧‧穿透孔 21‧‧‧ through hole

30、100‧‧‧測試插座 30, 100‧‧‧test socket

31、110‧‧‧導電部 31, 110‧‧‧ Conductive section

32‧‧‧絕緣支撐體 32‧‧‧ insulated support

50、150‧‧‧模具 50, 150‧‧‧mould

51‧‧‧上部模具 51‧‧‧upper mould

52、57‧‧‧鐵磁性基板 52, 57‧‧‧ Ferromagnetic substrate

54A、59A‧‧‧磁性構件 54A, 59A‧‧‧ Magnetic members

56‧‧‧下部模具 56‧‧‧Lower mold

111、111'、111''‧‧‧導電顆粒 111, 111 ', 111``‧‧‧ conductive particles

112‧‧‧本體 112‧‧‧ Ontology

113‧‧‧突出部 113‧‧‧ protrusion

120‧‧‧絕緣支撐體 120‧‧‧ insulated support

130‧‧‧測試目標裝置 130‧‧‧Test target device

131‧‧‧端子 131‧‧‧Terminal

140‧‧‧測試設備 140‧‧‧test equipment

141‧‧‧接墊 141‧‧‧ pad

311‧‧‧導電柱顆粒 311‧‧‧ conductive pillar particles

1121‧‧‧側向表面 1121‧‧‧ lateral surface

1122、1123‧‧‧凹凸部 1122, 1123‧‧‧ Bumps

1131‧‧‧內表面 1131‧‧‧Inner surface

1132‧‧‧凹陷部 1132‧‧‧Depression

d‧‧‧厚度 d‧‧‧thickness

h‧‧‧垂直長度 h‧‧‧vertical length

P‧‧‧導電顆粒/磁性導電顆粒 P‧‧‧Conductive particles / magnetic conductive particles

w‧‧‧水平長度/寬度 w‧‧‧horizontal length / width

q‧‧‧角度 q‧‧‧angle

圖1是說明先前技術的測試插座的圖。 FIG. 1 is a diagram illustrating a prior art test socket.

圖2是說明圖1中所示測試插座的剖視圖。 FIG. 2 is a sectional view illustrating the test socket shown in FIG. 1. FIG.

圖3及圖4是說明如何製造圖1中所示測試插座的圖。 3 and 4 are diagrams illustrating how the test socket shown in FIG. 1 is manufactured.

圖5是說明先前技術的測試插座的另一實例的圖。 FIG. 5 is a diagram illustrating another example of a prior art test socket.

圖6(a)、圖6(b)是說明先前技術中的問題的圖。 6 (a) and 6 (b) are diagrams explaining problems in the prior art.

圖7是說明根據本發明實施例的測試插座的圖。 FIG. 7 is a diagram illustrating a test socket according to an embodiment of the present invention.

圖8是說明圖7中所示測試插座的運作的圖。 FIG. 8 is a diagram illustrating the operation of the test socket shown in FIG. 7. FIG.

圖9是說明位於圖7中所示測試插座的導電部中的導電顆粒中的一者的立體圖。 圖10至圖12是說明用於製造測試插座的製程的示意圖。 圖13是說明圖12中所示測試插座的運作的放大圖。 圖14及圖15是說明根據本發明其他實施例的導電顆粒的圖。FIG. 9 is a perspective view illustrating one of conductive particles located in a conductive portion of the test socket shown in FIG. 7. 10 to 12 are schematic views illustrating a process for manufacturing a test socket. FIG. 13 is an enlarged view illustrating the operation of the test socket shown in FIG. 12. 14 and 15 are diagrams illustrating conductive particles according to other embodiments of the present invention.

Claims (13)

