TWI653454B - Test socket and conductive particle - Google Patents
Test socket and conductive particle Download PDFInfo
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- TWI653454B TWI653454B TW106115628A TW106115628A TWI653454B TW I653454 B TWI653454 B TW I653454B TW 106115628 A TW106115628 A TW 106115628A TW 106115628 A TW106115628 A TW 106115628A TW I653454 B TWI653454 B TW I653454B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
本發明是有關於一種測試插座。測試插座包括:多個導 電部,排列於與測試目標裝置的端子對應的位置且在測試插座的表面方向上彼此間隔開,導電部中的每一者包括多個導電顆粒,多個導電顆粒包含於彈性絕緣材料中且在測試插座的厚度方向上對齊;以及絕緣支撐體,排列於彼此間隔開的導電部之間,以支撐導電部並使導電部在表面方向上彼此絕緣,導電顆粒包括:本體,具有柱形狀;以及至少兩個突出部,自本體的上端部突出,其中在彼此相鄰的突出部之間設置有朝本體凹陷的凹陷部,且突出部的相互面對的內表面之間的角度是小於90°的銳角。 The invention relates to a test socket. Test socket includes: multiple guides The electric parts are arranged at positions corresponding to the terminals of the test target device and spaced apart from each other in the surface direction of the test socket, each of the conductive portions including a plurality of conductive particles, the plurality of conductive particles being contained in the elastic insulating material and Aligning in a thickness direction of the test socket; and an insulating support disposed between the conductive portions spaced apart from each other to support the conductive portions and insulating the conductive portions from each other in a surface direction, the conductive particles comprising: a body having a column shape; And at least two protrusions projecting from an upper end portion of the body, wherein a recess recessed toward the body is disposed between the protrusions adjacent to each other, and an angle between the mutually facing inner surfaces of the protrusion is less than 90 The acute angle of °.
Description
本發明是有關於一種測試插座以及導電顆粒,且更具體而言是有關於一種被配置成即便當測試插座頻繁接觸測試目標裝置時仍長時間維持導電性的測試插座及導電顆粒。 The present invention relates to a test socket and conductive particles, and more particularly to a test socket and conductive particles configured to maintain electrical conductivity for a long time even when the test socket frequently contacts the test target device.
一般而言,在測試製程期間使用測試插座以檢查所製造裝置是否具有缺陷或錯誤。舉例而言,當執行電性測試以檢查所製造裝置(測試目標裝置)是否具有缺陷或錯誤時,不使所述測試目標裝置與測試設備直接地接觸彼此而是藉由測試插座間接地連接至彼此。此乃因測試設備相對昂貴且在因頻繁接觸測試目標裝置而被磨損或損壞,進而需要被新測試設備取代時造成困難及高的成本。因此,可將測試插座可拆卸地附接至測試設備的上側,且接著可藉由使測試目標裝置接觸測試插座而非使測試目標裝置接觸測試設備來將欲測試的所述測試目標裝置電性連接至所述測試設備。此後,可經由測試插座將自測試設備產生的電性訊號傳輸至測試目標裝置。 In general, test sockets are used during the test process to check for defects or errors in the manufactured device. For example, when performing an electrical test to check whether the manufactured device (test target device) has a defect or an error, the test target device is not directly in contact with the test device but is indirectly connected to the test socket through the test socket. each other. This is because the test equipment is relatively expensive and is worn or damaged due to frequent contact with the test target device, which in turn requires difficulty and high cost when replaced by new test equipment. Therefore, the test socket can be detachably attached to the upper side of the test device, and then the test target device to be tested can be electrically connected by bringing the test target device into contact with the test socket instead of bringing the test target device into contact with the test device. Connect to the test device. Thereafter, the electrical signal generated by the self-test device can be transmitted to the test target device via the test socket.
參照圖1及圖2,可將測試插座100放置於測試目標裝置130與測試設備140之間以將測試目標裝置130的端子131電性連 接至測試設備140的接墊141。測試插座100包括:導電部110,排列於與測試目標裝置130的端子131對應的位置且在測試插座100的厚度方向上具有導電性,導電部110中的每一者是藉由在測試插座100的厚度方向上在彈性絕緣材料112中排列多個導電顆粒111而形成;以及絕緣支撐體120,支撐導電部110且使導電部110彼此絕緣。當測試插座100安裝於測試設備140上時,測試插座100的導電部110接觸測試設備140的接墊141,且測試目標裝置130可接觸測試插座100的導電部110。 Referring to FIG. 1 and FIG. 2, the test socket 100 can be placed between the test target device 130 and the test device 140 to electrically connect the terminal 131 of the test target device 130. Connected to the pads 141 of the test device 140. The test socket 100 includes a conductive portion 110 arranged at a position corresponding to the terminal 131 of the test target device 130 and having conductivity in the thickness direction of the test socket 100, each of the conductive portions 110 being passed through the test socket 100 The plurality of conductive particles 111 are arranged in the elastic insulating material 112 in the thickness direction; and the insulating support 120 supports the conductive portions 110 and insulates the conductive portions 110 from each other. When the test socket 100 is mounted on the test device 140, the conductive portion 110 of the test socket 100 contacts the pad 141 of the test device 140, and the test target device 130 can contact the conductive portion 110 of the test socket 100.
測試目標裝置130可利用插入物(insert)來傳送且可放置於測試插座100上同時接觸測試插座100的導電部110。此後,電性訊號可經由測試插座100自測試設備140傳輸至測試目標裝置130以對測試目標裝置130進行電性測試。 The test target device 130 can be transferred using an insert and can be placed on the test socket 100 while contacting the conductive portion 110 of the test socket 100. Thereafter, the electrical signal can be transmitted from the test device 140 to the test target device 130 via the test socket 100 to electrically test the test target device 130.
測試插座100的導電部110是藉由在彈性絕緣材料112中排列導電顆粒111而形成,且可使測試目標裝置130的端子131頻繁接觸導電部110。如上所述,當測試目標裝置130的端子131頻繁接觸導電部110時,分佈於彈性絕緣材料112中的導電顆粒111可輕易地與彈性絕緣材料112分離。具體而言,由於導電顆粒111具有球體形狀,因此導電顆粒111可更輕易地與彈性絕緣材料112分離。如上所述,若將導電顆粒111分離,則測試插座100的導電性可能降低,且因此可能對測試可靠性造成負面影響。 The conductive portion 110 of the test socket 100 is formed by arranging the conductive particles 111 in the elastic insulating material 112, and the terminal 131 of the test target device 130 can be frequently contacted with the conductive portion 110. As described above, when the terminal 131 of the test target device 130 frequently contacts the conductive portion 110, the conductive particles 111 distributed in the elastic insulating material 112 can be easily separated from the elastic insulating material 112. In particular, since the conductive particles 111 have a spherical shape, the conductive particles 111 can be more easily separated from the elastic insulating material 112. As described above, if the conductive particles 111 are separated, the conductivity of the test socket 100 may be lowered, and thus may have a negative influence on the test reliability.
