TWI643019B - 模具、壓印方法、壓印設備、及製造半導體物件的方法 - Google Patents

模具、壓印方法、壓印設備、及製造半導體物件的方法 Download PDF

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Publication number
TWI643019B
TWI643019B TW106119300A TW106119300A TWI643019B TW I643019 B TWI643019 B TW I643019B TW 106119300 A TW106119300 A TW 106119300A TW 106119300 A TW106119300 A TW 106119300A TW I643019 B TWI643019 B TW I643019B
Authority
TW
Taiwan
Prior art keywords
light
mold
pattern
light shielding
curing
Prior art date
Application number
TW106119300A
Other languages
English (en)
Chinese (zh)
Other versions
TW201802578A (zh
Inventor
篠田健一郎
Original Assignee
日商佳能股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商佳能股份有限公司 filed Critical 日商佳能股份有限公司
Publication of TW201802578A publication Critical patent/TW201802578A/zh
Application granted granted Critical
Publication of TWI643019B publication Critical patent/TWI643019B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
TW106119300A 2016-06-30 2017-06-09 模具、壓印方法、壓印設備、及製造半導體物件的方法 TWI643019B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-130918 2016-06-30
JP2016130918A JP6748496B2 (ja) 2016-06-30 2016-06-30 モールド、インプリント方法、インプリント装置および物品製造方法

Publications (2)

Publication Number Publication Date
TW201802578A TW201802578A (zh) 2018-01-16
TWI643019B true TWI643019B (zh) 2018-12-01

Family

ID=60806962

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106119300A TWI643019B (zh) 2016-06-30 2017-06-09 模具、壓印方法、壓印設備、及製造半導體物件的方法

Country Status (6)

Country Link
US (1) US20180004091A1 (enExample)
JP (1) JP6748496B2 (enExample)
KR (1) KR102280003B1 (enExample)
CN (1) CN107561855A (enExample)
SG (1) SG10201704389PA (enExample)
TW (1) TWI643019B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6815894B2 (ja) * 2017-02-27 2021-01-20 株式会社ディスコ 静電チャックテーブルの使用方法
CN108445711A (zh) * 2018-03-13 2018-08-24 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示装置
US11281095B2 (en) 2018-12-05 2022-03-22 Canon Kabushiki Kaisha Frame curing template and system and method of using the frame curing template
JP2021027107A (ja) 2019-08-01 2021-02-22 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP7374666B2 (ja) * 2019-08-29 2023-11-07 キヤノン株式会社 インプリント方法、前処理装置、インプリント用基板、および基板の製造方法
JP7346268B2 (ja) * 2019-12-05 2023-09-19 キヤノン株式会社 インプリント用のテンプレート、テンプレートを用いたインプリント方法
JP7465146B2 (ja) * 2020-05-12 2024-04-10 キヤノン株式会社 インプリント方法、インプリント装置、判定方法及び物品の製造方法
CN117761966A (zh) * 2020-07-01 2024-03-26 吉佳蓝科技股份有限公司 纳米压印用复制模制作装置
US11747731B2 (en) 2020-11-20 2023-09-05 Canon Kabishiki Kaisha Curing a shaped film using multiple images of a spatial light modulator
JP7710313B2 (ja) 2021-05-27 2025-07-18 キヤノン株式会社 モールド、インプリント装置、および物品の製造方法
TWI872651B (zh) * 2023-08-18 2025-02-11 光群雷射科技股份有限公司 組版式壓印設備

Citations (3)

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TW201436976A (zh) * 2013-01-24 2014-10-01 Soken Kagaku Kk 透光型壓印用模具、大面積模具的製造方法
CN104160477A (zh) * 2012-03-12 2014-11-19 佳能株式会社 压印方法、压印装置、以及使用其的物品制造方法
JP2015130384A (ja) * 2014-01-06 2015-07-16 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法

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JP3410089B2 (ja) * 1991-11-13 2003-05-26 株式会社東芝 露光用マスクの製造方法及び露光方法
US9573319B2 (en) * 2007-02-06 2017-02-21 Canon Kabushiki Kaisha Imprinting method and process for producing a member in which a mold contacts a pattern forming layer
JP5182470B2 (ja) * 2007-07-17 2013-04-17 大日本印刷株式会社 インプリントモールド
JP4799575B2 (ja) * 2008-03-06 2011-10-26 株式会社東芝 インプリント方法
JP5257225B2 (ja) * 2009-04-28 2013-08-07 大日本印刷株式会社 ナノインプリント用モールドおよびその製造方法
JP5531702B2 (ja) * 2010-03-23 2014-06-25 旭硝子株式会社 遮光膜付ガラス基板および液晶表示装置
JP6368075B2 (ja) * 2013-06-26 2018-08-01 キヤノン株式会社 モールド
JP5909210B2 (ja) * 2013-07-11 2016-04-26 キヤノン株式会社 インプリント装置及び物品の製造方法
JP2015144193A (ja) * 2014-01-31 2015-08-06 株式会社東芝 インプリント方法、テンプレートおよびインプリント装置
TWI662591B (zh) * 2014-07-08 2019-06-11 日商綜研化學股份有限公司 使用分步重複用壓印用模具的分步重複壓印方法、及分步重複用壓印用模具之製造方法
JP5900589B2 (ja) * 2014-12-12 2016-04-06 大日本印刷株式会社 インプリント用モールド、アライメント方法、インプリント方法、およびインプリント装置
JP2016028442A (ja) * 2015-10-08 2016-02-25 大日本印刷株式会社 テンプレート

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104160477A (zh) * 2012-03-12 2014-11-19 佳能株式会社 压印方法、压印装置、以及使用其的物品制造方法
TW201436976A (zh) * 2013-01-24 2014-10-01 Soken Kagaku Kk 透光型壓印用模具、大面積模具的製造方法
JP2015130384A (ja) * 2014-01-06 2015-07-16 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法

Also Published As

Publication number Publication date
JP6748496B2 (ja) 2020-09-02
JP2018006553A (ja) 2018-01-11
SG10201704389PA (en) 2018-01-30
CN107561855A (zh) 2018-01-09
KR102280003B1 (ko) 2021-07-21
KR20180003437A (ko) 2018-01-09
US20180004091A1 (en) 2018-01-04
TW201802578A (zh) 2018-01-16

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