TWI639540B - 容器收納裝置 - Google Patents
容器收納裝置 Download PDFInfo
- Publication number
- TWI639540B TWI639540B TW104131060A TW104131060A TWI639540B TW I639540 B TWI639540 B TW I639540B TW 104131060 A TW104131060 A TW 104131060A TW 104131060 A TW104131060 A TW 104131060A TW I639540 B TWI639540 B TW I639540B
- Authority
- TW
- Taiwan
- Prior art keywords
- container
- mounting table
- liquid
- moving member
- processing liquid
- Prior art date
Links
- 230000004308 accommodation Effects 0.000 title 1
- 239000007788 liquid Substances 0.000 claims abstract description 112
- 238000003860 storage Methods 0.000 claims abstract description 34
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 230000004044 response Effects 0.000 claims abstract description 5
- 230000007246 mechanism Effects 0.000 claims description 87
- 238000001514 detection method Methods 0.000 claims description 19
- 238000006073 displacement reaction Methods 0.000 claims description 16
- 230000008859 change Effects 0.000 claims description 7
- 235000014676 Phragmites communis Nutrition 0.000 description 13
- 239000000758 substrate Substances 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 244000273256 Phragmites communis Species 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 210000003437 trachea Anatomy 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-193581 | 2014-09-24 | ||
JP2014193581 | 2014-09-24 | ||
JP2015158322A JP6342368B2 (ja) | 2014-09-24 | 2015-08-10 | 容器収容装置 |
JP2015-158322 | 2015-08-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201632435A TW201632435A (zh) | 2016-09-16 |
TWI639540B true TWI639540B (zh) | 2018-11-01 |
Family
ID=55805865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104131060A TWI639540B (zh) | 2014-09-24 | 2015-09-21 | 容器收納裝置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6342368B2 (enrdf_load_stackoverflow) |
CN (1) | CN106716598B (enrdf_load_stackoverflow) |
TW (1) | TWI639540B (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI763944B (zh) * | 2017-11-01 | 2022-05-11 | 日商東京威力科創股份有限公司 | 處理液供給系統、處理液供給裝置及載具保管裝置 |
WO2020154325A1 (en) | 2019-01-22 | 2020-07-30 | Shanghai Yanfeng Jinqiao Automotive Trim Systems Co. Ltd. | Vehicle interior component |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05160016A (ja) * | 1991-12-04 | 1993-06-25 | Tokyo Electron Ltd | 処理装置 |
JPH11342360A (ja) * | 1998-06-02 | 1999-12-14 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
US20060174832A1 (en) * | 2005-02-10 | 2006-08-10 | Dainippon Screen Mfg., Co., Ltd. | Substrate processing apparatus |
JP2010171258A (ja) * | 2009-01-23 | 2010-08-05 | Sokudo Co Ltd | 基板処理装置及び基板処理方法 |
JP2013247276A (ja) * | 2012-05-28 | 2013-12-09 | Sokudo Co Ltd | 薬液供給方法と薬液供給装置と基板処理装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040082483A (ko) * | 2003-03-19 | 2004-09-30 | 삼성전자주식회사 | 포토레지스트 공급장치 |
KR20050088734A (ko) * | 2004-03-03 | 2005-09-07 | 삼성전자주식회사 | 포토레지스트 공급 장치 |
CN101364046A (zh) * | 2007-08-06 | 2009-02-11 | 力晶半导体股份有限公司 | 液体与液位的侦测预警系统及方法 |
-
2015
- 2015-08-10 JP JP2015158322A patent/JP6342368B2/ja active Active
- 2015-09-17 CN CN201580051716.7A patent/CN106716598B/zh active Active
- 2015-09-21 TW TW104131060A patent/TWI639540B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05160016A (ja) * | 1991-12-04 | 1993-06-25 | Tokyo Electron Ltd | 処理装置 |
JPH11342360A (ja) * | 1998-06-02 | 1999-12-14 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
US20060174832A1 (en) * | 2005-02-10 | 2006-08-10 | Dainippon Screen Mfg., Co., Ltd. | Substrate processing apparatus |
JP2010171258A (ja) * | 2009-01-23 | 2010-08-05 | Sokudo Co Ltd | 基板処理装置及び基板処理方法 |
JP2013247276A (ja) * | 2012-05-28 | 2013-12-09 | Sokudo Co Ltd | 薬液供給方法と薬液供給装置と基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2016066784A (ja) | 2016-04-28 |
JP6342368B2 (ja) | 2018-06-13 |
CN106716598B (zh) | 2020-08-14 |
TW201632435A (zh) | 2016-09-16 |
CN106716598A (zh) | 2017-05-24 |
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