在由本申請案的申請人提出申請的標題為「具有導電柱顆粒的測試插座(Test Socket with Conductive Pillar Particles)」的 韓國專利第1019721號中揭露了一種用於解決與先前技術的球體導電顆粒相關的問題的技術。如圖3中所示,此種測試插座200包括:導電部210,分別包括多個導電柱顆粒211,所述多個導電柱顆粒211放置於彈性絕緣材料中;以及絕緣支撐體220,支撐導電部210。由於導電柱顆粒211分佈於測試插座200的導電部210中,因此鄰近的導電柱顆粒211之間的接觸面積可為相對大的,且因此測試插座200的電阻可減小,藉此提供穩定的電性連接。另外,由於相較於先前技術的球體導電顆粒而言導電柱顆粒211與彈性絕緣材料具有相對大的接觸面積,因此導電柱顆粒211與彈性絕緣材料之間的黏合是強的,且因此即便當重複執行測試時,導電柱顆粒211仍可能無法輕易地與彈性絕緣材料分離。 The title of "Test Socket with Conductive Pillar Particles" filed by the applicant of the present application is entitled "Test Socket with Conductive Pillar Particles" A technique for solving the problems associated with the prior art spherical conductive particles is disclosed in Korean Patent No. 1019721. As shown in FIG. 3, the test socket 200 includes: a conductive portion 210 respectively including a plurality of conductive pillar particles 211, the plurality of conductive pillar particles 211 are placed in the elastic insulating material; and an insulating support 220 supporting the conductive Part 210. Since the conductive pillar particles 211 are distributed in the conductive portion 210 of the test socket 200, the contact area between the adjacent conductive pillar particles 211 can be relatively large, and thus the resistance of the test socket 200 can be reduced, thereby providing stable Electrical connection. In addition, since the conductive pillar particles 211 have a relatively large contact area with the elastic insulating material compared to the prior art spherical conductive particles, the adhesion between the conductive pillar particles 211 and the elastic insulating material is strong, and thus even when When the test is repeatedly performed, the conductive pillar particles 211 may still not be easily separated from the elastic insulating material.
儘管此種導電柱顆粒具有的導電性高於球體導電顆粒的導電性,然而若緊密地排列於導電部中的導電柱顆粒不在垂直方向上彼此對齊,則上部導電柱顆粒與下部導電柱顆粒之間可能不會發生接觸或者在導電部被壓縮的同時上部導電柱顆粒與下部導電柱顆粒之間的接觸可能不穩定。具體而言,由於近來存在傾向於減小導電部之間的距離的技術趨勢,因而此問題變得更加嚴峻。 Although the conductive pillar particles have higher conductivity than the spherical conductive particles, if the conductive pillar particles closely arranged in the conductive portion are not aligned with each other in the vertical direction, the upper conductive pillar particles and the lower conductive pillar particles Contact may or may not occur between the upper conductive pillar particles and the lower conductive pillar particles while the conductive portion is compressed. In particular, this problem has become more severe due to the recent trend in technology tending to reduce the distance between the conductive portions.
提供本發明是為瞭解決上述問題。更具體而言,本發明的目標是提供一種被配置成防止導電顆粒與導電部在頻繁接觸期間分離,以在導電部被壓縮及擴張的同時保證導電顆粒之間的牢固電性連 接的測試插座,以及提供導電顆粒。 The present invention has been made to solve the above problems. More specifically, it is an object of the present invention to provide a configuration that prevents separation of conductive particles from conductive portions during frequent contact to ensure a secure electrical connection between conductive particles while the conductive portions are compressed and expanded. Connect the test socket and provide conductive particles.
為達成上述目標,本發明的實施例提供一種測試插座,所述測試插座被配置成放置於測試目標裝置與測試設備之間,以將所述測試目標裝置的端子電性連接至所述測試設備的接墊,所述測試插座包括:多個導電部,排列於與所述測試目標裝置的所述端子對應的位置且在所述測試插座的表面方向上彼此間隔開,所述導電部中的每一者包括多個導電顆粒,所述多個導電顆粒包含於彈性絕緣材料中且在所述測試插座的厚度方向上對齊;以及絕緣支撐體,排列於彼此間隔開的所述導電部之間,以支撐所述導電部並使所述導電部在所述表面方向上彼此絕緣,其中所述導電顆粒中的每一者包括:本體,具有柱形狀;以及至少兩個突出部,自所述本體的上端部突出,其中在彼此相鄰的所述突出部之間設置有朝所述本體凹陷的凹陷部,且所述突出部的相互面對的內表面之間的角度是小於90°的銳角。 To achieve the above object, embodiments of the present invention provide a test socket configured to be placed between a test target device and a test device to electrically connect terminals of the test target device to the test device The test socket includes: a plurality of conductive portions arranged at positions corresponding to the terminals of the test target device and spaced apart from each other in a surface direction of the test socket, in the conductive portion Each of the plurality of electrically conductive particles, the plurality of electrically conductive particles being contained in the elastic insulating material and aligned in a thickness direction of the test socket; and an insulating support disposed between the electrically conductive portions spaced apart from each other To support the conductive portions and to insulate the conductive portions from each other in the surface direction, wherein each of the conductive particles includes: a body having a column shape; and at least two protrusions from An upper end portion of the body protrudes, wherein a recess portion recessed toward the body is disposed between the protrusions adjacent to each other, and the protrusions face each other The angle between the surfaces is an acute angle less than 90 °.
所述本體具有的形狀及大小可使得當利用磁場使所述導電顆粒在所述彈性絕緣材料中對齊時,所述導電顆粒可站立於所述厚度方向上。 The body has a shape and size such that when the conductive particles are aligned in the elastic insulating material by a magnetic field, the conductive particles may stand in the thickness direction.
所述本體中的每一者可具有大於1的h/w比率,其中h是指自所述本體的所述上端部至下端部量測的垂直長度,且w是指與所述垂直長度垂直的所述本體的水平長度。 Each of the bodies may have a h/w ratio greater than 1, wherein h refers to a vertical length measured from the upper end to the lower end of the body, and w is perpendicular to the vertical length The horizontal length of the body.
所述本體中的每一者可具有大於1的w/d比率,其中d 是指所述本體的厚度。 Each of the bodies may have a w/d ratio greater than 1, wherein d It refers to the thickness of the body.
所述突出部的長度及所述凹陷的形狀,可被確定成使得在導電顆粒的突出部插入相鄰的導電顆粒的凹陷部中之後,所述導電顆粒可在至少兩個點處彼此接觸。 The length of the protrusion and the shape of the recess may be determined such that after the protrusion of the conductive particles is inserted into the recess of the adjacent conductive particles, the conductive particles may contact each other at at least two points.
當相鄰的導電顆粒耦合至彼此時,所述相鄰的導電顆粒中的一者的突出部的端部與所述相鄰的導電顆粒中的另一者的突出部的端部,可沿所述突出部的內表面彼此接觸。 When adjacent conductive particles are coupled to each other, an end of the protrusion of one of the adjacent conductive particles and an end of the protrusion of the other of the adjacent conductive particles may be along The inner surfaces of the projections are in contact with each other.