一種測試插座,被配置成放置於測試目標裝置與測試設備之間,以將所述測試目標裝置的端子電性連接至所述測試設備的接墊,所述測試插座包括: 多個導電部,排列於與所述測試目標裝置的所述端子對應的位置且在所述測試插座的表面方向上彼此間隔開,所述導電部中的每一者包括多個導電顆粒,所述多個導電顆粒包含於彈性絕緣材料中且在所述測試插座的厚度方向上對齊;以及 絕緣支撐體,排列於彼此間隔開的所述導電部之間,以支撐所述導電部並使所述導電部在所述表面方向上彼此絕緣, 其中所述導電顆粒中的每一者包括: 本體,具有柱形狀;以及 至少兩個突出部,自所述本體的上端部突出, 其中在彼此相鄰的所述突出部之間設置有朝所述本體凹陷的凹陷部,且 所述突出部的相互面對的內表面之間的角度是大於90°的鈍角。A test socket configured to be placed between a test target device and a test device to electrically connect a terminal of the test target device to a pad of the test device, the test socket includes: a plurality of conductive portions, Arranged at positions corresponding to the terminals of the test target device and spaced apart from each other in a surface direction of the test socket, each of the conductive portions includes a plurality of conductive particles, the plurality of conductive particles Included in an elastic insulating material and aligned in a thickness direction of the test socket; and an insulating support body arranged between the conductive portions spaced apart from each other to support the conductive portions and keep the conductive portions in place The surface directions are insulated from each other, wherein each of the conductive particles includes: a body having a pillar shape; and at least two protrusions protruding from an upper end portion of the body, wherein the protrusions adjacent to each other A recessed portion recessed toward the body is provided between the portions, and an angle between inner surfaces of the protruding portions facing each other is an obtuse angle greater than 90 °. 如申請專利範圍第1項所述的測試插座,其中所述本體的形狀及大小使得當利用磁場將所述導電顆粒在所述彈性絕緣材料中對齊時,所述導電顆粒站立於所述厚度方向上。The test socket according to item 1 of the scope of patent application, wherein the shape and size of the body are such that the conductive particles stand in the thickness direction when the conductive particles are aligned in the elastic insulating material using a magnetic field. on. 如申請專利範圍第2項所述的測試插座,其中所述本體中的每一者具有大於1的h/w比率,其中h是指自所述本體的所述上端部至下端部量測的垂直長度,且w是指與所述垂直長度垂直的所述本體的水平長度。The test socket according to item 2 of the scope of patent application, wherein each of the bodies has an h / w ratio greater than 1, where h is measured from the upper end portion to the lower end portion of the body Vertical length, and w refers to the horizontal length of the body perpendicular to the vertical length. 如申請專利範圍第3項所述的測試插座,其中所述本體中的每一者具有大於1的w/d比率,其中d是指所述本體的厚度。The test socket of item 3 of the scope of patent application, wherein each of the bodies has a w / d ratio greater than 1, where d refers to the thickness of the body. 如申請專利範圍第1項所述的測試插座,其中所述突出部的所述相互面對的內表面被傾斜成將相鄰的導電顆粒的突出部引導至所述凹陷部中。The test socket according to item 1 of the scope of patent application, wherein the mutually facing inner surfaces of the protrusions are inclined to guide the protrusions of adjacent conductive particles into the recesses. 如申請專利範圍第1項所述的測試插座,其中在所述本體的所述上端部與下端部之間設置有側向表面,且所述側向表面自所述本體的所述上端部及所述下端部朝所述本體的中心部朝內凹陷。The test socket according to item 1 of the scope of patent application, wherein a lateral surface is provided between the upper end portion and the lower end portion of the body, and the lateral surface extends from the upper end portion of the body and The lower end portion is recessed inward toward a central portion of the body. 如申請專利範圍第1項至第6項中任一項所述的測試插座,其中在所述本體的側向表面上設置有多個凹凸部。The test socket according to any one of claims 1 to 6, wherein a plurality of uneven portions are provided on a lateral surface of the body. 如申請專利範圍第1項所述的測試插座,其中至少兩個突出部自所述本體的下端部突出。The test socket according to item 1 of the scope of patent application, wherein at least two protruding portions protrude from a lower end portion of the body. 如申請專利範圍第8項所述的測試插座,其中所述本體的所述上端部與所述下端部上的所述突出部相對於所述本體對稱。The test socket according to item 8 of the scope of patent application, wherein the upper end portion of the body and the protruding portion on the lower end portion are symmetrical with respect to the body. 一種用於測試插座中的導電顆粒,所述測試插座被配置成放置於測試目標裝置與測試設備之間,以將所述測試目標裝置的端子電性連接至所述測試設備的接墊, 其中所述導電顆粒包括在所述測試插座的厚度方向上在所述測試插座的導電部中對齊的多個導電顆粒,所述導電顆粒排列於彈性絕緣材料中,且當所述測試目標裝置的所述端子按壓所述導電部時,排列於所述導電部中的所述導電顆粒彼此接觸而使所述導電部變得有導電性, 其中所述導電顆粒中的每一者包括: 本體,具有柱形狀;以及 至少兩個突出部,自所述本體的上端部突出, 其中在彼此相鄰的所述突出部之間設置有朝所述本體凹陷的凹陷部,且 所述突出部的相互面對的內表面之間的角度是大於90°的鈍角。A conductive particle for a test socket, the test socket is configured to be placed between a test target device and a test device to electrically connect a terminal of the test target device to a pad of the test device, wherein The conductive particles include a plurality of conductive particles aligned in a conductive portion of the test socket in a thickness direction of the test socket, the conductive particles are arranged in an elastic insulating material, and when When the terminal presses the conductive portion, the conductive particles arranged in the conductive portion contact each other to make the conductive portion conductive, wherein each of the conductive particles includes: a body having A column shape; and at least two protruding portions protruding from an upper end portion of the body, wherein recessed portions recessed toward the body are provided between the protruding portions adjacent to each other, and mutual surfaces of the protruding portions The angle between the inner surfaces of the pair is an obtuse angle greater than 90 °. 如申請專利範圍第10項所述的導電顆粒,其中所述突出部的所述相互面對的內表面被傾斜成將相鄰的所述導電顆粒的所述突出部引導至所述凹陷部中。The conductive particle according to item 10 of the patent application range, wherein the mutually facing inner surfaces of the protrusions are inclined to guide the protrusions of the adjacent conductive particles into the depressions . 如申請專利範圍第10項所述的導電顆粒,其中所述本體在一個方向上伸長,以使得當藉由磁場將所述導電顆粒在所述彈性絕緣材料中對齊時,所述導電顆粒站立於所述測試插座的所述厚度方向上。The conductive particle according to item 10 of the patent application scope, wherein the body is elongated in one direction so that when the conductive particle is aligned in the elastic insulation material by a magnetic field, the conductive particle stands In the thickness direction of the test socket. 如申請專利範圍第10項所述的導電顆粒,其中至少兩個突出部自所述本體的下端部突出。The conductive particle according to item 10 of the patent application scope, wherein at least two protruding portions protrude from a lower end portion of the body.
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