TWI641632B - Polyimine precursor, resin composition and method for producing resin film - Google Patents

Polyimine precursor, resin composition and method for producing resin film Download PDF

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Publication number
TWI641632B
TWI641632B TW105130650A TW105130650A TWI641632B TW I641632 B TWI641632 B TW I641632B TW 105130650 A TW105130650 A TW 105130650A TW 105130650 A TW105130650 A TW 105130650A TW I641632 B TWI641632 B TW I641632B
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TW
Taiwan
Prior art keywords
group
film
polyimine
precursor
carbon number
Prior art date
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TW105130650A
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English (en)
Chinese (zh)
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TW201718714A (zh
Inventor
米谷昌樹
清水建樹
金田隆行
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旭化成股份有限公司
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Publication of TW201718714A publication Critical patent/TW201718714A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Liquid Crystal (AREA)
TW105130650A 2015-09-24 2016-09-22 Polyimine precursor, resin composition and method for producing resin film TWI641632B (zh)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2015186730 2015-09-24
JP??2015-186730 2015-09-24
JP??2015-218783 2015-11-06
JP2015218783 2015-11-06
JP??2016-055476 2016-03-18
JP2016055476 2016-03-18
JP??2016-124849 2016-06-23
JP2016124849 2016-06-23

Publications (2)

Publication Number Publication Date
TW201718714A TW201718714A (zh) 2017-06-01
TWI641632B true TWI641632B (zh) 2018-11-21

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
TW107135584A TWI695855B (zh) 2015-09-24 2016-09-22 聚醯亞胺前驅體、樹脂組合物及樹脂膜之製造方法
TW105130650A TWI641632B (zh) 2015-09-24 2016-09-22 Polyimine precursor, resin composition and method for producing resin film

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW107135584A TWI695855B (zh) 2015-09-24 2016-09-22 聚醯亞胺前驅體、樹脂組合物及樹脂膜之製造方法

Country Status (5)

Country Link
JP (5) JP6444522B2 (ko)
KR (3) KR102460768B1 (ko)
CN (2) CN112940253A (ko)
TW (2) TWI695855B (ko)
WO (1) WO2017051827A1 (ko)

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KR102516144B1 (ko) * 2018-08-28 2023-03-29 주식회사 엘지화학 투명 필름 제조용 용매의 전처리 방법
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JP7365940B2 (ja) * 2020-03-05 2023-10-20 東京応化工業株式会社 ワニス組成物、及びポリイミド樹脂の製造方法
JPWO2021193568A1 (ko) 2020-03-27 2021-09-30
KR20230007329A (ko) 2020-04-16 2023-01-12 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 이미드-아미드산 공중합체 및 그의 제조방법, 바니시, 그리고 폴리이미드 필름
JPWO2021210641A1 (ko) * 2020-04-16 2021-10-21
JP7483480B2 (ja) * 2020-04-24 2024-05-15 旭化成株式会社 ポリイミド前駆体、ポリイミド樹脂組成物、並びにポリイミド樹脂フィルム及びその製造方法
JP2021175790A (ja) * 2020-04-24 2021-11-04 旭化成株式会社 ポリイミド前駆体及びそれを含む樹脂組成物、ポリイミド樹脂膜、樹脂フィルム及びその製造方法
CN111533909B (zh) * 2020-06-08 2023-04-25 武汉柔显科技股份有限公司 一种聚酰胺酰亚胺、聚酰胺酰亚胺薄膜及显示装置
CN112225897A (zh) * 2020-10-19 2021-01-15 深圳市道尔顿电子材料有限公司 含芳香酯结构的三氟甲基取代芳香二胺化合物及其制备方法
JPWO2022085620A1 (ko) * 2020-10-22 2022-04-28
CN112175186B (zh) * 2020-10-29 2022-12-20 深圳市道尔顿电子材料有限公司 聚酰亚胺材料及其制备方法、聚酰亚胺薄膜及其制备方法
JP7547515B2 (ja) 2021-02-03 2024-09-09 三井化学株式会社 光学材料の製造方法、光学材料用重合性組成物、及び光学材料
JP7174199B1 (ja) * 2021-04-02 2022-11-17 旭化成株式会社 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法
CN113292726B (zh) * 2021-04-10 2023-03-24 常州市尚科新材料有限公司 聚酰亚胺模塑粉及其制备方法和应用
CN117120514A (zh) 2021-04-16 2023-11-24 三菱瓦斯化学株式会社 酰亚胺-酰胺酸共聚物和其制造方法、清漆以及聚酰亚胺薄膜
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TW201718714A (zh) 2017-06-01
CN112940253A (zh) 2021-06-11
JP2019070811A (ja) 2019-05-09
KR102133559B1 (ko) 2020-07-13
KR20220147724A (ko) 2022-11-03
KR102659377B1 (ko) 2024-04-19
WO2017051827A1 (ja) 2017-03-30
KR102460768B1 (ko) 2022-10-28
JP7095024B2 (ja) 2022-07-04
KR20180048605A (ko) 2018-05-10
JP2022128480A (ja) 2022-09-01
JP6444522B2 (ja) 2018-12-26
CN108026273A (zh) 2018-05-11
JP6725626B2 (ja) 2020-07-22
JPWO2017051827A1 (ja) 2018-03-22
JP7383764B2 (ja) 2023-11-20
TWI695855B (zh) 2020-06-11
TW201902992A (zh) 2019-01-16
JP2024023254A (ja) 2024-02-21
JP2020172652A (ja) 2020-10-22
CN108026273B (zh) 2021-04-06
KR20200085383A (ko) 2020-07-14

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