所述導電顆粒的所述突出部的所述相互面對的內表面,可被傾斜成使得所述相互面對的內表面之間的距離可在朝所述本體的方向上減小。 The mutually facing inner surfaces of the protrusions of the conductive particles may be inclined such that a distance between the mutually facing inner surfaces may decrease in a direction toward the body.
在所述本體的所述上端部與下端部之間可設置有側向表面,且所述側向表面可自所述本體的所述上端部及所述下端部朝所述本體的中心部朝內凹陷。 A lateral surface may be disposed between the upper end portion and the lower end portion of the body, and the lateral surface may be from the upper end portion and the lower end portion of the body toward a central portion of the body Inside the depression.
在所述本體的側向表面上可設置有多個凹凸部。 A plurality of concavo-convex portions may be disposed on a lateral surface of the body.
至少兩個突出部可自所述本體的下端部突出。 At least two protrusions may protrude from a lower end of the body.
所述本體的所述上端部與所述下端部上的所述突出部可相對於所述本體對稱。 The upper end portion of the body and the protrusion on the lower end portion may be symmetrical with respect to the body.
為達成上述目標,本發明的實施例提供一種測試插座,被配置成放置於測試目標裝置與測試設備之間,以將所述測試目標裝置的端子電性連接至所述測試設備的接墊,所述測試插座包括:多個導電部,排列於與所述測試目標裝置的所述端子對應的位置且在所述測試插座的表面方向上彼此間隔開,所述導電部中 的每一者包括多個導電顆粒,所述多個導電顆粒包含於彈性絕緣材料中且在所述測試插座的厚度方向上對齊;以及絕緣支撐體,排列於彼此間隔開的所述導電部之間,以支撐所述導電部並使所述導電部在所述表面方向上彼此絕緣,其中所述導電顆粒中的每一者包括:本體,具有柱形狀;以及至少兩個突出部,自所述本體的上端部突出,其中在彼此相鄰的所述突出部之間設置有朝所述本體凹陷的凹陷部,且所述突出部的相互面對的內表面之間的角度為90°或小於90°。 In order to achieve the above object, an embodiment of the present invention provides a test socket configured to be placed between a test target device and a test device to electrically connect terminals of the test target device to pads of the test device. The test socket includes: a plurality of conductive portions arranged at positions corresponding to the terminals of the test target device and spaced apart from each other in a surface direction of the test socket, in the conductive portion Each of the plurality of conductive particles includes a plurality of conductive particles contained in the elastic insulating material and aligned in a thickness direction of the test socket; and an insulating support disposed in the conductive portion spaced apart from each other To support the conductive portions and to insulate the conductive portions from each other in the surface direction, wherein each of the conductive particles includes: a body having a column shape; and at least two protrusions An upper end portion of the body protrudes, wherein a recess recessed toward the body is disposed between the protrusions adjacent to each other, and an angle between the mutually facing inner surfaces of the protrusion is 90° or Less than 90°.
為達成上述目標,本發明的實施例提供一種用於測試插座中的導電顆粒,所述測試插座被配置成放置於測試目標裝置與測試設備之間,以將所述測試目標裝置的端子電性連接至所述測試設備的接墊,其中所述導電顆粒包括在所述測試插座的厚度方向上在所述測試插座的導電部中對齊的多個導電顆粒,所述導電顆粒排列於彈性絕緣材料中,且當所述測試目標裝置的所述端子按壓所述導電部時,排列於所述導電部中的所述導電顆粒彼此接觸而使所述導電部變得有導電性,其中所述導電顆粒中的每一者包括:本體,具有柱形狀;以及至少兩個突出部,自所述本體的上端部突出,其中在彼此相鄰的所述突出部之間設置有朝所述本體凹陷的凹陷部,且所述突出部的相互面對的內表面之間的角度是小於90°的銳角。 In order to achieve the above object, embodiments of the present invention provide a conductive particle for testing a socket, the test socket being configured to be placed between a test target device and a test device to electrically connect a terminal of the test target device a pad connected to the test device, wherein the conductive particles comprise a plurality of conductive particles aligned in a conductive portion of the test socket in a thickness direction of the test socket, the conductive particles being arranged in an elastic insulating material And when the terminal of the test target device presses the conductive portion, the conductive particles arranged in the conductive portion contact each other to make the conductive portion become conductive, wherein the conductive portion Each of the particles includes: a body having a column shape; and at least two protrusions protruding from an upper end portion of the body, wherein a recess toward the body is disposed between the protrusions adjacent to each other The recesses, and the angle between the mutually facing inner surfaces of the protrusions is an acute angle of less than 90°.
所述本體在一個方向上伸長,以使得當藉由磁場使所述導電顆粒在所述彈性絕緣材料中對齊時,所述導電顆粒可站立於 所述測試插座的所述厚度方向上。 The body is elongated in one direction such that when the conductive particles are aligned in the elastic insulating material by a magnetic field, the conductive particles can stand The test socket is in the thickness direction.
至少兩個突出部可自所述本體的下端部突出。 At least two protrusions may protrude from a lower end of the body.
為達成上述目標,本發明的實施例提供一種用於測試插座中的導電顆粒,所述測試插座被配置成放置於測試目標裝置與測試設備之間,以將所述測試目標裝置的端子電性連接至所述測試設備的接墊,其中所述導電顆粒包括在所述測試插座的厚度方向上在所述測試插座的導電部中對齊的多個導電顆粒,所述導電顆粒排列於彈性絕緣材料中,且當所述測試目標裝置的所述端子按壓所述導電部時,排列於所述導電部中的所述導電顆粒彼此接觸而使所述導電部變得有導電性,其中所述導電顆粒中的每一者包括:本體,具有柱形狀;以及至少兩個突出部,自所述本體的上端部突出,其中在彼此相鄰的所述突出部之間設置有朝所述本體凹陷的凹陷部,且所述突出部的相互面對的內表面之間的角度為90°或小於90°。 In order to achieve the above object, embodiments of the present invention provide a conductive particle for testing a socket, the test socket being configured to be placed between a test target device and a test device to electrically connect a terminal of the test target device a pad connected to the test device, wherein the conductive particles comprise a plurality of conductive particles aligned in a conductive portion of the test socket in a thickness direction of the test socket, the conductive particles being arranged in an elastic insulating material And when the terminal of the test target device presses the conductive portion, the conductive particles arranged in the conductive portion contact each other to make the conductive portion become conductive, wherein the conductive portion Each of the particles includes: a body having a column shape; and at least two protrusions protruding from an upper end portion of the body, wherein a recess toward the body is disposed between the protrusions adjacent to each other The recessed portion and an angle between the mutually facing inner surfaces of the protruding portion is 90° or less.
在本發明的測試插座中,多個突出部自導電部中所含有的導電顆粒的柱形本體的端部突出。因此,即便當導電部在電性測試期間被壓縮時,耦合至彼此的導電顆粒仍可穩定地維持彼此接觸。 In the test socket of the present invention, the plurality of protrusions protrude from the end of the cylindrical body of the conductive particles contained in the conductive portion. Therefore, even when the conductive portions are compressed during the electrical test, the conductive particles coupled to each other can stably maintain contact with each other.
