KR102280003B1 - 몰드, 임프린트 방법, 임프린트 장치 및 반도체 물품 제조 방법 - Google Patents

몰드, 임프린트 방법, 임프린트 장치 및 반도체 물품 제조 방법 Download PDF

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KR102280003B1
KR102280003B1 KR1020170078955A KR20170078955A KR102280003B1 KR 102280003 B1 KR102280003 B1 KR 102280003B1 KR 1020170078955 A KR1020170078955 A KR 1020170078955A KR 20170078955 A KR20170078955 A KR 20170078955A KR 102280003 B1 KR102280003 B1 KR 102280003B1
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South Korea
Prior art keywords
mold
light
imprint
curing
substrate
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Expired - Fee Related
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KR1020170078955A
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English (en)
Korean (ko)
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KR20180003437A (ko
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겐이치로 시노다
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR1020170078955A 2016-06-30 2017-06-22 몰드, 임프린트 방법, 임프린트 장치 및 반도체 물품 제조 방법 Expired - Fee Related KR102280003B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-130918 2016-06-30
JP2016130918A JP6748496B2 (ja) 2016-06-30 2016-06-30 モールド、インプリント方法、インプリント装置および物品製造方法

Publications (2)

Publication Number Publication Date
KR20180003437A KR20180003437A (ko) 2018-01-09
KR102280003B1 true KR102280003B1 (ko) 2021-07-21

Family

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KR1020170078955A Expired - Fee Related KR102280003B1 (ko) 2016-06-30 2017-06-22 몰드, 임프린트 방법, 임프린트 장치 및 반도체 물품 제조 방법

Country Status (6)

Country Link
US (1) US20180004091A1 (enExample)
JP (1) JP6748496B2 (enExample)
KR (1) KR102280003B1 (enExample)
CN (1) CN107561855A (enExample)
SG (1) SG10201704389PA (enExample)
TW (1) TWI643019B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6815894B2 (ja) * 2017-02-27 2021-01-20 株式会社ディスコ 静電チャックテーブルの使用方法
CN108445711A (zh) * 2018-03-13 2018-08-24 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示装置
US11281095B2 (en) 2018-12-05 2022-03-22 Canon Kabushiki Kaisha Frame curing template and system and method of using the frame curing template
JP2021027107A (ja) 2019-08-01 2021-02-22 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP7374666B2 (ja) * 2019-08-29 2023-11-07 キヤノン株式会社 インプリント方法、前処理装置、インプリント用基板、および基板の製造方法
JP7346268B2 (ja) * 2019-12-05 2023-09-19 キヤノン株式会社 インプリント用のテンプレート、テンプレートを用いたインプリント方法
JP7465146B2 (ja) * 2020-05-12 2024-04-10 キヤノン株式会社 インプリント方法、インプリント装置、判定方法及び物品の製造方法
CN117761966A (zh) * 2020-07-01 2024-03-26 吉佳蓝科技股份有限公司 纳米压印用复制模制作装置
US11747731B2 (en) 2020-11-20 2023-09-05 Canon Kabishiki Kaisha Curing a shaped film using multiple images of a spatial light modulator
JP7710313B2 (ja) 2021-05-27 2025-07-18 キヤノン株式会社 モールド、インプリント装置、および物品の製造方法
TWI872651B (zh) * 2023-08-18 2025-02-11 光群雷射科技股份有限公司 組版式壓印設備

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009023113A (ja) 2007-07-17 2009-02-05 Dainippon Printing Co Ltd インプリントモールド
JP2010258326A (ja) * 2009-04-28 2010-11-11 Dainippon Printing Co Ltd ナノインプリント用モールドおよびその製造方法
US20110236604A1 (en) 2010-03-23 2011-09-29 Asahi Glass Company, Limited Light-shielding film-attached glass substrate and liquid crystal display device
US20150004275A1 (en) 2013-06-26 2015-01-01 Canon Kabushiki Kaisha Mold
JP2015144193A (ja) * 2014-01-31 2015-08-06 株式会社東芝 インプリント方法、テンプレートおよびインプリント装置
JP2016028442A (ja) 2015-10-08 2016-02-25 大日本印刷株式会社 テンプレート

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3410089B2 (ja) * 1991-11-13 2003-05-26 株式会社東芝 露光用マスクの製造方法及び露光方法
US9573319B2 (en) * 2007-02-06 2017-02-21 Canon Kabushiki Kaisha Imprinting method and process for producing a member in which a mold contacts a pattern forming layer
JP4799575B2 (ja) * 2008-03-06 2011-10-26 株式会社東芝 インプリント方法
JP6029494B2 (ja) * 2012-03-12 2016-11-24 キヤノン株式会社 インプリント方法およびインプリント装置、それを用いた物品の製造方法
KR20150112945A (ko) * 2013-01-24 2015-10-07 소켄 케미칼 앤드 엔지니어링 캄파니, 리미티드 광투과형 임프린트용 몰드, 대면적 몰드의 제조방법
JP5909210B2 (ja) * 2013-07-11 2016-04-26 キヤノン株式会社 インプリント装置及び物品の製造方法
JP6097704B2 (ja) * 2014-01-06 2017-03-15 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
TWI662591B (zh) * 2014-07-08 2019-06-11 日商綜研化學股份有限公司 使用分步重複用壓印用模具的分步重複壓印方法、及分步重複用壓印用模具之製造方法
JP5900589B2 (ja) * 2014-12-12 2016-04-06 大日本印刷株式会社 インプリント用モールド、アライメント方法、インプリント方法、およびインプリント装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009023113A (ja) 2007-07-17 2009-02-05 Dainippon Printing Co Ltd インプリントモールド
US20100189839A1 (en) 2007-07-17 2010-07-29 Dai Nippon Printing Co., Ltd. Imprint mold
JP2010258326A (ja) * 2009-04-28 2010-11-11 Dainippon Printing Co Ltd ナノインプリント用モールドおよびその製造方法
US20110236604A1 (en) 2010-03-23 2011-09-29 Asahi Glass Company, Limited Light-shielding film-attached glass substrate and liquid crystal display device
US20150004275A1 (en) 2013-06-26 2015-01-01 Canon Kabushiki Kaisha Mold
JP2015012034A (ja) * 2013-06-26 2015-01-19 キヤノン株式会社 モールド
JP2015144193A (ja) * 2014-01-31 2015-08-06 株式会社東芝 インプリント方法、テンプレートおよびインプリント装置
JP2016028442A (ja) 2015-10-08 2016-02-25 大日本印刷株式会社 テンプレート

Also Published As

Publication number Publication date
JP6748496B2 (ja) 2020-09-02
JP2018006553A (ja) 2018-01-11
SG10201704389PA (en) 2018-01-30
CN107561855A (zh) 2018-01-09
KR20180003437A (ko) 2018-01-09
US20180004091A1 (en) 2018-01-04
TWI643019B (zh) 2018-12-01
TW201802578A (zh) 2018-01-16

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