另外,由於測試插座的導電顆粒的相互面對的內表面之間的角度是銳角(即,小於90°),因此經耦合的導電顆粒之間可維持兩點接觸(two-point contact),藉此提高接觸穩定性。 In addition, since the angle between the mutually facing inner surfaces of the conductive particles of the test socket is an acute angle (ie, less than 90°), a two-point contact can be maintained between the coupled conductive particles. This improves contact stability.
10、100、200‧‧‧測試插座 10, 100, 200‧‧‧ test socket
20、110、210‧‧‧導電部 20,110,210‧‧‧Electrical Department
21、21'、21"、111‧‧‧導電顆粒 21, 21', 21", 111‧‧‧ conductive particles
22‧‧‧本體 22‧‧‧Ontology
23‧‧‧突出部 23‧‧‧Protruding
30、120、220‧‧‧絕緣支撐體 30, 120, 220‧‧‧ insulated support
112‧‧‧彈性絕緣材料 112‧‧‧elastic insulation
130‧‧‧測試目標裝置 130‧‧‧Test target device
131‧‧‧端子 131‧‧‧terminal
140‧‧‧測試設備 140‧‧‧Test equipment
141‧‧‧接墊 141‧‧‧ pads
211‧‧‧導電柱顆粒 211‧‧‧conductive column particles
221‧‧‧側向表面 221‧‧‧ lateral surface
222、223‧‧‧凹凸部 222, 223‧‧‧
231‧‧‧內表面 231‧‧‧ inner surface
232‧‧‧凹陷部 232‧‧‧Depression
d‧‧‧厚度 D‧‧‧thickness
h‧‧‧垂直長度 h‧‧‧Vertical length
w‧‧‧水平長度/寬度 W‧‧‧ horizontal length/width
θ‧‧‧角度 Θ‧‧‧ angle
圖1是說明先前技術的測試插座的圖。 1 is a diagram illustrating a test socket of the prior art.
圖2是說明圖1中所示測試插座的運作的圖。 Figure 2 is a diagram illustrating the operation of the test socket shown in Figure 1.
圖3是說明先前技術的另一測試插座的圖。 3 is a diagram illustrating another test socket of the prior art.
圖4是說明根據本發明實施例的測試插座的圖。 4 is a diagram illustrating a test socket in accordance with an embodiment of the present invention.
圖5是說明圖4中所示測試插座的運作的圖。 Figure 5 is a diagram for explaining the operation of the test socket shown in Figure 4.
圖6是說明位於圖4中所示測試插座的導電部中的導電顆粒中的一者的立體圖。 Figure 6 is a perspective view illustrating one of the conductive particles located in the conductive portion of the test socket shown in Figure 4.
圖7是說明其中如圖6中所示的此種導電顆粒在導電部中耦合至彼此的實例的圖。 FIG. 7 is a view illustrating an example in which such conductive particles as shown in FIG. 6 are coupled to each other in a conductive portion.
圖8是說明如圖6中所示的此種導電顆粒在導電部中的示例性運作的圖。 Figure 8 is a diagram illustrating an exemplary operation of such conductive particles as shown in Figure 6 in a conductive portion.
圖9是說明根據本發明另一實施例的導電顆粒的圖。 Figure 9 is a diagram illustrating conductive particles in accordance with another embodiment of the present invention.
圖10是說明根據本發明另一實施例的導電顆粒的圖。 Figure 10 is a diagram illustrating conductive particles in accordance with another embodiment of the present invention.
圖11及圖12(a)、圖12(b)是說明導電顆粒的耦合的圖。 11 and 12(a) and 12(b) are views for explaining coupling of conductive particles.
在下文中,將參照附圖根據本發明的實施例來詳細闡述測試插座。 Hereinafter, a test socket will be described in detail in accordance with an embodiment of the present invention with reference to the accompanying drawings.
根據本發明的較佳實施例,測試插座10呈具有預定厚度的片材形式,且被配置成在測試插座10的表面方向上阻擋電流並在測試插座10的厚度方向上傳導電流,以在垂直方向上將測試目 標裝置130的端子131電性連接至測試設備140的接墊141。測試插座10可用於對測試目標裝置130執行電性測試。 According to a preferred embodiment of the present invention, the test socket 10 is in the form of a sheet having a predetermined thickness and is configured to block current in the surface direction of the test socket 10 and conduct current in the thickness direction of the test socket 10 to be vertical Test direction The terminal 131 of the marking device 130 is electrically connected to the pad 141 of the testing device 140. The test socket 10 can be used to perform an electrical test on the test target device 130.
測試插座10包括導電部20及絕緣支撐體30。導電部20在厚度方向上延伸,且當導電部20在厚度方向上被按壓時,導電部20可被壓縮且可在厚度方向傳導電流。導電部20在表面方向上彼此間隔開且絕緣支撐體30排列於導電部20之間,使得電流可不在導電部20之間流動。現將詳細闡述導電部20及絕緣支撐體30。 The test socket 10 includes a conductive portion 20 and an insulating support 30. The conductive portion 20 extends in the thickness direction, and when the conductive portion 20 is pressed in the thickness direction, the conductive portion 20 can be compressed and can conduct a current in the thickness direction. The conductive portions 20 are spaced apart from each other in the surface direction and the insulating support 30 is arranged between the conductive portions 20 such that current may not flow between the conductive portions 20. The conductive portion 20 and the insulating support 30 will now be described in detail.
導電部20的上端部可接觸測試目標裝置130的端子131,且導電部20的下端部可接觸測試設備140的接墊141。在彈性絕緣材料中、導電部20中的每一者的上端部與下端部之間垂直地排列有多個導電顆粒21。當導電部20被測試目標裝置130按壓時,導電顆粒21可彼此接觸並傳導電流。亦即,當導電部20不被測試目標裝置130按壓時,導電顆粒21稍微彼此間隔開或彼此接觸,且當導電部20被測試目標裝置130按壓及壓縮時,導電顆粒21可牢固地彼此接觸,且因此可傳導電流。 The upper end portion of the conductive portion 20 may contact the terminal 131 of the test target device 130, and the lower end portion of the conductive portion 20 may contact the pad 141 of the test device 140. In the elastic insulating material, a plurality of conductive particles 21 are vertically arranged between the upper end portion and the lower end portion of each of the conductive portions 20. When the conductive portion 20 is pressed by the test target device 130, the conductive particles 21 may contact each other and conduct a current. That is, when the conductive portion 20 is not pressed by the test target device 130, the conductive particles 21 are slightly spaced apart from each other or in contact with each other, and when the conductive portion 20 is pressed and compressed by the test target device 130, the conductive particles 21 can be firmly contacted with each other. And thus can conduct current.
具體而言,導電部20是藉由在彈性絕緣材料中在與測試目標裝置130的端子131近似對應的位置緊密地垂直排列導電顆粒21而形成。 Specifically, the conductive portion 20 is formed by closely arranging the conductive particles 21 vertically at a position approximately corresponding to the terminal 131 of the test target device 130 in the elastic insulating material.
較佳地,所述彈性絕緣材料可包含具有交聯結構(crosslinked structure)的絕緣聚合物物質。可使用各種可固化聚合物成形材料來獲得此種交聯聚合物物質。所述交聯聚合物物質 的具體實例包括:共軛二烯橡膠(conjugated diene rubber),例如聚丁二烯橡膠(polybutadiene rubber)、天然橡膠、聚異戊二烯橡膠(polyisoprene rubber)、苯乙烯-丁二烯共聚物橡膠(styrene-butadiene copolymer rubber)、或丙烯腈-丁二烯共聚物橡膠(acrylonitrile-butadiene copolymer rubber);共軛二烯橡膠的氫化產物;嵌段共聚物橡膠(block copolymer rubber),例如苯乙烯-丁二烯-二烯嵌段共聚物橡膠(styrene-butadiene-diene block copolymer rubber)或苯乙烯-異戊二烯嵌段共聚物橡膠(styrene-isoprene block copolymer rubber);嵌段共聚物橡膠的氫化產物;氯丁二烯橡膠(chloroprene rubber);胺基甲酸酯橡膠(urethane rubber);聚酯橡膠(polyester rubber);表氯醇橡膠(epichlorohydrin rubber);矽酮橡膠(silicone rubber);乙烯-丙烯共聚物橡膠(ethylene-propylene copolymer rubber);以及乙烯-丙烯-二烯共聚物橡膠(ethylene-propylene-diene copolymer rubber)。由於矽酮橡膠具有較佳的可成形性(formability)及電性特性,因此可使用矽酮橡膠。 Preferably, the elastic insulating material may comprise an insulating polymer substance having a crosslinked structure. Various curable polymer forming materials can be used to obtain such crosslinked polymeric materials. Crosslinked polymer material Specific examples include: conjugated diene rubber, such as polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber (styrene-butadiene copolymer rubber), or acrylonitrile-butadiene copolymer rubber; hydrogenated product of conjugated diene rubber; block copolymer rubber, such as styrene Styrene-butadiene-diene block copolymer rubber or styrene-isoprene block copolymer rubber; hydrogenation of block copolymer rubber Product; chloroprene rubber; urethane rubber; polyester rubber; epichlorohydrin rubber; silicone rubber; An ethylene-propylene copolymer rubber; and an ethylene-propylene-diene copolymer rubber. Since an anthrone rubber has a good formability and electrical properties, an anthrone rubber can be used.
較佳地,所述矽酮橡膠可藉由交聯(crosslinking)或縮合(condensation)而自液體矽酮橡膠獲得。液體矽酮橡膠可較佳地當以10-1秒的剪切速率(shear rate)量測時具有不高於105泊(poise)的黏度。液體矽酮橡膠可為縮合固化矽酮橡膠(condensation curing silicone rubber)、加成固化矽酮橡膠(addition curing silicone rubber)、及具有乙烯基或羥基的矽酮橡 膠中的一種。液體矽酮橡膠的具體實例可包括二甲基矽酮生橡膠(dimethyl silicone raw rubber)、甲基乙烯基矽酮生橡膠(methyl vinyl silicone raw rubber)、及甲基苯基乙烯基矽酮生橡膠(methyl phenyl vinyl silicon raw rubber)。 Preferably, the fluorenone rubber is obtainable from liquid fluorenone rubber by crosslinking or condensation. The liquid fluorenone rubber may preferably have a viscosity of not more than 10 5 poise when measured at a shear rate of 10 -1 second. The liquid fluorenone rubber may be one of a condensation curing silicone rubber, an addition curing silicone rubber, and an anthrone rubber having a vinyl group or a hydroxyl group. Specific examples of the liquid fluorenone rubber may include dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, and methyl phenyl vinyl fluorenone raw rubber. (methyl phenyl vinyl silicon raw rubber).
導電顆粒21中的每一者包括整體具有柱形狀的本體22及自本體22的上端部與下端部突出的突出部23。 Each of the conductive particles 21 includes a body 22 having a column shape as a whole and a protrusion 23 protruding from an upper end portion and a lower end portion of the body 22.
本體22具有近似柱形狀,具體而言具有細的四稜柱形狀。儘管在以上實例中將本體22闡述為具有四稜柱形狀,然而本體22並非僅限於此。舉例而言,本體22可具有多稜柱形狀。 The body 22 has an approximately cylindrical shape, specifically a thin quadrangular prism shape. Although the body 22 is illustrated as having a quadrangular prism shape in the above examples, the body 22 is not limited thereto. For example, body 22 can have a polygonal prism shape.
本體22的形狀及大小被確定成使得可藉由利用磁場將本體22在彈性絕緣材料中對齊而使導電顆粒21站立於厚度方向上。亦即,當製造測試插座10時,會以其中分佈有導電顆粒21的液體矽酮橡膠來填充模具,且在一個方向上施加磁場以將導電顆粒21線性地排列於與導電部20對應的位置。對於此製程,將本體22的大小確定成使得導電顆粒21可站立於一個方向上是重要的。為此,本體22可具有在一個方向上延伸的長柱形狀。 The shape and size of the body 22 are determined such that the conductive particles 21 can stand in the thickness direction by aligning the body 22 in the elastic insulating material with a magnetic field. That is, when the test socket 10 is manufactured, the mold is filled with the liquid fluorenone rubber in which the conductive particles 21 are distributed, and a magnetic field is applied in one direction to linearly arrange the conductive particles 21 at positions corresponding to the conductive portion 20. . For this process, it is important to determine the size of the body 22 such that the conductive particles 21 can stand in one direction. To this end, the body 22 may have a long column shape extending in one direction.
具體而言,本體22中的每一者可具有大於1的h/w比率,其中h是指自本體22的上端部至下端部的垂直長度,且w是指與所述垂直長度垂直的本體22的水平長度。當h/w比率大於1時,本體22的垂直長度大於本體22的水平長度,且因此本體22可輕易地站立於與厚度方向平行的方向上。因此,當導電顆粒21在厚度方向上對齊時,自相鄰本體22延伸的突出部23可輕易地耦合 至彼此。然而,若如圖11中所示h/w比率小於1,則導電顆粒21可能不同地定向,且因此,突出部23可能無法輕易地耦合至彼此。 In particular, each of the bodies 22 can have a h/w ratio greater than one, where h refers to the vertical length from the upper end to the lower end of the body 22, and w refers to the body that is perpendicular to the vertical length The horizontal length of 22. When the h/w ratio is greater than 1, the vertical length of the body 22 is greater than the horizontal length of the body 22, and thus the body 22 can easily stand in a direction parallel to the thickness direction. Therefore, when the conductive particles 21 are aligned in the thickness direction, the protrusions 23 extending from the adjacent body 22 can be easily coupled To each other. However, if the h/w ratio is less than 1 as shown in FIG. 11, the conductive particles 21 may be oriented differently, and thus, the protrusions 23 may not be easily coupled to each other.
另外,本體22可具有大於1的w/d比率,其中d是指本體22的厚度。亦即,本體22可具有矩形水平橫截面而非正方形水平橫截面。當本體22具有大於1的w/d比率時,導電顆粒21可在特定方向上定向。亦即,導電顆粒21可不旋轉至隨機的角度但可在相對於本體22的中心軸線而言的特定方向上定向(與本體22的垂直長度平行地穿過本體22的中心),且因此上部導電顆粒與下部導電顆粒21的突出部23可輕易地耦合至彼此。然而,若如圖12(a)、圖12(b)中所示w/d比率小於1,則導電顆粒21可旋轉至不同的角度,且因此,導電顆粒21的突出部23可能無法輕易地耦合至彼此。w/d比率可較佳地大於1,更佳地為2或大於2,且甚至更佳地為5或大於5。 Additionally, body 22 can have a w/d ratio greater than one, where d refers to the thickness of body 22. That is, the body 22 can have a rectangular horizontal cross section rather than a square horizontal cross section. When the body 22 has a w/d ratio greater than 1, the conductive particles 21 may be oriented in a particular direction. That is, the conductive particles 21 may not be rotated to a random angle but may be oriented in a particular direction relative to the central axis of the body 22 (through the center of the body 22 in parallel with the vertical length of the body 22), and thus the upper conductive The protrusions 23 of the particles and the lower conductive particles 21 can be easily coupled to each other. However, if the w/d ratio is less than 1 as shown in FIGS. 12(a) and 12(b), the conductive particles 21 may be rotated to different angles, and therefore, the protruding portion 23 of the conductive particles 21 may not be easily Coupled to each other. The w/d ratio may preferably be greater than 1, more preferably 2 or greater than 2, and even more preferably 5 or greater than 5.
若如上所述確定本體22的大小,則導電顆粒21的突出部23可當導電顆粒21彼此對齊時輕易地耦合至彼此。 If the size of the body 22 is determined as described above, the protrusions 23 of the conductive particles 21 can be easily coupled to each other when the conductive particles 21 are aligned with each other.
另外,本體22的上端部與下端部之間形成有用於連接上端部表面與下端部表面的側向表面221,且側向表面221中的每一者自所述上端部及下端部朝本體22的中心部朝內凹陷。亦即,彈性絕緣材料可甚至填充於側向表面221的凹的中心部中,且因此可使導電顆粒21與導電部20的分離最小化。 In addition, a lateral surface 221 for connecting the upper end surface and the lower end surface is formed between the upper end portion and the lower end portion of the body 22, and each of the lateral surfaces 221 is from the upper end portion and the lower end portion toward the body 22 The center of the center is recessed toward the inside. That is, the elastic insulating material may even be filled in the concave central portion of the lateral surface 221, and thus the separation of the conductive particles 21 from the conductive portion 20 may be minimized.
至少兩個突出部23可自本體22中的每一者的上端部突出。另外,自本體22的下端部突出的突出部23可具有與自本體 22的上端部突出的突出部23的形狀或形式對應的形狀或形式。相鄰的突出部23之間形成有朝本體22凹陷的凹陷部232。較佳地,在相鄰突出部23之間形成的凹陷部232的內表面231之間的角度θ可為銳角(即,小於90°)。內表面231之間的角度θ可具有小於90°的任意值。較佳地,角度θ可介於30°至85°範圍內,且更佳地介於40°至70°範圍內。 At least two protrusions 23 may protrude from the upper end of each of the bodies 22. In addition, the protruding portion 23 protruding from the lower end portion of the body 22 may have a self-body The shape or form of the protruding portion 23 of the upper end portion of the 22 corresponds to a shape or form. A recess 232 recessed toward the body 22 is formed between the adjacent protrusions 23. Preferably, the angle θ between the inner surfaces 231 of the recesses 232 formed between adjacent protrusions 23 may be an acute angle (ie, less than 90°). The angle θ between the inner surfaces 231 may have any value less than 90°. Preferably, the angle θ may range from 30° to 85°, and more preferably from 40° to 70°.
突出部23的長度及凹陷部232的形狀可被確定成使得在導電顆粒21的突出部23插入相鄰凹陷部232中之後,突出部23與凹陷部232之間可形成至少兩個接觸點。詳言之,較佳地,當相鄰導電顆粒21耦合至彼此時,相鄰導電顆粒21的突出部23的端部可沿內表面231彼此接觸。當具有突出部23的導電顆粒21排列於導電部20中時,如圖7中所示導電顆粒21可與耦合至彼此的突出部23垂直地對齊。 The length of the protrusion 23 and the shape of the recess 232 may be determined such that after the protrusion 23 of the conductive particle 21 is inserted into the adjacent recess 232, at least two contact points may be formed between the protrusion 23 and the recess 232. In detail, preferably, when the adjacent conductive particles 21 are coupled to each other, the ends of the protrusions 23 of the adjacent conductive particles 21 may contact each other along the inner surface 231. When the conductive particles 21 having the protrusions 23 are arranged in the conductive portion 20, the conductive particles 21 may be vertically aligned with the protrusions 23 coupled to each other as shown in FIG.
舉例而言,當製造測試插座10時,兩個導電顆粒21中靠上的一個導電顆粒的突出部23,可在磁場的效應下自然地插入在所述兩個導電顆粒21中靠下的一個導電顆粒的突出部23之間形成的凹陷部232中。在此製程中,當測試目標裝置130的端子131按壓導電部20的上側時,在導電顆粒21中相對靠上的導電顆粒21如圖8中所示旋轉至某些角度的同時導電顆粒21之間的耦合得到維持。亦即,導電顆粒21的相鄰突出部23的相互面對的表面被稱作內表面231,且當相鄰導電顆粒21彼此耦合成使得導電顆粒21的突出部23的端部沿相鄰突出部23的內表面231接觸 另一導電顆粒21的突出部23的端部時,會保證在相鄰導電顆粒21之間得到令人滿意的電性連接。突出部23的內表面231之間的角度θ是銳角,且突出部23深深地插入凹陷部232中,藉此保證在突出部23之間得到高的耦合強度。 For example, when the test socket 10 is manufactured, the protruding portion 23 of one of the two conductive particles 21 can be naturally inserted under the effect of the magnetic field in the lower one of the two conductive particles 21 The recessed portion 232 is formed between the protruding portions 23 of the conductive particles. In this process, when the terminal 131 of the test target device 130 presses the upper side of the conductive portion 20, the relatively upper conductive particles 21 in the conductive particles 21 are rotated to some angles as shown in FIG. 8 while the conductive particles 21 are The coupling between them is maintained. That is, the mutually facing surfaces of the adjacent protrusions 23 of the conductive particles 21 are referred to as an inner surface 231, and when the adjacent conductive particles 21 are coupled to each other such that the ends of the protrusions 23 of the conductive particles 21 protrude adjacently Contact of inner surface 231 of portion 23 At the end of the protruding portion 23 of the other conductive particle 21, a satisfactory electrical connection between the adjacent conductive particles 21 is ensured. The angle θ between the inner surfaces 231 of the projections 23 is an acute angle, and the projections 23 are deeply inserted into the recesses 232, thereby ensuring a high coupling strength between the projections 23.
導電顆粒21的相鄰突出部23的相互面對的內表面231,被斜置成使得相互面對的內表面231之間的距離可在朝本體22的方向上減小,且因此當導電部20隨著來自測試目標裝置130的按壓力被釋放而返回至其原始狀態時,導電顆粒21可在內表面231上旋轉且返回至圖7中所示狀態。 The mutually facing inner surfaces 231 of the adjacent protrusions 23 of the conductive particles 21 are inclined such that the distance between the mutually facing inner surfaces 231 can be reduced in the direction toward the body 22, and thus when the conductive portion 20 When the pressing force from the test target device 130 is released and returned to its original state, the conductive particles 21 can be rotated on the inner surface 231 and returned to the state shown in FIG.
除導電顆粒21的形狀以外,現亦將闡述可用於形成導電顆粒21的材料。 In addition to the shape of the conductive particles 21, materials which can be used to form the conductive particles 21 will also be explained.
導電顆粒21可由磁性材料形成,以輕易地在垂直方向上沿磁力線排列導電顆粒21。舉例而言,導電顆粒21可為以下顆粒:磁性金屬的顆粒,所述磁性金屬例如為鎳、鐵、或鈷;所述磁性金屬的合金的顆粒;含有此種磁性金屬的顆粒;或者包括此種顆粒作為核心顆粒且被鍍覆以例如金、銀、鈀、或銠等難以氧化的導電金屬的顆粒。 The conductive particles 21 may be formed of a magnetic material to easily align the conductive particles 21 along the magnetic lines of force in the vertical direction. For example, the conductive particles 21 may be particles of a magnetic metal such as nickel, iron, or cobalt; particles of an alloy of the magnetic metal; particles containing such a magnetic metal; or The particles are used as core particles and are plated with particles of a conductive metal such as gold, silver, palladium, or rhodium which are difficult to oxidize.
然而,導電顆粒21並不總是需要包括磁性核心顆粒。舉例而言,導電顆粒21可包括:由例如非磁性金屬、玻璃、或碳等無機材料形成的核心顆粒;由例如聚苯乙烯或與二乙烯基苯交聯的聚苯乙烯等聚合物形成的核心顆粒;或者藉由將彈性纖維長絲或玻璃纖維長絲打碎成具有等於或小於某一值的長度的顆粒而形 成的核心顆粒,其中所述核心顆粒可被鍍覆以例如鎳、鈷、或鎳鈷合金等導電磁性物質,或者可被塗佈以導電磁性物質及難以氧化的導電金屬。 However, the conductive particles 21 are not always required to include magnetic core particles. For example, the conductive particles 21 may include: core particles formed of an inorganic material such as non-magnetic metal, glass, or carbon; formed of a polymer such as polystyrene or polystyrene crosslinked with divinylbenzene. Core particles; or by breaking elastic filaments or glass filaments into particles having a length equal to or less than a certain value The core particles are formed, wherein the core particles may be plated with a conductive magnetic substance such as nickel, cobalt, or nickel-cobalt alloy, or may be coated with a conductive magnetic substance and a conductive metal that is difficult to oxidize.
絕緣支撐體30使導電部20彼此絕緣且支撐導電部20。較佳地,絕緣支撐體30可由與用於形成導電部20的彈性絕緣材料相同的矽酮橡膠形成。然而,絕緣支撐體30並非僅限於此。亦即,絕緣支撐體30可由不同於用於形成彈性絕緣材料的絕緣材料形成。 The insulating support 30 insulates the conductive portions 20 from each other and supports the conductive portion 20. Preferably, the insulating support 30 may be formed of the same fluorenone rubber as the elastic insulating material for forming the conductive portion 20. However, the insulating support 30 is not limited to this. That is, the insulating support 30 may be formed of an insulating material different from that used to form the elastic insulating material.
根據本發明的實施例,可如下製造測試插座10。 According to an embodiment of the invention, the test socket 10 can be fabricated as follows.
首先,製備成形材料(forming material)(即,其中分佈有導電顆粒21的可流動彈性材料),且以所述成形材料填充模具(圖中未示出)。此後,在垂直方向上向成形材料施加磁場以將導電顆粒21在垂直方向上排列成與磁力線平行。接著,將成形材料固化,藉此完成對測試插座10的製造。 First, a forming material (i.e., a flowable elastic material in which the conductive particles 21 are distributed) is prepared, and a mold (not shown) is filled with the forming material. Thereafter, a magnetic field is applied to the forming material in the vertical direction to align the conductive particles 21 in the vertical direction in parallel with the magnetic lines of force. Next, the forming material is cured, thereby completing the manufacture of the test socket 10.
可如下使用根據本發明的較佳實施例的測試插座10來測試測試目標裝置130。 The test target device 130 can be tested using the test socket 10 in accordance with a preferred embodiment of the present invention as follows.
首先,將測試插座10放置於測試設備140上方。詳言之,將測試插座10放置成使得導電部20的下端部接觸測試設備140的接墊141。此後,將測試目標裝置130向下移動以使測試目標裝置130的端子131接觸導電部20。此時,若進一步將測試目標裝置130降低,則測試目標裝置130開始按壓導電部20,且導電部20的導電顆粒21的端部彼此接觸且因此而電性連接至彼此。此 時,若測試設備140產生預定電性訊號,則經由測試插座10將所述電性訊號傳輸至測試目標裝置130。 First, the test socket 10 is placed over the test equipment 140. In detail, the test socket 10 is placed such that the lower end portion of the conductive portion 20 contacts the pad 141 of the test apparatus 140. Thereafter, the test target device 130 is moved downward to bring the terminal 131 of the test target device 130 into contact with the conductive portion 20. At this time, if the test target device 130 is further lowered, the test target device 130 starts pressing the conductive portion 20, and the ends of the conductive particles 21 of the conductive portion 20 are in contact with each other and thus electrically connected to each other. this When the test device 140 generates a predetermined electrical signal, the electrical signal is transmitted to the test target device 130 via the test socket 10.
根據本發明的較佳實施例,測試插座10具有以下效果。 According to a preferred embodiment of the present invention, the test socket 10 has the following effects.
首先,由於本體22具有h/w比率大於1的柱形狀,因此在製造測試插座10時可輕易地使導電顆粒21垂直地對齊。 First, since the body 22 has a column shape in which the h/w ratio is larger than 1, the conductive particles 21 can be easily aligned vertically when the test socket 10 is manufactured.
另外,由於突出部23設置於垂直地對齊的本體22的上端部及下端部上,因此導電顆粒21可在導電部20中輕易地耦合至彼此。此耦合結構使得即便當導電部20被測試目標裝置130壓縮時,導電顆粒21之間仍可維持接觸,且因此,導電顆粒21的導電性可得到維持。 In addition, since the protruding portions 23 are provided on the upper end portion and the lower end portion of the vertically aligned body 22, the conductive particles 21 can be easily coupled to each other in the conductive portion 20. This coupling structure enables contact between the conductive particles 21 to be maintained even when the conductive portion 20 is compressed by the test target device 130, and therefore, the conductivity of the conductive particles 21 can be maintained.
另外,由於本體22在其中心區處是凹的,因此本體22與彈性絕緣材料之間的接觸面積增大,且因此本體22可不輕易地與導電部20分離。 In addition, since the body 22 is concave at its central portion, the contact area between the body 22 and the elastic insulating material is increased, and thus the body 22 may not be easily separated from the conductive portion 20.
另外,由於導電顆粒21的本體22的厚度(d)小於本體22的寬度(w),因此導電顆粒21可輕易地在垂直方向上對齊,且因此導電顆粒21可輕易地耦合至彼此。 In addition, since the thickness (d) of the body 22 of the conductive particles 21 is smaller than the width (w) of the body 22, the conductive particles 21 can be easily aligned in the vertical direction, and thus the conductive particles 21 can be easily coupled to each other.
另外,由於相鄰突出部23的相互面對的內表面231之間的角度是銳角(即,小於90°),因此突出部23可深深地插入凹陷部232中,且因此導電顆粒21之間的耦合力可為高的。 In addition, since the angle between the mutually facing inner surfaces 231 of the adjacent protrusions 23 is an acute angle (ie, less than 90°), the protrusions 23 can be deeply inserted into the recesses 232, and thus the conductive particles 21 The coupling force between them can be high.
另外,由於突出部23插入在突出部23之間形成的凹陷部232中,因此在使用測試插座10之後,相鄰導電顆粒21之間的接觸可在至少兩個點處得到維持。 In addition, since the protruding portion 23 is inserted in the depressed portion 232 formed between the protruding portions 23, the contact between the adjacent conductive particles 21 can be maintained at at least two points after the test socket 10 is used.
可如下所述修改根據本發明較佳實施例的測試插座10。 The test socket 10 in accordance with a preferred embodiment of the present invention can be modified as described below.
在以上所述實施例中,側向表面221是線性傾斜的。然而,如圖9中所示,導電顆粒21'的側向表面上可設置有在垂直方向上具有恆定寬度的凹凸部222。 In the embodiment described above, the lateral surface 221 is linearly inclined. However, as shown in FIG. 9, the lateral surface of the conductive particles 21' may be provided with the uneven portion 222 having a constant width in the vertical direction.
另外,如圖10中所示,導電顆粒21"的凹的中心區的側向表面上可設置有凹凸部223。若如上所述側向表面上設置有多個凹凸部,則可在凹凸部之間填充彈性絕緣材料,且因此可可靠地防止導電顆粒的分離。 In addition, as shown in FIG. 10, the lateral surface of the concave central portion of the conductive particles 21" may be provided with the uneven portion 223. If a plurality of concave and convex portions are provided on the lateral surface as described above, the concave and convex portions may be provided The elastic insulating material is filled between, and thus the separation of the conductive particles can be reliably prevented.
在上述實施例中,相鄰突出部23的相互面對的內表面231之間的角度小於90°。然而,此是非限制性實例。亦即,相鄰突出部23的相互面對的內表面231之間的角度可為90°或小於90°。 In the above embodiment, the angle between the mutually facing inner surfaces 231 of the adjacent projections 23 is less than 90°. However, this is a non-limiting example. That is, the angle between the mutually facing inner surfaces 231 of the adjacent protrusions 23 may be 90° or less.
儘管以上已示出及闡述了本發明的較佳實施例,然而本發明並非僅限於本發明的實施例或經修改實例,且可在不背離本發明的範圍的條件下作出各種其他潤飾及變動。 While the preferred embodiments of the present invention have been shown and described, the invention is not limited to the embodiments of the invention or the modified examples, and various other modifications and changes can be made without departing from the scope of the invention. .
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KR102204910B1 (en) * | 2019-11-26 | 2021-01-19 | 김규선 | Test socket |
KR102195339B1 (en) * | 2019-11-26 | 2020-12-24 | 김규선 | Conductive particle |
WO2021107484A1 (en) * | 2019-11-26 | 2021-06-03 | 주식회사 스노우 | Conductive particles and test socket having same |
KR102179457B1 (en) * | 2020-03-25 | 2020-11-16 | (주)티에스이 | Test socket and test apparatus having the same, manufacturing method for the test socket |
KR102474337B1 (en) | 2020-08-28 | 2022-12-07 | 주식회사 아이에스시 | Connector for electrical connection |
KR20240012895A (en) * | 2022-07-21 | 2024-01-30 | 주식회사 아이에스시 | Test connector |
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KR101057608B1 (en) * | 2003-02-05 | 2011-08-18 | 고조 후지모토 | How to connect between terminals and mounting method of semiconductor device |
KR100707727B1 (en) * | 2004-07-15 | 2007-04-16 | 주식회사 현원 | A portable file player |
KR101348204B1 (en) * | 2012-12-28 | 2014-01-10 | 주식회사 아이에스시 | Test socket and socket member |
KR101525520B1 (en) * | 2015-02-03 | 2015-06-03 | (주)티에스이 | Testing socket including conductive particles having combinable shape |
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2016
- 2016-05-11 KR KR1020160057821A patent/KR101805834B1/en active IP Right Grant
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2017
- 2017-05-11 CN CN201780015074.4A patent/CN108780116B/en active Active
- 2017-05-11 TW TW106115628A patent/TWI653454B/en active
- 2017-05-11 WO PCT/KR2017/004870 patent/WO2017196092A1/en active Application Filing
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JP2004260131A (en) | 2003-02-05 | 2004-09-16 | Japan Science & Technology Agency | Connection method between terminals, and packaging method of semiconductor device |
CN1808125A (en) | 2004-12-06 | 2006-07-26 | 三星电子株式会社 | Connector for testing a semiconductor package |
US20110272803A1 (en) | 2007-12-27 | 2011-11-10 | Isc Technology Co., Ltd. | Silicon contactor including plate type powders for testing semiconductor device |
TW201403073A (en) | 2012-06-18 | 2014-01-16 | Jae-Hak Lee | Test socket with conductive powder having through-hole and fabrication method thereof |
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TWI787868B (en) * | 2020-08-21 | 2022-12-21 | 韓商斯諾有限公司 | Conductive particle and testing socket comprising the same |
US11693027B2 (en) | 2020-08-21 | 2023-07-04 | Snow Co., Ltd. | Conductive particle and testing socket comprising the same |
Also Published As
Publication number | Publication date |
---|---|
WO2017196092A1 (en) | 2017-11-16 |
CN108780116A (en) | 2018-11-09 |
CN108780116B (en) | 2021-01-05 |
TW201802476A (en) | 2018-01-16 |
KR20170127319A (en) | 2017-11-21 |
KR101805834B1 (en) | 2017-12-07 |
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